ES382866A1 - Electroless plating solution and process - Google Patents

Electroless plating solution and process

Info

Publication number
ES382866A1
ES382866A1 ES382866A ES382866A ES382866A1 ES 382866 A1 ES382866 A1 ES 382866A1 ES 382866 A ES382866 A ES 382866A ES 382866 A ES382866 A ES 382866A ES 382866 A1 ES382866 A1 ES 382866A1
Authority
ES
Spain
Prior art keywords
plating
electroless plating
solution
article
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES382866A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Crown City Plating Co
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Publication of ES382866A1 publication Critical patent/ES382866A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Abstract

A process and solution for electroless plating of articles with a highly-stabilized electroless plating solution while maintaining high plating rates. An article having a catalytic noble metal on its surface is first electrolessly plated with a thin coating of metal plating, and is further electrolessly plated in a solution having an inhibitor concentration which prevents plating on an article having the catalytic noble metal on its surface but does not prevent plating on an article having the thin coating of plating metal.
ES382866A 1969-08-20 1970-08-19 Electroless plating solution and process Expired ES382866A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00851762A US3853590A (en) 1969-08-20 1969-08-20 Electroless plating solution and process

Publications (1)

Publication Number Publication Date
ES382866A1 true ES382866A1 (en) 1972-12-16

Family

ID=25311618

Family Applications (1)

Application Number Title Priority Date Filing Date
ES382866A Expired ES382866A1 (en) 1969-08-20 1970-08-19 Electroless plating solution and process

Country Status (7)

Country Link
US (1) US3853590A (en)
JP (1) JPS526694B1 (en)
DE (1) DE2040930C3 (en)
ES (1) ES382866A1 (en)
FR (1) FR2058989A5 (en)
GB (1) GB1307927A (en)
SE (1) SE353743B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3985851A (en) * 1974-06-24 1976-10-12 General Dynamics Corporation Method of forming a feed horn
US4063004A (en) * 1975-12-30 1977-12-13 Hooker Chemicals & Plastics Corporation Metal plating of plastics
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4419390A (en) * 1977-06-06 1983-12-06 Nathan Feldstein Method for rendering non-platable semiconductor substrates platable
US4181760A (en) * 1977-06-06 1980-01-01 Surface Technology, Inc. Method for rendering non-platable surfaces platable
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4228201A (en) * 1977-06-06 1980-10-14 Nathan Feldstein Method for rendering a non-platable semiconductor substrate platable
DE3012006A1 (en) * 1980-03-28 1981-10-08 Merck Patent Gmbh, 6100 Darmstadt METHOD FOR DEFLECTIVE METAL DEPOSITION
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4552787A (en) * 1984-02-29 1985-11-12 International Business Machines Corporation Deposition of a metal from an electroless plating composition
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US5361914A (en) * 1993-10-05 1994-11-08 Digital Equipment Corporation Device for component processing
US5903344A (en) * 1996-03-04 1999-05-11 Reedy Scientific Instruments Matrix isolation apparatus for spectroscopic analysis of chemical compounds
EP1862042B1 (en) * 2005-02-08 2013-04-10 FUJIFILM Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials

Also Published As

Publication number Publication date
FR2058989A5 (en) 1971-05-28
GB1307927A (en) 1973-02-21
DE2040930B2 (en) 1978-05-11
JPS526694B1 (en) 1977-02-24
US3853590A (en) 1974-12-10
SE353743B (en) 1973-02-12
DE2040930C3 (en) 1981-08-13
DE2040930A1 (en) 1971-03-04

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