FR2058989A5 - - Google Patents

Info

Publication number
FR2058989A5
FR2058989A5 FR7030463A FR7030463A FR2058989A5 FR 2058989 A5 FR2058989 A5 FR 2058989A5 FR 7030463 A FR7030463 A FR 7030463A FR 7030463 A FR7030463 A FR 7030463A FR 2058989 A5 FR2058989 A5 FR 2058989A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7030463A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Crown City Plating Co
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Application granted granted Critical
Publication of FR2058989A5 publication Critical patent/FR2058989A5/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR7030463A 1969-08-20 1970-08-19 Expired FR2058989A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00851762A US3853590A (en) 1969-08-20 1969-08-20 Electroless plating solution and process

Publications (1)

Publication Number Publication Date
FR2058989A5 true FR2058989A5 (en) 1971-05-28

Family

ID=25311618

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7030463A Expired FR2058989A5 (en) 1969-08-20 1970-08-19

Country Status (7)

Country Link
US (1) US3853590A (en)
JP (1) JPS526694B1 (en)
DE (1) DE2040930C3 (en)
ES (1) ES382866A1 (en)
FR (1) FR2058989A5 (en)
GB (1) GB1307927A (en)
SE (1) SE353743B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3985851A (en) * 1974-06-24 1976-10-12 General Dynamics Corporation Method of forming a feed horn
US4063004A (en) * 1975-12-30 1977-12-13 Hooker Chemicals & Plastics Corporation Metal plating of plastics
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4228201A (en) * 1977-06-06 1980-10-14 Nathan Feldstein Method for rendering a non-platable semiconductor substrate platable
US4419390A (en) * 1977-06-06 1983-12-06 Nathan Feldstein Method for rendering non-platable semiconductor substrates platable
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4181760A (en) * 1977-06-06 1980-01-01 Surface Technology, Inc. Method for rendering non-platable surfaces platable
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
DE3012006A1 (en) * 1980-03-28 1981-10-08 Merck Patent Gmbh, 6100 Darmstadt METHOD FOR DEFLECTIVE METAL DEPOSITION
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4552787A (en) * 1984-02-29 1985-11-12 International Business Machines Corporation Deposition of a metal from an electroless plating composition
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US5361914A (en) * 1993-10-05 1994-11-08 Digital Equipment Corporation Device for component processing
US5903344A (en) * 1996-03-04 1999-05-11 Reedy Scientific Instruments Matrix isolation apparatus for spectroscopic analysis of chemical compounds
WO2006085669A1 (en) * 2005-02-08 2006-08-17 Fujifilm Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials

Also Published As

Publication number Publication date
JPS526694B1 (en) 1977-02-24
GB1307927A (en) 1973-02-21
DE2040930C3 (en) 1981-08-13
US3853590A (en) 1974-12-10
ES382866A1 (en) 1972-12-16
DE2040930B2 (en) 1978-05-11
SE353743B (en) 1973-02-12
DE2040930A1 (en) 1971-03-04

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Legal Events

Date Code Title Description
ST Notification of lapse