CA928902A - Electroless plating baths with improved deposition rates - Google Patents
Electroless plating baths with improved deposition ratesInfo
- Publication number
- CA928902A CA928902A CA110714A CA110714A CA928902A CA 928902 A CA928902 A CA 928902A CA 110714 A CA110714 A CA 110714A CA 110714 A CA110714 A CA 110714A CA 928902 A CA928902 A CA 928902A
- Authority
- CA
- Canada
- Prior art keywords
- electroless plating
- deposition rates
- plating baths
- improved deposition
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4355370A | 1970-06-04 | 1970-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA928902A true CA928902A (en) | 1973-06-26 |
Family
ID=21927745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA110714A Expired CA928902A (en) | 1970-06-04 | 1971-04-19 | Electroless plating baths with improved deposition rates |
Country Status (3)
Country | Link |
---|---|
US (1) | US3645749A (en) |
JP (1) | JPS526928B1 (en) |
CA (1) | CA928902A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963842A (en) * | 1974-06-20 | 1976-06-15 | London Laboratories Limited Co. | Deposition of copper |
JPS5147535A (en) * | 1974-10-22 | 1976-04-23 | Toko Inc | DOMUDEN KAIMETSUKYOKU |
US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
ES2039403T3 (en) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER. |
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
US4935267A (en) * | 1987-05-08 | 1990-06-19 | Nippondenso Co., Ltd. | Process for electrolessly plating copper and plating solution therefor |
JP3986743B2 (en) * | 2000-10-03 | 2007-10-03 | 株式会社日立製作所 | WIRING BOARD, MANUFACTURING METHOD THEREOF, AND ELECTROLESS COPPER PLATING LIQUID USED FOR THE SAME |
US10773817B1 (en) | 2018-03-08 | 2020-09-15 | Northrop Grumman Systems Corporation | Bi-directional flow ram air system for an aircraft |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
-
1970
- 1970-06-04 US US43553A patent/US3645749A/en not_active Expired - Lifetime
-
1971
- 1971-04-09 JP JP46022685A patent/JPS526928B1/ja active Pending
- 1971-04-19 CA CA110714A patent/CA928902A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS526928B1 (en) | 1977-02-25 |
US3645749A (en) | 1972-02-29 |
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