GB953556A - Improvements in or relating to the preparation of the surfaces of metals or semi-conductor bodies - Google Patents

Improvements in or relating to the preparation of the surfaces of metals or semi-conductor bodies

Info

Publication number
GB953556A
GB953556A GB44832/60A GB4483260A GB953556A GB 953556 A GB953556 A GB 953556A GB 44832/60 A GB44832/60 A GB 44832/60A GB 4483260 A GB4483260 A GB 4483260A GB 953556 A GB953556 A GB 953556A
Authority
GB
United Kingdom
Prior art keywords
substrates
compartment
coating
semi
vapour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB44832/60A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB953556A publication Critical patent/GB953556A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Abstract

<PICT:0953556/C3/1> A metal or a semi-conductor such as bismuth telluride is coated by vapour deposition with an adhesion layer of Fe, Co or Ni and then a soldering layer of Au, Pt or Ag. The substrate may first be pretreated by an electrical glow discharge and the process is carried out either intermittently, Fig. 1 (not shown), in which the substrates are mounted in a rotatable turntable with vapour coating sources above and below the substrates, or continuously as shown in Fig. 2. A vacuum chamber 1 is divided into three compartments 14, 15 and 16, with an air lock 20 on the entry side and an air lock 21 on the exit side. The substrates are mounted in a guide bar 19 which passes the substrates through the compartment 14 where the glow discharge treatment is carried out, compartment 15 where the first coating is applied and compartment 16 where the soldering coating is applied. The vapour coating sources 6, 7, 8 and 9 are mounted above and below the substrates so that both faces are coated.
GB44832/60A 1959-12-31 1960-12-30 Improvements in or relating to the preparation of the surfaces of metals or semi-conductor bodies Expired GB953556A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0066493 1959-12-31

Publications (1)

Publication Number Publication Date
GB953556A true GB953556A (en) 1964-03-25

Family

ID=7498857

Family Applications (1)

Application Number Title Priority Date Filing Date
GB44832/60A Expired GB953556A (en) 1959-12-31 1960-12-30 Improvements in or relating to the preparation of the surfaces of metals or semi-conductor bodies

Country Status (2)

Country Link
FR (1) FR1277057A (en)
GB (1) GB953556A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367806A (en) * 1964-01-07 1968-02-06 Int Standard Electric Corp Method of etching a graded metallic film
GB2273110A (en) * 1992-12-03 1994-06-08 Gec Marconi Avionics Holdings Depositing different materials on a substrate by controlling degree of exposure
US5454919A (en) * 1992-12-03 1995-10-03 Gec-Marconi Avionics Holdings Limited Depositing different materials on a substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367806A (en) * 1964-01-07 1968-02-06 Int Standard Electric Corp Method of etching a graded metallic film
GB2273110A (en) * 1992-12-03 1994-06-08 Gec Marconi Avionics Holdings Depositing different materials on a substrate by controlling degree of exposure
US5454919A (en) * 1992-12-03 1995-10-03 Gec-Marconi Avionics Holdings Limited Depositing different materials on a substrate
GB2273110B (en) * 1992-12-03 1996-01-24 Gec Marconi Avionics Holdings Depositing different materials on a substrate

Also Published As

Publication number Publication date
FR1277057A (en) 1961-11-24

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