ES2171274T3 - Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada. - Google Patents
Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada.Info
- Publication number
- ES2171274T3 ES2171274T3 ES97942853T ES97942853T ES2171274T3 ES 2171274 T3 ES2171274 T3 ES 2171274T3 ES 97942853 T ES97942853 T ES 97942853T ES 97942853 T ES97942853 T ES 97942853T ES 2171274 T3 ES2171274 T3 ES 2171274T3
- Authority
- ES
- Spain
- Prior art keywords
- smart card
- chip card
- card module
- semiconductor chip
- combined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
LA INVENCION ESTA RELACIONADA CON UN MODULO DE TARJETAS DE CHIP (1), QUE COMPRENDE UN SOPORTE (2) CON UN PRIMER PLANO DE CONTACTO (3) Y UN CHIP SEMICONDUCTOR (4), ASI COMO CONEXIONES CONDUCTIVAS ELECTRICAMENTE (5) ENTRE EL CHIP SEMICONDUCTOR Y EL PRIMER PLANO DE CONTACTO. ADEMAS DEL PRIMER PLANO DE CONTACTO, EL MODULO DE TARJETAS DE CHIP PRESENTA EN LA OTRA CARA DEL SOPORTE (2), OTRO PLANO DE CONEXION (6), QUE SE CONECTA ELECTRICAMENTE CON EL CHIP SEMICONDUCTOR (4). EL OTRO PLANO DE CONEXION (6) PUEDE SERVIR, POR EJEMPLO, PARA EL CONTACTO DE UNA BOBINA DE INDUCCION INTEGRADA EN UN CUERPO DE TARJETA PARA LA TRANSMISION DE DATOS SIN CONTACTO. POR OTRA PARTE, LA INVENCION ESTA RELACIONADA CON UNA TARJETA COMBINADA PARA LA TRANSMISION DE DATOS CON O SIN CONTACTO, QUE COMPRENDE EL MODULO DE TARJETAS DE CHIP (1) SEGUN LA INVENCION, ASI COMO UN PROCEDIMIENTO PARA LA FABRICACION DEL MODULO DE TARJETAS DE CHIP Y DE LA TARJETA COMBINADA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19632813A DE19632813C2 (de) | 1996-08-14 | 1996-08-14 | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2171274T3 true ES2171274T3 (es) | 2002-09-01 |
Family
ID=7802649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97942853T Expired - Lifetime ES2171274T3 (es) | 1996-08-14 | 1997-08-12 | Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada. |
Country Status (13)
Country | Link |
---|---|
US (1) | US6095423A (es) |
EP (1) | EP0919041B1 (es) |
JP (1) | JP3262804B2 (es) |
KR (1) | KR100358578B1 (es) |
CN (1) | CN1143381C (es) |
AT (1) | ATE209800T1 (es) |
BR (1) | BR9711161A (es) |
DE (2) | DE19632813C2 (es) |
ES (1) | ES2171274T3 (es) |
IN (1) | IN191477B (es) |
RU (1) | RU2161331C2 (es) |
UA (1) | UA52673C2 (es) |
WO (1) | WO1998007115A1 (es) |
Families Citing this family (67)
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DE19640304C2 (de) | 1996-09-30 | 2000-10-12 | Siemens Ag | Chipmodul insbesondere zur Implantation in einen Chipkartenkörper |
FR2760113B1 (fr) * | 1997-02-24 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact a antenne bobinee |
DE69837465T2 (de) * | 1997-06-23 | 2007-12-13 | Rohm Co. Ltd., Kyoto | Modul für ic-karte, ic-karte und verfahren zu seiner herstellung |
JP3687783B2 (ja) * | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
US6826554B2 (en) * | 1998-06-29 | 2004-11-30 | Fujitsu Limited | System and method for adaptively configuring a shopping display in response to a recognized customer profile |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
US6578203B1 (en) * | 1999-03-08 | 2003-06-10 | Tazwell L. Anderson, Jr. | Audio/video signal distribution system for head mounted displays |
US20020057364A1 (en) | 1999-05-28 | 2002-05-16 | Anderson Tazwell L. | Electronic handheld audio/video receiver and listening/viewing device |
US20060174297A1 (en) * | 1999-05-28 | 2006-08-03 | Anderson Tazwell L Jr | Electronic handheld audio/video receiver and listening/viewing device |
US7210160B2 (en) | 1999-05-28 | 2007-04-24 | Immersion Entertainment, L.L.C. | Audio/video programming and charging system and method |
JP3461308B2 (ja) * | 1999-07-30 | 2003-10-27 | Necマイクロシステム株式会社 | データ処理装置、その動作制御方法 |
US7796162B2 (en) * | 2000-10-26 | 2010-09-14 | Front Row Technologies, Llc | Providing multiple synchronized camera views for broadcast from a live venue activity to remote viewers |
US20030112354A1 (en) * | 2001-12-13 | 2003-06-19 | Ortiz Luis M. | Wireless transmission of in-play camera views to hand held devices |
US7630721B2 (en) | 2000-06-27 | 2009-12-08 | Ortiz & Associates Consulting, Llc | Systems, methods and apparatuses for brokering data between wireless devices and data rendering devices |
US7812856B2 (en) * | 2000-10-26 | 2010-10-12 | Front Row Technologies, Llc | Providing multiple perspectives of a venue activity to electronic wireless hand held devices |
US7782363B2 (en) * | 2000-06-27 | 2010-08-24 | Front Row Technologies, Llc | Providing multiple video perspectives of activities through a data network to a remote multimedia server for selective display by remote viewing audiences |
US8583027B2 (en) | 2000-10-26 | 2013-11-12 | Front Row Technologies, Llc | Methods and systems for authorizing computing devices for receipt of venue-based data based on the location of a user |
US7149549B1 (en) | 2000-10-26 | 2006-12-12 | Ortiz Luis M | Providing multiple perspectives for a venue activity through an electronic hand held device |
JP4873776B2 (ja) * | 2000-11-30 | 2012-02-08 | ソニー株式会社 | 非接触icカード |
DE10109993A1 (de) * | 2001-03-01 | 2002-09-05 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Moduls |
US20030085288A1 (en) * | 2001-11-06 | 2003-05-08 | Luu Deniel V.H. | Contactless SIM card carrier with detachable antenna and carrier therefore |
US7344074B2 (en) * | 2002-04-08 | 2008-03-18 | Nokia Corporation | Mobile terminal featuring smart card interrupt |
DE10237084A1 (de) * | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements |
WO2004034617A1 (en) | 2002-10-07 | 2004-04-22 | Immersion Entertainment, Llc | System and method for providing event spectators with audio/video signals pertaining to remote events |
US7593687B2 (en) | 2003-10-07 | 2009-09-22 | Immersion Entertainment, Llc | System and method for providing event spectators with audio/video signals pertaining to remote events |
KR100579019B1 (ko) * | 2003-11-10 | 2006-05-12 | (주)이.씨테크날리지 | 콤비카드 제조방법 |
EP2039460A3 (de) * | 2004-11-02 | 2014-07-02 | HID Global GmbH | Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit |
KR100723493B1 (ko) * | 2005-07-18 | 2007-06-04 | 삼성전자주식회사 | 와이어 본딩 및 플립 칩 본딩이 가능한 스마트 카드 모듈기판 및 이를 포함하는 스마트 카드 모듈 |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
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US7546671B2 (en) * | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
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DE102014107299B4 (de) | 2014-05-23 | 2019-03-28 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
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US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
JP2713529B2 (ja) * | 1992-08-21 | 1998-02-16 | 三菱電機株式会社 | 信号受信用コイルおよびこれを使用した非接触icカード |
AU670497B2 (en) * | 1993-03-18 | 1996-07-18 | Nagraid S.A. | Method for producing a card with at least one electronic component, and card thereby obtained |
JPH0737049A (ja) * | 1993-07-23 | 1995-02-07 | Toshiba Corp | 外部記憶装置 |
JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
-
1996
- 1996-08-14 DE DE19632813A patent/DE19632813C2/de not_active Expired - Fee Related
-
1997
- 1997-08-04 IN IN1442CA1997 patent/IN191477B/en unknown
- 1997-08-12 AT AT97942853T patent/ATE209800T1/de not_active IP Right Cessation
- 1997-08-12 CN CNB971987653A patent/CN1143381C/zh not_active Expired - Fee Related
- 1997-08-12 DE DE59705575T patent/DE59705575D1/de not_active Expired - Fee Related
- 1997-08-12 ES ES97942853T patent/ES2171274T3/es not_active Expired - Lifetime
- 1997-08-12 WO PCT/EP1997/004378 patent/WO1998007115A1/de active IP Right Grant
- 1997-08-12 JP JP50940198A patent/JP3262804B2/ja not_active Expired - Fee Related
- 1997-08-12 RU RU99105123/09A patent/RU2161331C2/ru not_active IP Right Cessation
- 1997-08-12 KR KR1019997001253A patent/KR100358578B1/ko not_active IP Right Cessation
- 1997-08-12 EP EP97942853A patent/EP0919041B1/de not_active Expired - Lifetime
- 1997-08-12 BR BR9711161-9A patent/BR9711161A/pt not_active IP Right Cessation
- 1997-12-08 UA UA99020806A patent/UA52673C2/uk unknown
-
1999
- 1999-02-16 US US09/250,874 patent/US6095423A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1143381C (zh) | 2004-03-24 |
UA52673C2 (uk) | 2003-01-15 |
DE19632813C2 (de) | 2000-11-02 |
BR9711161A (pt) | 2000-01-11 |
KR100358578B1 (ko) | 2002-10-25 |
IN191477B (es) | 2003-12-06 |
KR20000029989A (ko) | 2000-05-25 |
WO1998007115A1 (de) | 1998-02-19 |
US6095423A (en) | 2000-08-01 |
EP0919041B1 (de) | 2001-11-28 |
JP3262804B2 (ja) | 2002-03-04 |
DE59705575D1 (de) | 2002-01-10 |
RU2161331C2 (ru) | 2000-12-27 |
DE19632813A1 (de) | 1998-02-19 |
ATE209800T1 (de) | 2001-12-15 |
JP2000501535A (ja) | 2000-02-08 |
EP0919041A1 (de) | 1999-06-02 |
CN1233334A (zh) | 1999-10-27 |
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