CN101673789B - 发光二极管封装基板结构、制法及其封装结构 - Google Patents
发光二极管封装基板结构、制法及其封装结构 Download PDFInfo
- Publication number
- CN101673789B CN101673789B CN 200810149596 CN200810149596A CN101673789B CN 101673789 B CN101673789 B CN 101673789B CN 200810149596 CN200810149596 CN 200810149596 CN 200810149596 A CN200810149596 A CN 200810149596A CN 101673789 B CN101673789 B CN 101673789B
- Authority
- CN
- China
- Prior art keywords
- metal
- substrate
- piercing
- led
- described metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
10 | 金属基板 |
12 | 金属接脚 |
13 | 金属穿孔 |
14 | 金属承座 |
20 | 绝缘基板 |
22 | 绝缘穿孔 |
22’ | 绝缘穿孔 |
23 | 金属层 |
24 | 黏着层 |
30 | 绝缘材料 |
40 | 发光二极管芯片 |
50 | 封装材料 |
60 | 金属引线 |
62 | 焊球 |
64 | 焊球 |
Claims (25)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810149596 CN101673789B (zh) | 2008-09-12 | 2008-09-12 | 发光二极管封装基板结构、制法及其封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810149596 CN101673789B (zh) | 2008-09-12 | 2008-09-12 | 发光二极管封装基板结构、制法及其封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101673789A CN101673789A (zh) | 2010-03-17 |
CN101673789B true CN101673789B (zh) | 2011-08-17 |
Family
ID=42020886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200810149596 Expired - Fee Related CN101673789B (zh) | 2008-09-12 | 2008-09-12 | 发光二极管封装基板结构、制法及其封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101673789B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101086014B1 (ko) * | 2011-06-27 | 2011-11-22 | (주)포인트엔지니어링 | 고방열성 광소자용 기판 및 그 제조방법 |
CN104078556B (zh) * | 2013-03-28 | 2017-03-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构的制造方法 |
CN105225964B (zh) * | 2014-06-25 | 2017-12-26 | 吕传盛 | 含固相反应的富金层银基导线制造方法 |
CN105762082B (zh) * | 2014-12-19 | 2018-10-23 | 深南电路有限公司 | 一种封装基板的制作方法及封装基板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6095423A (en) * | 1996-08-14 | 2000-08-01 | Siemens Aktiengesellschaft | Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
CN1902757A (zh) * | 2003-12-02 | 2007-01-24 | 3M创新有限公司 | 照明组件 |
CN1901183A (zh) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | 衬底、智能卡模块及制造它们的方法 |
CN101226918A (zh) * | 2007-01-17 | 2008-07-23 | 台湾应解股份有限公司 | 芯片封装基板及其封装结构 |
-
2008
- 2008-09-12 CN CN 200810149596 patent/CN101673789B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6095423A (en) * | 1996-08-14 | 2000-08-01 | Siemens Aktiengesellschaft | Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
CN1902757A (zh) * | 2003-12-02 | 2007-01-24 | 3M创新有限公司 | 照明组件 |
CN1901183A (zh) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | 衬底、智能卡模块及制造它们的方法 |
CN101226918A (zh) * | 2007-01-17 | 2008-07-23 | 台湾应解股份有限公司 | 芯片封装基板及其封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN101673789A (zh) | 2010-03-17 |
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