TW428298B - Manufacturing method and structure for 3D system on chip - Google Patents

Manufacturing method and structure for 3D system on chip

Info

Publication number
TW428298B
TW428298B TW88116072A TW88116072A TW428298B TW 428298 B TW428298 B TW 428298B TW 88116072 A TW88116072 A TW 88116072A TW 88116072 A TW88116072 A TW 88116072A TW 428298 B TW428298 B TW 428298B
Authority
TW
Taiwan
Prior art keywords
chips
chip
stacked vertically
manufacturing
electrically connected
Prior art date
Application number
TW88116072A
Other languages
Chinese (zh)
Inventor
Jian-Gau Shr
Shin-Bang Liu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW88116072A priority Critical patent/TW428298B/en
Application granted granted Critical
Publication of TW428298B publication Critical patent/TW428298B/en

Links

Abstract

A 3D system on a chip (SOC) structure which comprises: a plurality of chips and a plurality of plugs arranged in each chip. Those chips are stacked vertically and comprise a peripheral circuit region respectively that the peripheral circuit region is configured with several contact pads respectively. The plugs are located in the chips and being electrically connected with the corresponding contact pad of the two chips which are neighbored and stacked vertically; and, electrically connected with the corresponding contact pad of the two chips which are not adjacent and stacked vertically.
TW88116072A 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip TW428298B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Publications (1)

Publication Number Publication Date
TW428298B true TW428298B (en) 2001-04-01

Family

ID=21642337

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Country Status (1)

Country Link
TW (1) TW428298B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906422B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906422B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7906849B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7915157B2 (en) 1998-12-21 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7919867B2 (en) 2001-12-13 2011-04-05 Megica Corporation Chip structure and process for forming the same
US7932603B2 (en) 2001-12-13 2011-04-26 Megica Corporation Chip structure and process for forming the same
US8008776B2 (en) 2001-12-13 2011-08-30 Megica Corporation Chip structure and process for forming the same
US8546947B2 (en) 2001-12-13 2013-10-01 Megica Corporation Chip structure and process for forming the same

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