TW428298B - Manufacturing method and structure for 3D system on chip - Google Patents
Manufacturing method and structure for 3D system on chipInfo
- Publication number
- TW428298B TW428298B TW88116072A TW88116072A TW428298B TW 428298 B TW428298 B TW 428298B TW 88116072 A TW88116072 A TW 88116072A TW 88116072 A TW88116072 A TW 88116072A TW 428298 B TW428298 B TW 428298B
- Authority
- TW
- Taiwan
- Prior art keywords
- chips
- chip
- stacked vertically
- manufacturing
- electrically connected
- Prior art date
Links
Abstract
A 3D system on a chip (SOC) structure which comprises: a plurality of chips and a plurality of plugs arranged in each chip. Those chips are stacked vertically and comprise a peripheral circuit region respectively that the peripheral circuit region is configured with several contact pads respectively. The plugs are located in the chips and being electrically connected with the corresponding contact pad of the two chips which are neighbored and stacked vertically; and, electrically connected with the corresponding contact pad of the two chips which are not adjacent and stacked vertically.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88116072A TW428298B (en) | 1999-09-17 | 1999-09-17 | Manufacturing method and structure for 3D system on chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88116072A TW428298B (en) | 1999-09-17 | 1999-09-17 | Manufacturing method and structure for 3D system on chip |
Publications (1)
Publication Number | Publication Date |
---|---|
TW428298B true TW428298B (en) | 2001-04-01 |
Family
ID=21642337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88116072A TW428298B (en) | 1999-09-17 | 1999-09-17 | Manufacturing method and structure for 3D system on chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW428298B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906422B2 (en) | 1998-12-21 | 2011-03-15 | Megica Corporation | Chip structure and process for forming the same |
US7915734B2 (en) | 2001-12-13 | 2011-03-29 | Megica Corporation | Chip structure and process for forming the same |
-
1999
- 1999-09-17 TW TW88116072A patent/TW428298B/en not_active IP Right Cessation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906422B2 (en) | 1998-12-21 | 2011-03-15 | Megica Corporation | Chip structure and process for forming the same |
US7906849B2 (en) | 1998-12-21 | 2011-03-15 | Megica Corporation | Chip structure and process for forming the same |
US7915157B2 (en) | 1998-12-21 | 2011-03-29 | Megica Corporation | Chip structure and process for forming the same |
US7915734B2 (en) | 2001-12-13 | 2011-03-29 | Megica Corporation | Chip structure and process for forming the same |
US7919867B2 (en) | 2001-12-13 | 2011-04-05 | Megica Corporation | Chip structure and process for forming the same |
US7932603B2 (en) | 2001-12-13 | 2011-04-26 | Megica Corporation | Chip structure and process for forming the same |
US8008776B2 (en) | 2001-12-13 | 2011-08-30 | Megica Corporation | Chip structure and process for forming the same |
US8546947B2 (en) | 2001-12-13 | 2013-10-01 | Megica Corporation | Chip structure and process for forming the same |
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