ES2106520T3 - Procedimiento que permite el trabajo de materiales por radiacion emitida por diodos. - Google Patents

Procedimiento que permite el trabajo de materiales por radiacion emitida por diodos.

Info

Publication number
ES2106520T3
ES2106520T3 ES94911123T ES94911123T ES2106520T3 ES 2106520 T3 ES2106520 T3 ES 2106520T3 ES 94911123 T ES94911123 T ES 94911123T ES 94911123 T ES94911123 T ES 94911123T ES 2106520 T3 ES2106520 T3 ES 2106520T3
Authority
ES
Spain
Prior art keywords
radiation
pct
diodes
procedure
allows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94911123T
Other languages
English (en)
Inventor
Eckhard Beyer
Konrad Wissenbach
Volker Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4316829A external-priority patent/DE4316829A1/de
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Application granted granted Critical
Publication of ES2106520T3 publication Critical patent/ES2106520T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Semiconductor Lasers (AREA)

Abstract

LA INVENCION SE REFIERE A UN PROCEDIMIENTO PARA MECANIZACION DE MATERIALES MEDIANTE RADIACION DE DIODOS, EN PARTICULAR RADIACION DE DIODOS LASER. PARA ADAPTAR EL PERFIL DEL RAYO AL PROCESO DE MECANIZADO, SE IMPLANTA EL PROCEDIMIENTO DE TAL MODO QUE LA RADIACION EMITIDA POR UNA PLURALIDAD DE DIODOS CON UN PERFIL DE RAYO PREVIAMENTE DETERMINADO SE DIRIGE HACIA LA REGION DE MECANIZACION DE LA PIEZA DE TRABAJO Y LA DISTRIBUCION DE INTENSIDAD EN EL PERFIL DEL RAYO SE ALTERA MEDIANTE EL CONTROL DE LA POTENCIA DE SALIDA DEL DIODO.
ES94911123T 1993-05-19 1994-03-08 Procedimiento que permite el trabajo de materiales por radiacion emitida por diodos. Expired - Lifetime ES2106520T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4316829A DE4316829A1 (de) 1992-10-12 1993-05-19 Verfahren zur Materialbearbeitung mit Diodenstrahlung

Publications (1)

Publication Number Publication Date
ES2106520T3 true ES2106520T3 (es) 1997-11-01

Family

ID=6488519

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94911123T Expired - Lifetime ES2106520T3 (es) 1993-05-19 1994-03-08 Procedimiento que permite el trabajo de materiales por radiacion emitida por diodos.

Country Status (8)

Country Link
US (1) US5705788A (es)
EP (1) EP0700325B1 (es)
JP (1) JPH09501104A (es)
AT (1) ATE156739T1 (es)
DE (1) DE59403740D1 (es)
DK (1) DK0700325T3 (es)
ES (1) ES2106520T3 (es)
WO (1) WO1994026459A1 (es)

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Also Published As

Publication number Publication date
US5705788A (en) 1998-01-06
ATE156739T1 (de) 1997-08-15
EP0700325A1 (de) 1996-03-13
DK0700325T3 (da) 1997-09-01
DE59403740D1 (de) 1997-09-18
EP0700325B1 (de) 1997-08-13
JPH09501104A (ja) 1997-02-04
WO1994026459A1 (de) 1994-11-24

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