EP2712281B1 - Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor - Google Patents
Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor Download PDFInfo
- Publication number
- EP2712281B1 EP2712281B1 EP12785591.4A EP12785591A EP2712281B1 EP 2712281 B1 EP2712281 B1 EP 2712281B1 EP 12785591 A EP12785591 A EP 12785591A EP 2712281 B1 EP2712281 B1 EP 2712281B1
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- European Patent Office
- Prior art keywords
- wiring substrate
- notch
- view
- main
- main surface
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- 239000000758 substrate Substances 0.000 title claims description 258
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000004020 conductor Substances 0.000 claims description 154
- 239000000919 ceramic Substances 0.000 claims description 43
- 230000035515 penetration Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 18
- 238000000926 separation method Methods 0.000 description 14
- 229910010293 ceramic material Inorganic materials 0.000 description 10
- 230000001747 exhibiting effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000006112 glass ceramic composition Substances 0.000 description 3
- 229910052863 mullite Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Definitions
- the present invention relates to a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; to a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and to a method for producing the multi-piece wiring substrate array.
- ceramic wiring substrates are produced by separating a multi-piece ceramic wiring substrate array into individual pieces along dividing grooves provided on the front surface or back surface of the wiring substrate array.
- a method for producing a multi-piece wiring substrate array in which a blade having a specific edge angle is pressed against a green sheet laminate at positions where dividing grooves are to be formed, so that chips or burrs are less likely to be generated at a metal layer, etc. located in the vicinity of the thus-formed dividing grooves during separation of the substrate array (see, for example, Patent Document 1).
- the depth of a dividing groove formed by means of the aforementioned blade must be smaller than that of the position of a plating wire for connecting the internal wirings of two adjacent wiring substrate units, the dividing groove must be formed to be shallower than the bottom of a bottomed hole or shallower than a stepped portion of a through hole having two concentric portions of different inner diameters, which results in easy generation of burrs, etc.
- the conductor layer may exhibit poor reliability during soldering for mounting of a component on the conductor layer.
- An object of the present invention is to solve problems described in the Background Art section, and to provide a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed.
- Another object of the present invention is to provide a multi-piece wiring substrate array for providing a plurality of the wiring substrates.
- Yet another object of the present invention is to provide a method for reliably producing the multi-piece wiring substrate array.
- EP-A1-2315508 discloses a ceramic substrate and manufacturing method for the substrate on which the precharacterising portions of the independent claims are based.
- JP-A-807-192961 disclosed a multi-layer electronic device and production method in which a mother laminate comprises a plurality of insulating sheets laminated through conductive films have holes made at splitting positions and filled with conductive material. Grooves are made in the mother laminate in order to split the conductive material into a plurality of parts.
- EP-A2-0871220 discloses a ceramic substrate which includes four generally quadrant-like indentations at corners of the substrate with conductive members applied to the inner surface of the indentations to form input and output terminals.
- a dividing groove of a green sheet is formed such that the depth of the dividing groove at a position where it crosses with a through hole or a bottomed hole of the green sheet-the hole to become a notch located on a side surface of each wiring substrate-is greater than that of the dividing groove at a position where it does not cross with the through hole or the bottomed hole.
- the present invention provides a wiring substrate as defined by claims 1 to 7.
- first main surface and a second main surface of the paired main surfaces are described relative to each other.
- first main surface is the back surface of the substrate main body
- second main surface is the front surface of the substrate main body.
- the ceramic material examples include high-temperature fired ceramic materials such as alumina, mullite, and aluminum nitride; and low-temperature fired ceramic materials such as glass-ceramic material.
- the aforementioned groove surface corresponds to one of the inner wall surfaces of a dividing groove exposed on each side surface of an individual wiring substrate, the wiring substrate being produced by separating a multi-piece wiring substrate array into individual pieces along dividing grooves (each having a V-shaped cross section) formed, through laser processing, on a main surface of the below-described green sheet laminate which is to become the multi-piece wiring substrate array.
- the groove surface has a width (depth in a thickness direction) which is 50% or less of the width (in a thickness direction) of the corresponding side surface of the substrate main body.
- a plating wire for connecting the internal wirings of adjacent wiring substrate units of the below-described multi-piece wiring substrate array, which breakage would otherwise occur through formation of a dividing groove between the wiring substrate units.
- an end surface of the plating wire formed on a wiring substrate is exposed on the first-main-surface-side fracture surface of a side surface at a position shallower than the deepest portion of a notch provided on the side surface.
- the aforementioned notch may be formed on all the four side surfaces of the wiring substrate, or may be formed only on one, two, or three side surfaces of the wiring substrate.
- the below-described conductor layer is formed at least on the inner wall of the notch, and the conductor layer serves as an external connection terminal for achieving electrical conduction between the internal wiring of the wiring substrate and an external component.
- the present invention also encompasses a wiring substrate wherein each side surface also has a groove surface located on a side toward the second main surface, and the fracture surface is located between the first-main-surface-side groove surface and the second-main-surface-side groove surface.
- the second-main-surface-side groove surface may have a belt-like shape and may extend in a longitudinal direction of the side surface.
- the second-main-surface-side groove surface may have curved portions (i.e., extending portions) on opposite sides of the second notch or the fourth notch.
- the present invention also encompasses a wiring substrate wherein a conductor layer is formed so as to extend on the inner wall of the notch or each of the first to fourth notches.
- the present invention also provides a multi-piece wiring substrate array as defined by claim 8.
- the present invention also encompasses a multi-piece wiring substrate array which further comprises second cylindrical portions each having a shape similar to that of the first cylindrical portion in plan view, having a cross-sectional area smaller than that of the first cylindrical portion, and penetrating between a center portion of a bottom surface of the first cylindrical portion and the second main surface so as to extend in a thickness direction of the product region, wherein one or each of two dividing grooves crossing with the corresponding first and second cylindrical portions in a radial direction has a bottom which has third curved portions on opposite sides of the second cylindrical portion, the third curved portions being convex toward the first main surface in side view.
- the present invention also encompasses a multi-piece wiring substrate array wherein a conductor layer is formed so as to extend on the inner wall of the first cylindrical portion, or on both the inner walls of the first and second cylindrical portions.
- the present invention also provides a method for producing a multi-piece wiring substrate array as defined by claim 11.
- through holes, etc. are formed in a green sheet laminate through the following procedure: penetration holes are formed in each of a plurality of green sheets, and subsequently the green sheets are stacked so that the penetration holes communicate with one another.
- the laser processing is carried out so that the focal point of the laser beam for forming the dividing grooves is maintained at a generally constant depth in a thickness direction of the green sheet laminate (including the inside of the through holes, etc.).
- a step of forming a conductor layer on the inner wall of each of the penetration holes of the green sheets so that a circular tubular conductor layer is formed on the inner wall of the bottomed hole or through hole of the green sheet laminate, and that the conductor layer crosses with the corresponding dividing groove.
- the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch in a longitudinal direction of the side surface, the first curved portions being convex toward the first main surface of the substrate main body in side view, and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.
- the notch is surrounded by a pair of the first curved portions located on the opposite sides in the side surface, and the second curved portion located between the deepest portion of the notch and a second-main-surface-side portion of the side surface.
- these two types of curved portions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion being defined by a partition line and extending toward the second-main-surface side of the side surface. Therefore, generation of ceramic burrs or cracks is suppressed in the vicinity of the notch located on the first-main-surface side of the side surface, and also breakage of the conductor layer provided on the inner wall of the notch is suppressed. Thus, the wiring substrate exhibits excellent form and dimensional accuracy.
- the notch is surrounded by the first curved portions located on a pair of side surfaces, and the third curved portion located between the deepest portion of the notch and a second-main-surface-side portion of each side surface.
- These two types of curved portions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surface. Therefore, generation of burrs or cracks is suppressed in the vicinity of the notch located at the corner portion formed by the paired side surfaces and on the first-main-surface side of the side surfaces, and also breakage of the conductor layer provided on the inner wall of the notch is suppressed.
- the wiring substrate exhibits excellent form and dimensional accuracy.
- the first notch is sandwiched between a pair of the first curved portions located on the opposite sides of the side surface in a longitudinal direction; the second notch is sandwiched between a pair of the third curved portions located on the opposite sides of the side surface in a longitudinal direction; and the paired third curved portions are respectively adjacent to a pair of the deepest portions of the first notch (exclusive of the second notch).
- these two types of curved portions located at the aforementioned four positions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surface.
- the wiring substrate exhibits excellent form and dimensional accuracy.
- the third notch is sandwiched between a pair of the first curved portions located on the opposite sides of the paired side surfaces in a longitudinal direction; the fourth notch is sandwiched between a pair of the third curved portions located on the opposite sides of the paired side surfaces in a longitudinal direction; and the paired third curved portions are respectively adjacent to a pair of the deepest portions of the third notch (exclusive of the fourth notch) of the paired side surfaces.
- these two types of curved portions located at the aforementioned four positions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surfaces.
- the wiring substrate exhibits excellent form and dimensional accuracy.
- a second-main-surface-side groove surface is formed in addition to the groove surface which is provided on the first-main-surface side of the side surface and which includes any of the first to fourth curved portions (i.e., extending portion), and these groove surfaces are parallel to each other. That is, the fracture surface is formed only at a position sandwiched between the paired groove surfaces. Therefore, generation of burrs, etc. is suppressed in the vicinity of any of the first to fourth notches, and also breakage of the conductor layer provided on the inner wall of any of the first to fourth notches is further suppressed. Thus, the wiring substrate exhibits further excellent form and dimensional accuracy.
- connection terminal of a motherboard e.g., a printed wiring board
- the internal wiring formed on any of a plurality of ceramic layers forming the substrate main body as well as between the connection terminal and the surface wiring formed on the second main surface (front surface), via the conductor layer formed so as to extend on the inner wall of each of the first to fourth notches.
- a metal (e.g., Ni or Au) plating film is reliably formed to cover an end surface of the conductor layer formed on the inner wall of each notch, the end surface (i.e., cut surface before separation of the substrate array) being exposed on the groove surface. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely.
- the bottom of one dividing groove which crosses with the first cylindrical portion in a radial direction and which separates the first cylindrical portion into two parts, or the bottoms of two dividing grooves which orthogonally cross each other at the first cylindrical portion and which separate the first cylindrical portion into four parts have symmetrical first curved portions on opposite sides of the first cylindrical portion in a longitudinal direction of the dividing groove(s), the first curved portions being convex toward the first main surface in side view.
- a second curved portion which is convex toward the second main surface, is provided on a second-main-surface side of the first cylindrical portion.
- the bottom of a dividing groove which separates the first and second cylindrical portions into two or four parts in an axial direction has symmetrical first curved portions on opposite sides of the first cylindrical portion in a longitudinal direction of the dividing groove, the first curved portions being convex toward the first main surface in side view, and also has symmetrical third curved portions on opposite sides of the second cylindrical portion in a longitudinal direction of the dividing groove, the third curved portions being convex toward the first main surface in side view.
- the multi-piece wiring substrate array of claim 10 when the product region is separated into individual wiring substrate units along the dividing grooves, ceramic burrs are less likely to be generated, and breakage of a conductor layer is suppressed in the vicinity of first and second notches or third and fourth notches formed through separation of the first and second cylindrical portions into two or four parts.
- a plating film e.g., Ni or Au plating film
- Ni or Au plating film is formed to completely or almost completely cover an end surface of the conductor layer exposed in each dividing groove. Therefore, when the product region is separated into individual wiring substrate units, there can be reliably produced a plurality of wiring substrates each exhibiting excellent electrical conduction to an external component (e.g., a motherboard) and excellent brazing property during mounting thereof on the component.
- the green sheet laminate is continuously irradiated with a laser beam so that the laser beam is scanned at least on the first main surface of the laminate so as to cross with the bottomed hole or the through hole in a radial direction. Therefore, the bottom of each of lattice-shape dividing grooves formed on the first main surface has, on opposite sides of the bottomed hole or the through hole, etc., first curved portions which are convex toward the first main surface, and a second or third curved portion which is convex toward the second main surface.
- the production method can reliably produce a multi-piece wiring substrate array for providing a plurality of wiring substrates exhibiting excellent form and dimensional accuracy.
- FIG. 1 is a perspective view of a first wiring substrate 1a according to the present invention, as viewed from obliquely downward.
- the first wiring substrate 1a includes a substrate main body kp which is formed of a plurality of ceramic layers S (not illustrated), and which has a rectangular (or square) shape in plan view.
- the substrate main body kp has a pair of opposite first and second main surfaces 3 and 2, and four side surfaces 4 each being located between the paired main surfaces 3 and 2.
- Each side surface 4 has a notch 11 formed only on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of the side surface 4, the notch 11 having a concave (semicircular) shape in plan view, and also has a conductor layer 12 formed so as to extend on the inner wall of the notch 11.
- Each side surface 4 has a groove surface 6 located on the side toward the first main surface (back surface) 3 and a fracture surface 5 (of the aforementioned ceramic layers S) located between the groove surface 6 and the second main surface (front surface) 2.
- the groove surface 6 corresponds to one of the inner wall surfaces of a dividing groove formed in the below-described multi-piece wiring substrate array, and is smoother than the fracture surface 5 of the ceramic layers S.
- the conductor layer 12 also has, on the ceiling surface of the notch 11, a conductor layer 15 having a semicircular shape in plan view.
- the conductor layer 15 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S.
- the ceramic layers S are formed of a high-temperature fired ceramic material such as alumina or mullite, or a low-temperature fired ceramic material such as glass-ceramic material.
- the conductor layers 12 and 15 are formed of W or Mo
- the conductor layers 12 and 15 are formed of Cu or Ag.
- the first main surface 3 is the back surface of the substrate main body kp
- the second main surface 2 is the front surface of the substrate main body kp. The first main surface and the second main surface are described relative to each other.
- the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11 and the conductor layer 12, the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view, and also has a second curved portion R2 on the side (toward the second main surface 2) of the notch 11 and the conductor layers 12 and 15, the second curved portion R2 being convex toward the second main surface 2 in side view.
- first curved portions R1 on opposite sides of the notch 11 and the conductor layer 12
- the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view
- a second curved portion R2 on the side (toward the second main surface 2) of the notch 11 and the conductor layers 12 and 15, the second curved portion R2 being convex toward the second main surface 2 in side view.
- the groove surface 6 of each side surface 4 has, on opposite sides of the notch 11 and the conductor layer 12 in side view, a pair of extending portions 8 which taper toward the second main surface 2, and a semicircular extending portion 9 on the side (toward the second main surface 2) of the notch 11 and the conductor layers 12 and 15, the semicircular extending portion 9 being convex toward the second main surface 2.
- the extending portions 8 and 9 are formed as a portion of a dividing groove in association with formation of the dividing groove in the below-described multi-piece wiring substrate array through laser processing.
- FIG. 2 is a perspective view of a second wiring substrate 1c according to the present invention, as viewed from obliquely downward.
- the second wiring substrate 1c includes a substrate main body kp having first and second main surfaces 3 and 2 and side surfaces 4 as in the aforementioned case; a notch 13 having a quarter arc shape in plan view; and a conductor layer 14 similar to that described above.
- the notch 13 is provided at the corner portion formed by adjacent side surfaces 4, 4 only on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of the side surfaces 4.
- the conductor layer 14 is formed so as to extend on the inner wall of the notch 13.
- the conductor layer 14 also has, on the ceiling surface of the notch 13, a conductor layer 16 having a quarter arc shape in plan view.
- the conductor layer 16 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S.
- the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 13 and the conductor layer 14, the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view, and also has third curved portions R3 on the side (toward the second main surface 2) of the notch 13 and the conductor layer 14, the third curved portions R3 being symmetric with each other and convex toward the second main surface 2 in side view.
- the groove surface 6 of each side surface 4 has, on opposite sides of the notch 13 and the conductor layer 14 in side view, extending portions 8 which are adjacent to the notch 13 and the conductor layer 14 and which taper toward the second main surface 2, and also has a quarter-arc-shaped extending portion 10 on the side (toward the second main surface 2) of the notch 13 and the conductor layer 14.
- the extending portions 8 and 10 are formed as a portion of a dividing groove in association with formation of the dividing groove in the below-described multi-piece wiring substrate array through laser processing.
- the wiring substrate 1a or 1c According to the aforementioned first or second wiring substrate 1a or 1c, burrs or cracks are less likely to be generated in the ceramic layers S in the vicinity of the notch 11 or 13 located on the side (toward the first main surface 3) of the side surface 4, and breakage of the conductor layer 12 or 14 provided on the inner wall of the notch 11 or 13 is suppressed.
- the wiring substrate 1a or 1c exhibits excellent form and dimensional accuracy.
- connection terminal of a non-illustrated motherboard e.g., a printed wiring board
- a metal (e.g., Ni or Au) plating film is reliably formed to cover an end surface of the conductor layer 12 or 14, the end surface (i.e., cut surface before separation of the substrate array) being exposed on the groove surface 6. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely.
- the width of the groove surface 6 (exclusive of a portion in the vicinity of the notch 11 or 13) is small; i.e., the width is about 20 to about 30% (50% or less) of the width of each side surface 4 as measured in a thickness direction, a plating wire for achieving electrical conduction between adjacent wiring substrate units of the multi-piece wiring substrate array can be located at a position of the fracture surface 5 in the vicinity of the boundary 7.
- the notch 11 or 13 and the conductor layer 12 or 14 may be formed at least on any one of the side surfaces 4, or may be formed only between a pair of adjacent side surfaces 4, 4.
- FIG. 3 is a perspective view of a third wiring substrate 1e according to the present invention, as viewed from obliquely downward.
- the third wiring substrate 1e includes a substrate main body kp having first and second main surfaces 3 and 2 and side surfaces 4 as in the aforementioned case; a first notch 11 which has a concave shape in plan view, and which is formed on each side surface 4 on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of the side surface 4; a second notch 17 which has a concave shape in plan view as in the aforementioned case and has a smaller cross-sectional area, and which penetrates between a center portion of the ceiling surface (bottom surface) of the first notch 11 and the second main surface (front surface) 2; and conductor layers 12 and 18 which are respectively formed so as to extend on the inner walls of the first and second notches 11 and 17.
- a conductor layer 15 having a semi-ring shape in bottom view is formed on the ceiling surface of the first notch 11 for connecting the conductor layers 12 and 18.
- the conductor layer 15 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S.
- the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the first notch 11 and the conductor layer 12, the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view, and also has third curved portions R3 on opposite sides of the second notch 17 and the conductor layer 18, the third curved portions R3 being symmetric with each other and convex toward the second main surface 2 of the substrate main body kp in side view.
- first curved portions R1 on opposite sides of the first notch 11 and the conductor layer 12
- the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view
- third curved portions R3 on opposite sides of the second notch 17 and the conductor layer 18, the third curved portions R3 being symmetric with each other and convex toward the second main surface 2 of the substrate main body kp in side view.
- the groove surface 6 of each side surface 4 has, on opposite sides of the first notch 11 and the conductor layer 12 in side view, a pair of extending portions 8 which taper toward the second main surface 2, and also has quarter-arc-shaped extending portions 10 on opposite sides of the second notch 17 and the conductor layer 18, the portions 10 extending toward the first notch 11.
- the extending portions 8 and 10 are formed in association with formation of a dividing groove in the below-described multi-piece wiring substrate array through laser processing.
- the extending portions 10 include horn-like portions extending along the conductor layer 18 toward the second main surface 2.
- FIG. 4 is a perspective view of a fourth wiring substrate 1g according to the present invention, as viewed from obliquely downward.
- the fourth wiring substrate 1g includes a substrate main body kp having first and second main surfaces 3 and 2 and side surfaces 4 as in the aforementioned case; a third notch 13 which has a quarter arc shape in plan view, and which is provided at the corner portion formed by adjacent side surfaces 4, 4 only on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of the side surfaces 4; a fourth notch 19 which has a quarter arc shape in plan view as in the aforementioned case and has a smaller cross-sectional area, and which penetrates between a center portion of the ceiling surface (bottom surface) of the third notch 13 and the second main surface (front surface) 2; and conductor layers 14 and 20 which are respectively formed so as to extend on the inner walls of the third and fourth notches 13 and 19.
- a conductor layer 16 having a fan-like shape in bottom view is formed on the ceiling surface of the third notch 13 for connecting the conductor layers 14 and 20.
- the conductor layer 16 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S.
- the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 13 and the conductor layer 14, the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view, and also has third curved portions R3 on opposite sides (toward the third notch 13) of the fourth notch 19 and the conductor layer 20, the third curved portions R3 being symmetric with each other and convex toward the second main surface 2 in side view.
- first curved portions R1 on opposite sides of the notch 13 and the conductor layer 14
- the first curved portions R1 being symmetric with each other and convex toward the first main surface 3 in side view
- third curved portions R3 on opposite sides (toward the third notch 13) of the fourth notch 19 and the conductor layer 20
- the third curved portions R3 being symmetric with each other and convex toward the second main surface 2 in side view.
- each side surface 4 has, on opposite sides of the third notch 13 and the conductor layer 14 in side view, extending portions 8 which are adjacent to the third notch 13 and the conductor layer 14 and which taper toward the second main surface 2, and also has quarter-arc-shaped extending portions 10 on opposite sides of the fourth notch 19 and the conductor layer 20, the portions 10 extending toward the third notch 13.
- the extending portions 8 and 10 are formed in a manner similar to that described above.
- the extending portions 10 include horn-like portions extending along the conductor layer 20 toward the second main surface 2.
- the wiring substrate 1e or 1g exhibits excellent form and dimensional accuracy.
- connection terminal of a non-illustrated motherboard e.g., a printed wiring board
- the internal wiring formed on any of the ceramic layers S forming the substrate main body kp as well as between the connection terminal and the surface wiring (not illustrated) formed on the second main surface 2, via the aforementioned conductor layer 12, 14, 18, or 20.
- a metal (e.g., Au) plating film is reliably formed to cover an end surface of the conductor layer 12, 14, 18, or 20, the end surface being exposed on the groove surface 6. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely.
- the width of the groove surface 6 (exclusive of a portion in the vicinity of the notch 11, 13, 17, or 19) is small; i.e., the width is 50% or less of the width of each side surface 4 as measured in a thickness direction, a plating wire for achieving electrical conduction between adjacent wiring substrate units of the multi-piece wiring substrate array can be readily located at any position of the fracture surface 5.
- the notch 11, 13, 17, or 19 and the conductor layer 12, 14, 18, or 20 may be formed at least on any one of the side surfaces 4, or may be formed only between a pair of adjacent side surfaces 4, 4.
- FIG. 5 is a side view of a wiring substrate 1b, which is an applied embodiment of the first wiring substrate 1a.
- the wiring substrate 1b includes a substrate main body kp as in the aforementioned case, and each side surface 4 of the substrate main body kp has a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the second main surface 2, in addition to a groove surface 6 on the side toward the first main surface (back surface) 3 on which a notch 11 and a conductor layer 12 are formed.
- a fracture surface 5 is sandwiched between the paired groove surfaces 6, 6.
- the total width of the paired groove surfaces 6, 6 is 50% or less of the width of the side surface 4 as measured in a thickness direction of the substrate main body kp.
- FIG. 6 is a side view of a wiring substrate 1d, which is an applied embodiment of the second wiring substrate 1c.
- the wiring substrate 1d includes a substrate main body kp as in the aforementioned case, and each side surface 4 of the substrate main body kp has, at the corner portion formed by adjacent side surfaces 4, 4, a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the second main surface 2, in addition to a groove surface 6 on the side toward the first main surface (back surface) 3 on which a notch 13 and a conductor layer 14 are formed.
- a belt-like fracture surface 5 is sandwiched between the paired groove surfaces 6, 6.
- FIG. 7 is a side view of a wiring substrate 1f, which is an applied embodiment of the third wiring substrate 1e.
- the wiring substrate 1f includes a substrate main body kp as in the aforementioned case, and each side surface 4 of the substrate main body kp has a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the second main surface 2, in addition to a groove surface 6 on the side toward the first main surface (back surface) 3 on which a first notch 11 and a conductor layer 12 are formed.
- a belt-like fracture surface 5 is sandwiched between the paired groove surfaces 6, 6.
- the groove surface 6 on the side toward the second main surface 2 has extending portions which are provided on opposite sides of a second notch 17 and a conductor layer 18, and which taper toward the notch 17 and the layer 18.
- FIG. 8 is a side view of a wiring substrate 1h, which is an applied embodiment of the fourth wiring substrate 1g.
- the wiring substrate 1h includes a substrate main body kp as in the aforementioned case, and each side surface 4 of the substrate main body kp has, at the corner portion formed by adjacent side surfaces 4, 4, a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the second main surface 2, in addition to a groove surface 6 on the side toward the first main surface (back surface) 3 on which a notch 13 and a conductor layer 14 are formed.
- a belt-like fracture surface 5 is sandwiched between the paired groove surfaces 6, 6.
- the groove surface 6 on the side toward the second main surface 2 has extending portions which are provided on opposite sides of a fourth notch 19 and a conductor layer 20, and which taper toward the notch 19 and the layer 20.
- the aforementioned wiring substrate 1b, 1d, 1f, or 1h exhibits effects similar to those obtained by the wiring substrate 1a, 1c, 1e, or 1g.
- FIG. 9 is a plan view of a first multi-piece wiring substrate array 21a according to the present invention.
- FIG. 10 is a partial, vertical cross-sectional view of the multi-piece wiring substrate array 21a of FIG. 9 taken along line X-X.
- the multi-piece wiring substrate array 21a includes a product region 24 having a plurality of wiring substrate units 1n which are adjacently arranged in a matrix form, each unit being formed of a plurality of stacked ceramic layers S (not illustrated) as in the aforementioned case, and having a pair of first and second main surfaces 23 and 22 and a rectangular (or square) shape in plan view; an edge portion 25 which is formed of the ceramic layers S, which is located around the product region 24, and which has a pair of first and second main surfaces 23 and 22 and has a rectangular frame shape in plan view; dividing grooves 26 which are formed on the first main surface 23 and are arranged in a lattice shape in plan view, and which are provided between adjacent wiring substrate units 1n, 1n and between the product region 24 and the edge portion 25.
- Each of the dividing grooves 26 has a V-shaped cross section, and is formed through the below-described laser processing.
- the paired main surfaces 23 and 22 are common in the wiring substrate units 1n, the product region 24, and the edge portion 25.
- the first main surface 23 is to become the first main surface (back surface) 3 of the wiring substrate 1a
- the second main surface 22 is to become the second main surface (front surface) 2 of the wiring substrate 1a.
- One of the inner wall surfaces of each dividing groove 26 is to become the groove surface 6 of each side surface 4 of the wiring substrate 1a.
- Each of the wiring substrate units 1n is to become the first wiring substrate 1a through separation of the multi-piece wiring substrate array 21a into individual pieces.
- each of the four dividing grooves 26 surrounding each wiring substrate unit 1n has, at a middle portion thereof, a first cylindrical portion (notch: bottomed hole) 31 which has a circular shape in plan view, which is open only at the first main surface 23, and which crosses with the dividing groove 26 in a radial direction.
- the first cylindrical portion 31 has a circular tubular conductor layer 12 extending on the inner wall of the portion 31, and also has a disk-like conductor layer 15 which is located at the bottom of the portion 31 and is connected to the conductor layer 12.
- the conductor layer 12 has a ring-like flange portion extending on the first main surface 23, and the conductor layer 15 has a flange portion extending between the ceramic layers (S) toward the outer periphery thereof. Similar to the aforementioned case, the conductor layers 12 and 15 are formed of, for example, W or Mo.
- the bottom 27 of the dividing groove 26 crossing with the first cylindrical portion 31 and the conductor layers 12 and 15 in a radial direction has first curved portions R1 on opposite sides of the first cylindrical portion 31 and the conductor layers 12 and 15, the first curved portions R1 being convex toward the first main surface 23 in side view, and also has a second curved portion R2 on the side (toward the second main surface 22) of the first cylindrical portion 31 and the conductor layers 12 and 15, the second curved portion R2 being convex toward the second main surface 22 in side view.
- the dividing groove 26 has-on opposite sides of the first cylindrical portion 31 and the conductor layers 12 and 15 in side view (vertical cross-sectional view)-extending portions 28 which taper toward the second main surface 22, and a semicircular extending portion 29 on the side (toward the second main surface 22) of the first cylindrical portion 31 and the conductor layers 12 and 15, the semicircular extending portion 29 being convex toward the second main surface 22.
- FIG. 11 is a partial, vertical cross-sectional view of a third multi-piece wiring substrate array 21e according to the present invention, which is shown in a manner similar to that in FIG. 10 .
- the third multi-piece wiring substrate array 21e includes, as in the aforementioned case, a product region 24 having a plurality of wiring substrate units 1n, each of which is to become the aforementioned third wiring substrate 1e; an edge portion 25; and dividing grooves 26. As shown in FIG.
- each of the four dividing grooves 26 surrounding each wiring substrate unit 1n has, at a middle portion thereof, a first cylindrical portion 31 which has a circular shape in plan view, which is open only at the first main surface 23, and which crosses with the dividing groove 26 in a radial direction; and also has a second cylindrical portion (notch) 32 which has a shape similar to that of the first cylindrical portion 31 in plan view, which has a diameter smaller than that of the first cylindrical portion 31, and which penetrates between a center portion of the bottom surface of the first cylindrical portion 31 and the second main surface 22 so as to extend in a thickness direction of the product region 24, the second cylindrical portion 32 concentrically communicating with the first cylindrical portion 31.
- Circular tubular conductor layers 12 and 18 are formed so as to extend on the inner walls of the first and second cylindrical portions 31 and 32, respectively.
- a disk-like conductor layer 15 is sandwiched between the conductor layers 12 and 18.
- the conductor layers 12, 15, and 18 are formed of, for example, W or Mo.
- Each of the conductor layers has a flange portion extending in a radial direction.
- the bottom 27 of the dividing groove 26 crossing with the first cylindrical portion 31 and the conductor layer 12 in a radial direction has first curved portions R1 on opposite sides of the first cylindrical portion 31 and the conductor layer 12, the first curved portions R1 being convex toward the first main surface 23 in side view, and also has third curved portions R3 on opposite sides of the second cylindrical portion 32 and the conductor layer 18 and on the side toward the first cylindrical portion 31, the third curved portions R3 being convex toward the second main surface 22 in side view.
- the dividing groove 26 has on opposite sides of the first cylindrical portion 31 and the conductor layer 12 in side view (vertical cross-sectional view)extending portions 28 which taper toward the second main surface 22, and also has-on opposite sides of the second cylindrical portion 32 and the conductor layer 18 and on the side toward the first main surface 23-quarter-arc-shaped extending portions 30 which are convex toward the second main surface 22.
- the dividing groove 26 having the extending portions 28 and 30 is formed through the below-described laser processing.
- the bottom 27 of the dividing groove 26 which crosses with the first or second cylindrical portion 31 or 32 in a radial direction and which separates the first or second cylindrical portion 31 or 32 into two parts has the symmetrical first curved portions R1 on opposite sides of the first cylindrical portion 31 in a longitudinal direction of the dividing groove 26, the first curved portions R1 being convex toward the first main surface 23 in side view.
- the second curved portion R2, which is convex toward the second main surface 22, is provided on the side (toward the second main surface 22) of the first cylindrical portion 31, or the symmetrical third curved portions R3 are provided on opposite sides of the second cylindrical portion 32.
- Belt-like dividing grooves 26 may also be formed on the second main surface 22 of the multi-piece wiring substrate array 21a or 21e shown in FIG. 10 or 11 so that the dividing grooves are arranged in lattice shape in plan view, to thereby produce a multi-piece wiring substrate array (21b or 21f) having a plurality of wiring substrate units 1n for providing the aforementioned wiring substrate 1b or 1f.
- FIG. 12 is a plan view of a second multi-piece wiring substrate array 21c according to the present invention.
- FIG. 13 is a partial, vertical cross-sectional view of the multi-piece wiring substrate array 21c of FIG. 12 taken along line Y-Y.
- the second multi-piece wiring substrate array 21c includes, as in the aforementioned case, a product region 24 formed of the ceramic layers S, an edge portion 25, and dividing grooves 26 which are formed only on the first main surface 23 so as to be arranged in a lattice shape.
- Each of the wiring substrate units 1n located in the product region 24 is to become the second wiring substrate 1c through separation of the multi-piece wiring substrate array 21c into individual pieces.
- each of the four dividing grooves 26 surrounding each wiring substrate unit 1n has, in the vicinity of a cross point of two adjacent dividing grooves 26, 26, a first cylindrical portion 31 which has a circular shape in plan view, which is open only at the first main surface 23, and which orthogonally crosses with the two dividing grooves 26 in a radial direction.
- the first cylindrical portion 31 has a circular tubular conductor layer 14 extending on the inner wall of the portion 31, and also has a conductor layer 16 (similar to that described above) which is located at the bottom of the cylindrical portion 31. Similar to the aforementioned case, the conductor layers 14 and 16 are formed of, for example, W or Mo.
- the bottom 27 of the two dividing grooves 26 orthogonally crossing with the first cylindrical portion 31 and the conductor layer 14 in a radial direction has first curved portions R1 on opposite sides of the first cylindrical portion 31 and the conductor layer 14, the first curved portions R1 being convex toward the first main surface 23 in side view, and also has a second curved portion R2 on the side (toward the second main surface 22) of the first cylindrical portion 31 and the conductor layers 14 and 16, the second curved portion R2 being convex toward the second main surface 22 in side view.
- the dividing groove 26 has-on opposite sides of the first cylindrical portion 31 and the conductor layer 14 in side view-extending portions 28 which taper toward the second main surface 22, and a semicircular extending portion 29 on the side (toward the second main surface 22) of the first cylindrical portion 31 and the conductor layers 14 and 16, the semicircular extending portion 29 being convex toward the second main surface 22.
- FIG. 14 is a partial, vertical cross-sectional view of a fourth multi-piece wiring substrate array 21g according to the present invention, which is shown in a manner similar to that in FIG. 13 .
- the fourth multi-piece wiring substrate array 21g includes, as in the aforementioned case, a product region 24 having a plurality of wiring substrate units 1n, each of which is to become the aforementioned fourth wiring substrate 1g; an edge portion 25; and dividing grooves 26. As shown in FIG.
- each of the four dividing grooves 26 surrounding each wiring substrate unit 1n has, in the vicinity of a cross point of two adjacent dividing grooves 26, 26, a first cylindrical portion 31 which has a circular shape in plan view, which is open only at the first main surface 23, and which crosses with the two orthogonal dividing grooves 26 in a radial direction; and also has a second cylindrical portion 32 which has a shape similar to that of the first cylindrical portion 31 in plan view, which has a diameter smaller than that of the first cylindrical portion 31, and which penetrates between a center portion of the bottom surface of the first cylindrical portion 31 and the second main surface 22 so as to extend in a thickness direction of the product region 24, the second cylindrical portion 32 concentrically communicating with the first cylindrical portion 31.
- Conductor layers 14 and 20 are formed on the inner walls of the first and second cylindrical portions 31 and 32, respectively, and a conductor layer 16 is sandwiched between the conductor layers 14 and 20. Similar to the aforementioned case, the conductor layers 14, 16, and 20 are formed of, for example, W or Mo.
- the bottom 27 of the dividing groove 26 crossing with the first cylindrical portion 31 and the conductor layer 14 in a radial direction has a pair of symmetrical first curved portions R1 on opposite sides of the first cylindrical portion 31 and the conductor layer 14, the first curved portions R1 being convex toward the first main surface 23 in side view, and also has symmetrical third curved portions R3 on opposite sides of the second cylindrical portion 32 and the conductor layer 20 and on the side toward the first cylindrical portion 31, the third curved portions R3 being convex toward the second main surface 22 in side view.
- the dividing groove 26 has-on opposite sides of the first cylindrical portion 31 and the conductor layer 14 in side view-extending portions 28 which taper toward the second main surface 22, and also has-on opposite sides of the second cylindrical portion 32 and the conductor layer 20 and on the side toward the first main surface 23-quarter-arc-shaped extending portions 30 which are convex toward the second main surface 22.
- the dividing groove 26 having the extending portions 28 and 30 is formed through the below-described laser processing.
- the bottom 27 of the two dividing grooves 26 which orthogonally cross with the first or second cylindrical portion 31 or 32 in a radial direction and which separates the first or second cylindrical portion 31 or 32 into four parts in an axial direction has the symmetrical first curved portions R1 on opposite sides of the first cylindrical portion 31 in a longitudinal direction of the dividing grooves 26, the first curved portions R1 being convex toward the first main surface 23 in side view.
- the second curved portion R2, which is convex toward the second main surface 22, is provided on the side (toward the second main surface 22) of the first cylindrical portion 31, or the symmetrical third curved portions R3 are provided on opposite sides of the second cylindrical portion 32.
- Belt-like dividing grooves 26 may also be formed on the second main surface 22 of the multi-piece wiring substrate array 21c or 21g shown in FIG. 13 or 14 so that the dividing grooves are arranged in lattice shape in plan view, to thereby produce a multi-piece wiring substrate array (21d or 21h) having a plurality of wiring substrate units 1n for providing the aforementioned wiring substrate 1d or 1h.
- a ceramic slurry was prepared in advance by mixing alumina powder with appropriate amounts of a resin binder, a solvent, etc., and a plurality of green sheets (not illustrated) were formed from the ceramic slurry through the doctor blade method.
- penetration holes having different inner diameters were formed at specific positions of the green sheets through punching.
- An electrically conductive paste containing W or Mo powder was filled into a penetration hole of small diameter, to thereby form an unfired via conductor (not illustrated), and the electrically conductive paste was applied to the inner wall of a penetration hole of large diameter under reduced pressure, to thereby form an unfired, circular tubular conductor layer.
- the aforementioned electrically conductive paste was applied through printing to a specific position of at least one of the front surface and back surface of each of the aforementioned green sheets, to thereby form an unfired internal wiring layer or surface wiring layer (not illustrated).
- a portion of the internal wiring layer may also serve as a wiring layer for plating (not illustrated).
- FIG. 15(a) there was produced a green sheet laminate gs having a pair of opposite first and second main surfaces 23 and 22; a bottomed hole 31h opening only at the first main surface 23; a circular tubular conductor layer 12 formed so as to extend on the inner wall of the bottomed hole 31h; and a conductor layer 15 provided at the bottom of the hole 31h.
- the first main surface 23 of the green sheet laminate gs was irradiated with a laser beam L in a thickness direction of the laminate gs, and the laser beam L was continuously scanned along the main surface 23.
- the laser beam L employed was, for example, a UV-YAG laser beam.
- the focal point F of the laser beam L was maintained at a constant depth by means of a lens 34, and the laser beam L was scanned at a constant scan rate (about 100 mm/second).
- irradiation of the laser beam L was carried out under the following conditions (frequency: about 30 to about 100 Hz, repetition number: 2 to 5).
- first curved portions R1 convex toward the first main surface 23 were formed on opposite sides of the conductor layer 12 at the bottom 27 of the dividing groove 26 formed so as to cross with the bottomed hole 31h and the conductor layer 12, and a second curved portion R2 convex toward the second main surface 22 was formed below the bottomed hole 31h and the conductor layer 15.
- the separations grooves 26 were formed on the first main surface 23 of the green sheet laminate gs so as to be arranged in a lattice shape in plan view.
- FIG. 17(a) there was produced a green sheet laminate gs having a pair of opposite first and second main surfaces 23 and 22; a through hole 31h opening at the first main surface 23; a through hole 32h having a smaller diameter and located between the through hole 31h and the second main surface 22, the through hole 32h concentrically communicating with the through hole 31h; conductor layers 12 and 18 provided on the inner walls of the through holes 31h and 32h, respectively; and a conductor layer 15 sandwiched between the conductor layers 12 and 18.
- the first main surface 23 of the green sheet laminate gs was irradiated with the aforementioned laser beam L in a thickness direction of the laminate gs under the same conditions as described above, and the laser beam L was continuously scanned along the main surface 23.
- symmetrical first curved portions R1 convex toward the first main surface 23 were formed on opposite sides of the conductor layer 12 at the bottom 27 of the dividing groove 26 formed so as to cross with the through holes 31h and 32h and the conductor layers 12 and 18, and symmetrical third curved portions R3 convex toward the second main surface 22 were formed on opposite sides of the through hole 32h and the conductor layer 18.
- the separations grooves 26 were formed on the first main surface 23 of the green sheet laminate gs so as to be arranged in a lattice shape in plan view.
- the above-produced ceramic laminate was subjected to Ni electroplating and Au electroplating by immersing the laminate in specific electroplating baths sequentially.
- the inner walls of the conductor layers 12 and 18, etc. were covered with an Ni plating film and an Au plating film, and the end surface (cut surface) of the conductor layer 18, the surface being located above the third curved portions R3 and exposed to the outside, was also covered with an Ni plating film and an Au plating film.
- the multi-piece wiring substrate array 21a and 21c were produced through the above-described steps.
- each of the dividing grooves 26 formed on the main surface 23 of the product region 24 so as to be arranged in a lattice shape has the symmetrical first curved portions R1 located on opposite sides of the conductor layer 12 in side view, and also has the second curved portion R2 or a pair of the symmetrical third curved portions R3.
- the dividing grooves 26 each including the extending portions 28 to 30 can be accurately and reliably formed through laser processing employing the aforementioned laser beam L, a blade having a special shape is not required to be employed. Therefore, production cost can be reduced, and a groove formation step is readily controlled.
- a method for producing a multi-piece wiring substrate array (21c or 21g) in which each wiring substrate unit 1n is to become the aforementioned wiring substrate 1c or 1g including a step of causing two dividing grooves 26 shown in FIGs. 15 to 18 to cross orthogonally with the bottomed hole 31h and the conductor layer 12, or with center portions of the through hole 31h and 32h and the conductor layers 12 and 18.
- a method for producing a multi-piece wiring substrate array (21b, 21d, 21f, or 21h) in which each wiring substrate unit 1n is to become the aforementioned wiring substrate 1b, 1d, 1f, or 1h, the method further including a step of forming the dividing grooves 26 also on the second main surface 22 of the green sheet laminate gs so that they are in line symmetry with respect to those on the first main surface 23.
- the ceramic layers S of the aforementioned wiring substrate or multi-piece wiring substrate array may be formed of a high-temperature fired ceramic material other than alumina (e.g., aluminum nitride or mullite), or may be formed of a low-temperature fired ceramic material such as glass-ceramic material.
- the aforementioned conductor e.g., the conductor layer 12 or 18 is formed of Cu or Ag.
- the aforementioned substrate main body or wiring substrate unit may have a rectangular shape in plan view.
- the aforementioned substrate main body kp or wiring substrate unit 1n may be in such a form that it has a cavity which is open on the second main surface (front surface) 2 or 22 and which has a bottom surface and side surfaces.
- the laser processing may be appropriately carried out so that the laser irradiation conditions for the inside of the bottomed or through hole 31h, etc. differ from those for the main surface 23 of the green sheet laminate gs.
- the aforementioned multi-piece wiring substrate array production method may be continuously followed by a step of separating the wiring substrate array into individual wiring substrates.
- a wiring substrate exhibiting excellent form and dimensional accuracy and having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed, as well as a multi-piece wiring substrate array for providing a plurality of the wiring substrates.
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Description
- The present invention relates to a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; to a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and to a method for producing the multi-piece wiring substrate array.
- Generally, ceramic wiring substrates are produced by separating a multi-piece ceramic wiring substrate array into individual pieces along dividing grooves provided on the front surface or back surface of the wiring substrate array. In connection therewith, there has been proposed a method for producing a multi-piece wiring substrate array, in which a blade having a specific edge angle is pressed against a green sheet laminate at positions where dividing grooves are to be formed, so that chips or burrs are less likely to be generated at a metal layer, etc. located in the vicinity of the thus-formed dividing grooves during separation of the substrate array (see, for example, Patent Document 1).
- However, when dividing grooves are formed in a green sheet by means of a blade through the production method described in Patent Document 1, since a fracture surface (cracking) meanders at the inner wall of a through hole or bottomed hole which is to become a notch and which crosses with the thus-formed dividing grooves in a radial direction of the hole, burrs or cracks are likely to be generated. In addition, since the depth of a dividing groove formed by means of the aforementioned blade must be smaller than that of the position of a plating wire for connecting the internal wirings of two adjacent wiring substrate units, the dividing groove must be formed to be shallower than the bottom of a bottomed hole or shallower than a stepped portion of a through hole having two concentric portions of different inner diameters, which results in easy generation of burrs, etc.
- Also, when a metal conductor layer is formed on the inner wall of the through hole, burrs are likely to be generated through breakage of the metal layer, and a cut surface of the non-plated conductor layer is exposed after separation of the substrate array. Therefore, the conductor layer may exhibit poor reliability during soldering for mounting of a component on the conductor layer.
- Meanwhile, there has been proposed a multi-piece wiring substrate array, in which a dividing groove having different, discontinuous depths is formed by means of a special blade having a single base and different edge heights (widths), so as to prevent burrs or cracks, which would otherwise be generated in association with a meandering fracture surface (cracking) at the inner wall of a through hole in a green sheet (see, for example, Patent Document 2).
- However, in the case of the multi-piece wiring substrate array described in
Patent Document 2, every time a through-hole-forming position is changed to any position which crosses with a dividing groove, there must be provided a number of special blades having different edge heights (widths) and lengths corresponding to both a portion in the vicinity of the surface of a green sheet and a portion in the vicinity of a through hole. Thus, the multi-piece wiring substrate array poses a problem in that various types of special blades are required, which results in considerably high production cost and low productivity. -
- Patent Document 1: Japanese Patent Application Laid-Open (kokai) No.
2009-218319 FIGs. 1 to 8 ) - Patent Document 2: Japanese Patent Application Laid-Open (kokai) No.
2009-266992 FIGs. 1 to 8 ) - An object of the present invention is to solve problems described in the Background Art section, and to provide a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed. Another object of the present invention is to provide a multi-piece wiring substrate array for providing a plurality of the wiring substrates. Yet another object of the present invention is to provide a method for reliably producing the multi-piece wiring substrate array.
-
EP-A1-2315508 discloses a ceramic substrate and manufacturing method for the substrate on which the precharacterising portions of the independent claims are based. -
JP-A-807-192961 -
EP-A2-0871220 discloses a ceramic substrate which includes four generally quadrant-like indentations at corners of the substrate with conductive members applied to the inner surface of the indentations to form input and output terminals. - In order to solve the aforementioned problems, the present invention has been achieved on the basis of the idea that a dividing groove of a green sheet is formed such that the depth of the dividing groove at a position where it crosses with a through hole or a bottomed hole of the green sheet-the hole to become a notch located on a side surface of each wiring substrate-is greater than that of the dividing groove at a position where it does not cross with the through hole or the bottomed hole.
- Accordingly, the present invention provides a wiring substrate as defined by claims 1 to 7.
- As used herein, a first main surface and a second main surface of the paired main surfaces are described relative to each other. For example, when the first main surface is the back surface of the substrate main body, the second main surface is the front surface of the substrate main body.
- Examples of the ceramic material include high-temperature fired ceramic materials such as alumina, mullite, and aluminum nitride; and low-temperature fired ceramic materials such as glass-ceramic material.
- The aforementioned groove surface corresponds to one of the inner wall surfaces of a dividing groove exposed on each side surface of an individual wiring substrate, the wiring substrate being produced by separating a multi-piece wiring substrate array into individual pieces along dividing grooves (each having a V-shaped cross section) formed, through laser processing, on a main surface of the below-described green sheet laminate which is to become the multi-piece wiring substrate array.
- Preferably, the groove surface has a width (depth in a thickness direction) which is 50% or less of the width (in a thickness direction) of the corresponding side surface of the substrate main body. In this case, there can be readily prevented breakage of a plating wire for connecting the internal wirings of adjacent wiring substrate units of the below-described multi-piece wiring substrate array, which breakage would otherwise occur through formation of a dividing groove between the wiring substrate units. Thus, an end surface of the plating wire formed on a wiring substrate is exposed on the first-main-surface-side fracture surface of a side surface at a position shallower than the deepest portion of a notch provided on the side surface.
- The aforementioned notch may be formed on all the four side surfaces of the wiring substrate, or may be formed only on one, two, or three side surfaces of the wiring substrate.
- The below-described conductor layer is formed at least on the inner wall of the notch, and the conductor layer serves as an external connection terminal for achieving electrical conduction between the internal wiring of the wiring substrate and an external component.
- The present invention also encompasses a wiring substrate wherein each side surface also has a groove surface located on a side toward the second main surface, and the fracture surface is located between the first-main-surface-side groove surface and the second-main-surface-side groove surface.
- The second-main-surface-side groove surface may have a belt-like shape and may extend in a longitudinal direction of the side surface. Alternatively, as in the aforementioned case, the second-main-surface-side groove surface may have curved portions (i.e., extending portions) on opposite sides of the second notch or the fourth notch.
- The present invention also encompasses a wiring substrate wherein a conductor layer is formed so as to extend on the inner wall of the notch or each of the first to fourth notches.
- The present invention also provides a multi-piece wiring substrate array as defined by
claim 8. - The present invention also encompasses a multi-piece wiring substrate array which further comprises second cylindrical portions each having a shape similar to that of the first cylindrical portion in plan view, having a cross-sectional area smaller than that of the first cylindrical portion, and penetrating between a center portion of a bottom surface of the first cylindrical portion and the second main surface so as to extend in a thickness direction of the product region, wherein one or each of two dividing grooves crossing with the corresponding first and second cylindrical portions in a radial direction has a bottom which has third curved portions on opposite sides of the second cylindrical portion, the third curved portions being convex toward the first main surface in side view.
- The present invention also encompasses a multi-piece wiring substrate array wherein a conductor layer is formed so as to extend on the inner wall of the first cylindrical portion, or on both the inner walls of the first and second cylindrical portions.
- The present invention also provides a method for producing a multi-piece wiring substrate array as defined by
claim 11. - In the aforementioned multi-piece wiring substrate array production method, through holes, etc. are formed in a green sheet laminate through the following procedure: penetration holes are formed in each of a plurality of green sheets, and subsequently the green sheets are stacked so that the penetration holes communicate with one another.
- In the aforementioned multi-piece wiring substrate array production method, the laser processing is carried out so that the focal point of the laser beam for forming the dividing grooves is maintained at a generally constant depth in a thickness direction of the green sheet laminate (including the inside of the through holes, etc.).
- There may also be provided a step of forming a conductor layer on the inner wall of each of the penetration holes of the green sheets, so that a circular tubular conductor layer is formed on the inner wall of the bottomed hole or through hole of the green sheet laminate, and that the conductor layer crosses with the corresponding dividing groove.
- According to a first wiring substrate of the invention, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch in a longitudinal direction of the side surface, the first curved portions being convex toward the first main surface of the substrate main body in side view, and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view. In addition, the notch is surrounded by a pair of the first curved portions located on the opposite sides in the side surface, and the second curved portion located between the deepest portion of the notch and a second-main-surface-side portion of the side surface. Furthermore, these two types of curved portions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion being defined by a partition line and extending toward the second-main-surface side of the side surface. Therefore, generation of ceramic burrs or cracks is suppressed in the vicinity of the notch located on the first-main-surface side of the side surface, and also breakage of the conductor layer provided on the inner wall of the notch is suppressed. Thus, the wiring substrate exhibits excellent form and dimensional accuracy.
- According to a second wiring substrate of the invention, the notch is surrounded by the first curved portions located on a pair of side surfaces, and the third curved portion located between the deepest portion of the notch and a second-main-surface-side portion of each side surface. These two types of curved portions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surface. Therefore, generation of burrs or cracks is suppressed in the vicinity of the notch located at the corner portion formed by the paired side surfaces and on the first-main-surface side of the side surfaces, and also breakage of the conductor layer provided on the inner wall of the notch is suppressed. Thus, the wiring substrate exhibits excellent form and dimensional accuracy.
- According to a third wiring substrate of the invention, the first notch is sandwiched between a pair of the first curved portions located on the opposite sides of the side surface in a longitudinal direction; the second notch is sandwiched between a pair of the third curved portions located on the opposite sides of the side surface in a longitudinal direction; and the paired third curved portions are respectively adjacent to a pair of the deepest portions of the first notch (exclusive of the second notch). In addition, these two types of curved portions located at the aforementioned four positions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surface. Therefore, generation of burrs or cracks is suppressed in the vicinity of the first notch located on the first-main-surface side of the side surface, and in the vicinity of the second notch located adjacent to the first notch. Also, breakage of the conductor layer provided on the inner wall of the first or second notch is suppressed. Thus, the wiring substrate exhibits excellent form and dimensional accuracy.
- According to a fourth wiring substrate of the invention, the third notch is sandwiched between a pair of the first curved portions located on the opposite sides of the paired side surfaces in a longitudinal direction; the fourth notch is sandwiched between a pair of the third curved portions located on the opposite sides of the paired side surfaces in a longitudinal direction; and the paired third curved portions are respectively adjacent to a pair of the deepest portions of the third notch (exclusive of the fourth notch) of the paired side surfaces. In addition, these two types of curved portions located at the aforementioned four positions correspond to a portion of the groove surface, which is smoother than the fracture surface, the portion extending toward the second-main-surface side of the side surfaces. Therefore, generation of burrs or cracks is suppressed in the vicinity of the third notch located on the first-main-surface side of the side surfaces, and in the vicinity of the fourth notch located adjacent to the third notch. Also, breakage of the conductor layer provided on the inner wall of the third or fourth notch is suppressed. Thus, the wiring substrate exhibits excellent form and dimensional accuracy.
- According to the wiring substrate of
claim 6, a second-main-surface-side groove surface is formed in addition to the groove surface which is provided on the first-main-surface side of the side surface and which includes any of the first to fourth curved portions (i.e., extending portion), and these groove surfaces are parallel to each other. That is, the fracture surface is formed only at a position sandwiched between the paired groove surfaces. Therefore, generation of burrs, etc. is suppressed in the vicinity of any of the first to fourth notches, and also breakage of the conductor layer provided on the inner wall of any of the first to fourth notches is further suppressed. Thus, the wiring substrate exhibits further excellent form and dimensional accuracy. - According to the wiring substrate of claim 7, electrical conduction can be reliably achieved between the connection terminal of a motherboard (e.g., a printed wiring board) and the internal wiring formed on any of a plurality of ceramic layers forming the substrate main body, as well as between the connection terminal and the surface wiring formed on the second main surface (front surface), via the conductor layer formed so as to extend on the inner wall of each of the first to fourth notches. In addition, a metal (e.g., Ni or Au) plating film is reliably formed to cover an end surface of the conductor layer formed on the inner wall of each notch, the end surface (i.e., cut surface before separation of the substrate array) being exposed on the groove surface. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely.
- According to the multi-piece wiring substrate array of
claim 8, the bottom of one dividing groove which crosses with the first cylindrical portion in a radial direction and which separates the first cylindrical portion into two parts, or the bottoms of two dividing grooves which orthogonally cross each other at the first cylindrical portion and which separate the first cylindrical portion into four parts have symmetrical first curved portions on opposite sides of the first cylindrical portion in a longitudinal direction of the dividing groove(s), the first curved portions being convex toward the first main surface in side view. In addition, a second curved portion, which is convex toward the second main surface, is provided on a second-main-surface side of the first cylindrical portion. Therefore, when the product region is separated into individual wiring substrate units along the dividing grooves, ceramic burrs or cracks are less likely to be generated in the vicinity of a notch which is formed through separation of the first cylindrical portion into two parts, and which has a concave shape in plan view, or in the vicinity of a notch which is formed through separation of the first cylindrical portion into four parts, and which has a quarter arc shape in plan view. Thus, a plurality of ceramic wiring substrates exhibiting excellent form and dimensional accuracy can be reliably produced from the wiring substrate array. - According to the multi-piece wiring substrate array of
claim 9, the bottom of a dividing groove which separates the first and second cylindrical portions into two or four parts in an axial direction has symmetrical first curved portions on opposite sides of the first cylindrical portion in a longitudinal direction of the dividing groove, the first curved portions being convex toward the first main surface in side view, and also has symmetrical third curved portions on opposite sides of the second cylindrical portion in a longitudinal direction of the dividing groove, the third curved portions being convex toward the first main surface in side view. Therefore, when the product region is separated into individual wiring substrate units along the dividing grooves, ceramic burrs or cracks are less likely to be generated in the vicinity of first and second notches or third and fourth notches formed through separation of the first and second cylindrical portions into two or four parts. Thus, a plurality of wiring substrates exhibiting excellent form and dimensional accuracy can be reliably produced from the wiring substrate array. - According to the multi-piece wiring substrate array of
claim 10, when the product region is separated into individual wiring substrate units along the dividing grooves, ceramic burrs are less likely to be generated, and breakage of a conductor layer is suppressed in the vicinity of first and second notches or third and fourth notches formed through separation of the first and second cylindrical portions into two or four parts. In addition, a plating film (e.g., Ni or Au plating film) is formed to completely or almost completely cover an end surface of the conductor layer exposed in each dividing groove. Therefore, when the product region is separated into individual wiring substrate units, there can be reliably produced a plurality of wiring substrates each exhibiting excellent electrical conduction to an external component (e.g., a motherboard) and excellent brazing property during mounting thereof on the component. - According to the multi-piece wiring substrate array production method of
claim 11, the green sheet laminate is continuously irradiated with a laser beam so that the laser beam is scanned at least on the first main surface of the laminate so as to cross with the bottomed hole or the through hole in a radial direction. Therefore, the bottom of each of lattice-shape dividing grooves formed on the first main surface has, on opposite sides of the bottomed hole or the through hole, etc., first curved portions which are convex toward the first main surface, and a second or third curved portion which is convex toward the second main surface. Thus, the production method can reliably produce a multi-piece wiring substrate array for providing a plurality of wiring substrates exhibiting excellent form and dimensional accuracy. -
- [
FIG. 1 ]
FIG. 1 is a perspective view of a first wiring substrate according to the present invention, as viewed from obliquely downward. - [
FIG. 2 ]
FIG. 2 is a perspective view of a second wiring substrate according to the present invention, as viewed from obliquely downward. - [
FIG. 3 ]
FIG. 3 is a perspective view of a third wiring substrate according to the present invention, as viewed from obliquely downward. - [
FIG. 4 ]
FIG. 4 is a perspective view of a fourth wiring substrate according to the present invention, as viewed from obliquely downward. - [
FIG. 5 ]
FIG. 5 is a side view of a wiring substrate, which is an applied embodiment of the first wiring substrate. - [
FIG. 6 ]
FIG. 6 is a side view of a wiring substrate, which is an applied embodiment of the second wiring substrate. - [
FIG. 7 ]
FIG. 7 is a side view of a wiring substrate, which is an applied embodiment of the third wiring substrate. - [
FIG. 8 ]
FIG. 8 is a side view of a wiring substrate, which is an applied embodiment of the fourth wiring substrate. - [
FIG. 9 ]
FIG. 9 is a plan view of a first multi-piece wiring substrate array according to the present invention. - [
FIG. 10 ]
FIG. 10 is a partially enlarged cross-sectional view of the multi-piece wiring substrate array ofFIG. 9 taken along line X-X. - [
FIG. 11 ]
FIG. 11 is a partially enlarged cross-sectional view of a third multi-piece wiring substrate array, which is shown in a manner similar to that inFIG. 10 . - [
FIG. 12 ]
FIG. 12 is a plan view of a second multi-piece wiring substrate array according to the present invention. - [
FIG. 13 ]
FIG. 13 is a partially enlarged cross-sectional view of the multi-piece wiring substrate array ofFIG. 12 taken along line Y-Y. - [
FIG. 14 ]
FIG. 14 is a partially enlarged cross-sectional view of a fourth multi-piece wiring substrate array, which is shown in a manner similar to that inFIG. 13 . - [
FIG. 15 ]
FIG. 15 schematically shows a step of producing the first multi-piece wiring substrate array. - [
FIG. 16 ]
FIG. 16 schematically shows a production step subsequent to the step shown inFIG. 15 . - [
FIG. 17 ]
FIG. 17 schematically shows a step of producing the second multi-piece wiring substrate array. - [
FIG. 18 ]
FIG. 18 schematically shows a production step subsequent to the step shown inFIG. 17 . - Embodiments of the present invention will next be described.
-
FIG. 1 is a perspective view of a first wiring substrate 1a according to the present invention, as viewed from obliquely downward. - As shown in
FIG. 1 , the first wiring substrate 1a includes a substrate main body kp which is formed of a plurality of ceramic layers S (not illustrated), and which has a rectangular (or square) shape in plan view. The substrate main body kp has a pair of opposite first and secondmain surfaces side surfaces 4 each being located between the pairedmain surfaces side surface 4 has anotch 11 formed only on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of theside surface 4, thenotch 11 having a concave (semicircular) shape in plan view, and also has aconductor layer 12 formed so as to extend on the inner wall of thenotch 11. - Each
side surface 4 has agroove surface 6 located on the side toward the first main surface (back surface) 3 and a fracture surface 5 (of the aforementioned ceramic layers S) located between thegroove surface 6 and the second main surface (front surface) 2. Thegroove surface 6 corresponds to one of the inner wall surfaces of a dividing groove formed in the below-described multi-piece wiring substrate array, and is smoother than thefracture surface 5 of the ceramic layers S. - The
conductor layer 12 also has, on the ceiling surface of thenotch 11, aconductor layer 15 having a semicircular shape in plan view. Theconductor layer 15 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S. - The ceramic layers S are formed of a high-temperature fired ceramic material such as alumina or mullite, or a low-temperature fired ceramic material such as glass-ceramic material. When the ceramic layers S are formed of a high-temperature fired ceramic material, the conductor layers 12 and 15 are formed of W or Mo, whereas when the ceramic layers S are formed of a low-temperature fired ceramic material, the conductor layers 12 and 15 are formed of Cu or Ag. Generally, the first
main surface 3 is the back surface of the substrate main body kp, and the secondmain surface 2 is the front surface of the substrate main body kp. The first main surface and the second main surface are described relative to each other. - As shown in
FIG. 1 , in eachside surface 4, the boundary 7 between thegroove surface 6 and thefracture surface 5 has first curved portions R1 on opposite sides of thenotch 11 and theconductor layer 12, the first curved portions R1 being symmetric with each other and convex toward the firstmain surface 3 in side view, and also has a second curved portion R2 on the side (toward the second main surface 2) of thenotch 11 and the conductor layers 12 and 15, the second curved portion R2 being convex toward the secondmain surface 2 in side view. Specifically, as shown inFIG. 1 , thegroove surface 6 of eachside surface 4 has, on opposite sides of thenotch 11 and theconductor layer 12 in side view, a pair of extendingportions 8 which taper toward the secondmain surface 2, and a semicircular extendingportion 9 on the side (toward the second main surface 2) of thenotch 11 and the conductor layers 12 and 15, the semicircular extendingportion 9 being convex toward the secondmain surface 2. The extendingportions -
FIG. 2 is a perspective view of asecond wiring substrate 1c according to the present invention, as viewed from obliquely downward. - As shown in
FIG. 2 , thesecond wiring substrate 1c includes a substrate main body kp having first and secondmain surfaces side surfaces 4 as in the aforementioned case; anotch 13 having a quarter arc shape in plan view; and aconductor layer 14 similar to that described above. Thenotch 13 is provided at the corner portion formed byadjacent side surfaces conductor layer 14 is formed so as to extend on the inner wall of thenotch 13. Theconductor layer 14 also has, on the ceiling surface of thenotch 13, aconductor layer 16 having a quarter arc shape in plan view. Theconductor layer 16 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S. - As shown in
FIG. 2 , in the pairedside surfaces notch 13 and theconductor layer 14, the boundary 7 between thegroove surface 6 and thefracture surface 5 has first curved portions R1 on opposite sides of thenotch 13 and theconductor layer 14, the first curved portions R1 being symmetric with each other and convex toward the firstmain surface 3 in side view, and also has third curved portions R3 on the side (toward the second main surface 2) of thenotch 13 and theconductor layer 14, the third curved portions R3 being symmetric with each other and convex toward the secondmain surface 2 in side view. - Specifically, as shown in
FIG. 2 , thegroove surface 6 of eachside surface 4 has, on opposite sides of thenotch 13 and theconductor layer 14 in side view, extendingportions 8 which are adjacent to thenotch 13 and theconductor layer 14 and which taper toward the secondmain surface 2, and also has a quarter-arc-shaped extendingportion 10 on the side (toward the second main surface 2) of thenotch 13 and theconductor layer 14. The extendingportions - According to the aforementioned first or
second wiring substrate 1a or 1c, burrs or cracks are less likely to be generated in the ceramic layers S in the vicinity of thenotch side surface 4, and breakage of theconductor layer notch wiring substrate 1a or 1c exhibits excellent form and dimensional accuracy. - Electrical conduction can be reliably achieved between the connection terminal of a non-illustrated motherboard (e.g., a printed wiring board) and the internal wiring (not illustrated) formed on any of the ceramic layers S forming the substrate main body kp, as well as between the connection terminal and the surface wiring (not illustrated) formed on the second
main surface 2, via theaforementioned conductor layer conductor layer groove surface 6. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely. Furthermore, since the width of the groove surface 6 (exclusive of a portion in the vicinity of thenotch 11 or 13) is small; i.e., the width is about 20 to about 30% (50% or less) of the width of eachside surface 4 as measured in a thickness direction, a plating wire for achieving electrical conduction between adjacent wiring substrate units of the multi-piece wiring substrate array can be located at a position of thefracture surface 5 in the vicinity of the boundary 7. - The
notch conductor layer adjacent side surfaces -
FIG. 3 is a perspective view of a third wiring substrate 1e according to the present invention, as viewed from obliquely downward. - As shown in
FIG. 3 , the third wiring substrate 1e includes a substrate main body kp having first and secondmain surfaces side surfaces 4 as in the aforementioned case; afirst notch 11 which has a concave shape in plan view, and which is formed on eachside surface 4 on the side toward the first main surface (back surface) 3 so as to extend in a thickness direction of theside surface 4; asecond notch 17 which has a concave shape in plan view as in the aforementioned case and has a smaller cross-sectional area, and which penetrates between a center portion of the ceiling surface (bottom surface) of thefirst notch 11 and the second main surface (front surface) 2; and conductor layers 12 and 18 which are respectively formed so as to extend on the inner walls of the first andsecond notches conductor layer 15 having a semi-ring shape in bottom view is formed on the ceiling surface of thefirst notch 11 for connecting the conductor layers 12 and 18. Theconductor layer 15 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S. - As shown in
FIG. 3 , in eachside surface 4, the boundary 7 between thegroove surface 6 and thefracture surface 5 has first curved portions R1 on opposite sides of thefirst notch 11 and theconductor layer 12, the first curved portions R1 being symmetric with each other and convex toward the firstmain surface 3 in side view, and also has third curved portions R3 on opposite sides of thesecond notch 17 and theconductor layer 18, the third curved portions R3 being symmetric with each other and convex toward the secondmain surface 2 of the substrate main body kp in side view. Specifically, as shown inFIG. 3 , thegroove surface 6 of eachside surface 4 has, on opposite sides of thefirst notch 11 and theconductor layer 12 in side view, a pair of extendingportions 8 which taper toward the secondmain surface 2, and also has quarter-arc-shaped extendingportions 10 on opposite sides of thesecond notch 17 and theconductor layer 18, theportions 10 extending toward thefirst notch 11. The extendingportions portions 10 include horn-like portions extending along theconductor layer 18 toward the secondmain surface 2. -
FIG. 4 is a perspective view of afourth wiring substrate 1g according to the present invention, as viewed from obliquely downward. - As shown in
FIG. 4 , thefourth wiring substrate 1g includes a substrate main body kp having first and secondmain surfaces side surfaces 4 as in the aforementioned case; athird notch 13 which has a quarter arc shape in plan view, and which is provided at the corner portion formed byadjacent side surfaces fourth notch 19 which has a quarter arc shape in plan view as in the aforementioned case and has a smaller cross-sectional area, and which penetrates between a center portion of the ceiling surface (bottom surface) of thethird notch 13 and the second main surface (front surface) 2; and conductor layers 14 and 20 which are respectively formed so as to extend on the inner walls of the third andfourth notches conductor layer 16 having a fan-like shape in bottom view is formed on the ceiling surface of thethird notch 13 for connecting the conductor layers 14 and 20. Theconductor layer 16 has a flange portion f which is provided along the outer periphery thereof, and which extends between the aforementioned ceramic layers S. - As shown in
FIG. 4 , in the pairedside surfaces third notch 13 and theconductor layer 14, the boundary 7 between thegroove surface 6 and thefracture surface 5 has first curved portions R1 on opposite sides of thenotch 13 and theconductor layer 14, the first curved portions R1 being symmetric with each other and convex toward the firstmain surface 3 in side view, and also has third curved portions R3 on opposite sides (toward the third notch 13) of thefourth notch 19 and theconductor layer 20, the third curved portions R3 being symmetric with each other and convex toward the secondmain surface 2 in side view. Specifically, as shown inFIG. 4 , thegroove surface 6 of eachside surface 4 has, on opposite sides of thethird notch 13 and theconductor layer 14 in side view, extendingportions 8 which are adjacent to thethird notch 13 and theconductor layer 14 and which taper toward the secondmain surface 2, and also has quarter-arc-shaped extendingportions 10 on opposite sides of thefourth notch 19 and theconductor layer 20, theportions 10 extending toward thethird notch 13. The extendingportions portions 10 include horn-like portions extending along theconductor layer 20 toward the secondmain surface 2. - According to the aforementioned third or
fourth wiring substrate 1e or 1g, burrs or cracks are less likely to be generated in the ceramic layers S in the vicinity of any of the first tofourth notches side surface 4, and breakage of theconductor layer notch wiring substrate 1e or 1g exhibits excellent form and dimensional accuracy. - Electrical conduction can be reliably achieved between the connection terminal of a non-illustrated motherboard (e.g., a printed wiring board) and the internal wiring formed on any of the ceramic layers S forming the substrate main body kp, as well as between the connection terminal and the surface wiring (not illustrated) formed on the second
main surface 2, via theaforementioned conductor layer conductor layer groove surface 6. Therefore, brazing during mounting of the wiring substrate on the motherboard can be carried out readily and securely. Furthermore, since the width of the groove surface 6 (exclusive of a portion in the vicinity of thenotch side surface 4 as measured in a thickness direction, a plating wire for achieving electrical conduction between adjacent wiring substrate units of the multi-piece wiring substrate array can be readily located at any position of thefracture surface 5. - The
notch conductor layer adjacent side surfaces -
FIG. 5 is a side view of awiring substrate 1b, which is an applied embodiment of the first wiring substrate 1a. As shown inFIG. 5 , thewiring substrate 1b includes a substrate main body kp as in the aforementioned case, and eachside surface 4 of the substrate main body kp has a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the secondmain surface 2, in addition to agroove surface 6 on the side toward the first main surface (back surface) 3 on which anotch 11 and aconductor layer 12 are formed. Thus, in eachside surface 4 of thewiring substrate 1b, afracture surface 5 is sandwiched between the pairedgroove surfaces groove surfaces side surface 4 as measured in a thickness direction of the substrate main body kp. -
FIG. 6 is a side view of awiring substrate 1d, which is an applied embodiment of thesecond wiring substrate 1c. As shown inFIG. 6 , thewiring substrate 1d includes a substrate main body kp as in the aforementioned case, and eachside surface 4 of the substrate main body kp has, at the corner portion formed byadjacent side surfaces like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the secondmain surface 2, in addition to agroove surface 6 on the side toward the first main surface (back surface) 3 on which anotch 13 and aconductor layer 14 are formed. Thus, in eachside surface 4 of thewiring substrate 1d, a belt-like fracture surface 5 is sandwiched between the pairedgroove surfaces -
FIG. 7 is a side view of awiring substrate 1f, which is an applied embodiment of the third wiring substrate 1e. As shown inFIG. 7 , thewiring substrate 1f includes a substrate main body kp as in the aforementioned case, and eachside surface 4 of the substrate main body kp has a belt-like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the secondmain surface 2, in addition to agroove surface 6 on the side toward the first main surface (back surface) 3 on which afirst notch 11 and aconductor layer 12 are formed. Thus, in eachside surface 4 of thewiring substrate 1f, a belt-like fracture surface 5 is sandwiched between the pairedgroove surfaces groove surface 6 on the side toward the secondmain surface 2 has extending portions which are provided on opposite sides of asecond notch 17 and aconductor layer 18, and which taper toward thenotch 17 and thelayer 18. -
FIG. 8 is a side view of awiring substrate 1h, which is an applied embodiment of thefourth wiring substrate 1g. As shown inFIG. 8 , thewiring substrate 1h includes a substrate main body kp as in the aforementioned case, and eachside surface 4 of the substrate main body kp has, at the corner portion formed byadjacent side surfaces like groove surface 6 which extends along the second main surface (front surface) 2 on the side toward the secondmain surface 2, in addition to agroove surface 6 on the side toward the first main surface (back surface) 3 on which anotch 13 and aconductor layer 14 are formed. Thus, in eachside surface 4 of thewiring substrate 1h, a belt-like fracture surface 5 is sandwiched between the pairedgroove surfaces groove surface 6 on the side toward the secondmain surface 2 has extending portions which are provided on opposite sides of afourth notch 19 and aconductor layer 20, and which taper toward thenotch 19 and thelayer 20. - The
aforementioned wiring substrate wiring substrate -
FIG. 9 is a plan view of a first multi-piecewiring substrate array 21a according to the present invention.FIG. 10 is a partial, vertical cross-sectional view of the multi-piecewiring substrate array 21a ofFIG. 9 taken along line X-X. - As shown in
FIGs. 9 and 10 , the multi-piecewiring substrate array 21a includes aproduct region 24 having a plurality ofwiring substrate units 1n which are adjacently arranged in a matrix form, each unit being formed of a plurality of stacked ceramic layers S (not illustrated) as in the aforementioned case, and having a pair of first and secondmain surfaces edge portion 25 which is formed of the ceramic layers S, which is located around theproduct region 24, and which has a pair of first and secondmain surfaces grooves 26 which are formed on the firstmain surface 23 and are arranged in a lattice shape in plan view, and which are provided between adjacentwiring substrate units product region 24 and theedge portion 25. Each of the dividinggrooves 26 has a V-shaped cross section, and is formed through the below-described laser processing. - The paired
main surfaces wiring substrate units 1n, theproduct region 24, and theedge portion 25. The firstmain surface 23 is to become the first main surface (back surface) 3 of the wiring substrate 1a, and the secondmain surface 22 is to become the second main surface (front surface) 2 of the wiring substrate 1a. One of the inner wall surfaces of each dividinggroove 26 is to become thegroove surface 6 of eachside surface 4 of the wiring substrate 1a. Each of thewiring substrate units 1n is to become the first wiring substrate 1a through separation of the multi-piecewiring substrate array 21a into individual pieces. - As shown in
FIGs. 9 and 10 , each of the four dividinggrooves 26 surrounding eachwiring substrate unit 1n has, at a middle portion thereof, a first cylindrical portion (notch: bottomed hole) 31 which has a circular shape in plan view, which is open only at the firstmain surface 23, and which crosses with the dividinggroove 26 in a radial direction. The firstcylindrical portion 31 has a circulartubular conductor layer 12 extending on the inner wall of theportion 31, and also has a disk-like conductor layer 15 which is located at the bottom of theportion 31 and is connected to theconductor layer 12. Theconductor layer 12 has a ring-like flange portion extending on the firstmain surface 23, and theconductor layer 15 has a flange portion extending between the ceramic layers (S) toward the outer periphery thereof. Similar to the aforementioned case, the conductor layers 12 and 15 are formed of, for example, W or Mo. - As shown in
FIG. 10 , the bottom 27 of the dividinggroove 26 crossing with the firstcylindrical portion 31 and the conductor layers 12 and 15 in a radial direction has first curved portions R1 on opposite sides of the firstcylindrical portion 31 and the conductor layers 12 and 15, the first curved portions R1 being convex toward the firstmain surface 23 in side view, and also has a second curved portion R2 on the side (toward the second main surface 22) of the firstcylindrical portion 31 and the conductor layers 12 and 15, the second curved portion R2 being convex toward the secondmain surface 22 in side view. - Specifically, the dividing
groove 26 has-on opposite sides of the firstcylindrical portion 31 and the conductor layers 12 and 15 in side view (vertical cross-sectional view)-extendingportions 28 which taper toward the secondmain surface 22, and a semicircular extendingportion 29 on the side (toward the second main surface 22) of the firstcylindrical portion 31 and the conductor layers 12 and 15, the semicircular extendingportion 29 being convex toward the secondmain surface 22. -
FIG. 11 is a partial, vertical cross-sectional view of a third multi-piecewiring substrate array 21e according to the present invention, which is shown in a manner similar to that inFIG. 10 . - The third multi-piece
wiring substrate array 21e includes, as in the aforementioned case, aproduct region 24 having a plurality ofwiring substrate units 1n, each of which is to become the aforementioned third wiring substrate 1e; anedge portion 25; and dividinggrooves 26. As shown inFIG. 11 , each of the four dividinggrooves 26 surrounding eachwiring substrate unit 1n has, at a middle portion thereof, a firstcylindrical portion 31 which has a circular shape in plan view, which is open only at the firstmain surface 23, and which crosses with the dividinggroove 26 in a radial direction; and also has a second cylindrical portion (notch) 32 which has a shape similar to that of the firstcylindrical portion 31 in plan view, which has a diameter smaller than that of the firstcylindrical portion 31, and which penetrates between a center portion of the bottom surface of the firstcylindrical portion 31 and the secondmain surface 22 so as to extend in a thickness direction of theproduct region 24, the secondcylindrical portion 32 concentrically communicating with the firstcylindrical portion 31. Circular tubular conductor layers 12 and 18 are formed so as to extend on the inner walls of the first and secondcylindrical portions like conductor layer 15 is sandwiched between the conductor layers 12 and 18. - Similar to the aforementioned case, the conductor layers 12, 15, and 18 are formed of, for example, W or Mo. Each of the conductor layers has a flange portion extending in a radial direction.
- As shown in
FIG. 11 , the bottom 27 of the dividinggroove 26 crossing with the firstcylindrical portion 31 and theconductor layer 12 in a radial direction has first curved portions R1 on opposite sides of the firstcylindrical portion 31 and theconductor layer 12, the first curved portions R1 being convex toward the firstmain surface 23 in side view, and also has third curved portions R3 on opposite sides of the secondcylindrical portion 32 and theconductor layer 18 and on the side toward the firstcylindrical portion 31, the third curved portions R3 being convex toward the secondmain surface 22 in side view. Specifically, the dividinggroove 26 has on opposite sides of the firstcylindrical portion 31 and theconductor layer 12 in side view (vertical cross-sectional view)extendingportions 28 which taper toward the secondmain surface 22, and also has-on opposite sides of the secondcylindrical portion 32 and theconductor layer 18 and on the side toward the first main surface 23-quarter-arc-shaped extendingportions 30 which are convex toward the secondmain surface 22. The dividinggroove 26 having the extendingportions - According to the first or third multi-piece
wiring substrate array groove 26 which crosses with the first or secondcylindrical portion cylindrical portion cylindrical portion 31 in a longitudinal direction of the dividinggroove 26, the first curved portions R1 being convex toward the firstmain surface 23 in side view. In addition, the second curved portion R2, which is convex toward the secondmain surface 22, is provided on the side (toward the second main surface 22) of the firstcylindrical portion 31, or the symmetrical third curved portions R3 are provided on opposite sides of the secondcylindrical portion 32. - Therefore, when the
product region 24 is separated into individualwiring substrate units 1n along the dividinggrooves 26, burrs or cracks of the ceramic layers S are less likely to be generated in the vicinity of thenotch cylindrical portion conductor layer cylindrical portion conductor layer groove 26. Thus, a plurality of ceramic wiring substrates 1a or 1e exhibiting excellent form and dimensional accuracy can be reliably produced from the wiring substrate array. - Belt-
like dividing grooves 26 may also be formed on the secondmain surface 22 of the multi-piecewiring substrate array FIG. 10 or 11 so that the dividing grooves are arranged in lattice shape in plan view, to thereby produce a multi-piece wiring substrate array (21b or 21f) having a plurality ofwiring substrate units 1n for providing theaforementioned wiring substrate -
FIG. 12 is a plan view of a second multi-piecewiring substrate array 21c according to the present invention.FIG. 13 is a partial, vertical cross-sectional view of the multi-piecewiring substrate array 21c ofFIG. 12 taken along line Y-Y. - As shown in
FIGs. 12 and 13 , the second multi-piecewiring substrate array 21c includes, as in the aforementioned case, aproduct region 24 formed of the ceramic layers S, anedge portion 25, and dividinggrooves 26 which are formed only on the firstmain surface 23 so as to be arranged in a lattice shape. Each of thewiring substrate units 1n located in theproduct region 24 is to become thesecond wiring substrate 1c through separation of the multi-piecewiring substrate array 21c into individual pieces. - As shown in
FIGs. 12 and 13 , each of the four dividinggrooves 26 surrounding eachwiring substrate unit 1n has, in the vicinity of a cross point of twoadjacent dividing grooves cylindrical portion 31 which has a circular shape in plan view, which is open only at the firstmain surface 23, and which orthogonally crosses with the two dividinggrooves 26 in a radial direction. The firstcylindrical portion 31 has a circulartubular conductor layer 14 extending on the inner wall of theportion 31, and also has a conductor layer 16 (similar to that described above) which is located at the bottom of thecylindrical portion 31. Similar to the aforementioned case, the conductor layers 14 and 16 are formed of, for example, W or Mo. - As shown in
FIG. 13 , the bottom 27 of the two dividinggrooves 26 orthogonally crossing with the firstcylindrical portion 31 and theconductor layer 14 in a radial direction has first curved portions R1 on opposite sides of the firstcylindrical portion 31 and theconductor layer 14, the first curved portions R1 being convex toward the firstmain surface 23 in side view, and also has a second curved portion R2 on the side (toward the second main surface 22) of the firstcylindrical portion 31 and the conductor layers 14 and 16, the second curved portion R2 being convex toward the secondmain surface 22 in side view. - Specifically, the dividing
groove 26 has-on opposite sides of the firstcylindrical portion 31 and theconductor layer 14 in side view-extendingportions 28 which taper toward the secondmain surface 22, and a semicircular extendingportion 29 on the side (toward the second main surface 22) of the firstcylindrical portion 31 and the conductor layers 14 and 16, the semicircular extendingportion 29 being convex toward the secondmain surface 22. -
FIG. 14 is a partial, vertical cross-sectional view of a fourth multi-piecewiring substrate array 21g according to the present invention, which is shown in a manner similar to that inFIG. 13 . - The fourth multi-piece
wiring substrate array 21g includes, as in the aforementioned case, aproduct region 24 having a plurality ofwiring substrate units 1n, each of which is to become the aforementionedfourth wiring substrate 1g; anedge portion 25; and dividinggrooves 26. As shown inFIG. 14 , each of the four dividinggrooves 26 surrounding eachwiring substrate unit 1n has, in the vicinity of a cross point of twoadjacent dividing grooves cylindrical portion 31 which has a circular shape in plan view, which is open only at the firstmain surface 23, and which crosses with the twoorthogonal dividing grooves 26 in a radial direction; and also has a secondcylindrical portion 32 which has a shape similar to that of the firstcylindrical portion 31 in plan view, which has a diameter smaller than that of the firstcylindrical portion 31, and which penetrates between a center portion of the bottom surface of the firstcylindrical portion 31 and the secondmain surface 22 so as to extend in a thickness direction of theproduct region 24, the secondcylindrical portion 32 concentrically communicating with the firstcylindrical portion 31. Conductor layers 14 and 20 are formed on the inner walls of the first and secondcylindrical portions conductor layer 16 is sandwiched between the conductor layers 14 and 20. Similar to the aforementioned case, the conductor layers 14, 16, and 20 are formed of, for example, W or Mo. - As shown in
FIG. 14 , the bottom 27 of the dividinggroove 26 crossing with the firstcylindrical portion 31 and theconductor layer 14 in a radial direction has a pair of symmetrical first curved portions R1 on opposite sides of the firstcylindrical portion 31 and theconductor layer 14, the first curved portions R1 being convex toward the firstmain surface 23 in side view, and also has symmetrical third curved portions R3 on opposite sides of the secondcylindrical portion 32 and theconductor layer 20 and on the side toward the firstcylindrical portion 31, the third curved portions R3 being convex toward the secondmain surface 22 in side view. Specifically, the dividinggroove 26 has-on opposite sides of the firstcylindrical portion 31 and theconductor layer 14 in side view-extendingportions 28 which taper toward the secondmain surface 22, and also has-on opposite sides of the secondcylindrical portion 32 and theconductor layer 20 and on the side toward the first main surface 23-quarter-arc-shaped extendingportions 30 which are convex toward the secondmain surface 22. The dividinggroove 26 having the extendingportions - According to the second or fourth multi-piece
wiring substrate array grooves 26 which orthogonally cross with the first or secondcylindrical portion cylindrical portion cylindrical portion 31 in a longitudinal direction of the dividinggrooves 26, the first curved portions R1 being convex toward the firstmain surface 23 in side view. In addition, the second curved portion R2, which is convex toward the secondmain surface 22, is provided on the side (toward the second main surface 22) of the firstcylindrical portion 31, or the symmetrical third curved portions R3 are provided on opposite sides of the secondcylindrical portion 32. Therefore, when theproduct region 24 is separated into individualwiring substrate units 1n along the dividinggrooves 26, burrs or cracks of the ceramic layers S are less likely to be generated in the vicinity of thenotch cylindrical portion conductor layer cylindrical portion conductor layer groove 26. Thus, a plurality ofwiring substrates - Belt-
like dividing grooves 26 may also be formed on the secondmain surface 22 of the multi-piecewiring substrate array FIG. 13 or 14 so that the dividing grooves are arranged in lattice shape in plan view, to thereby produce a multi-piece wiring substrate array (21d or 21h) having a plurality ofwiring substrate units 1n for providing theaforementioned wiring substrate - Next will be described methods for producing the first and third multi-piece
wiring substrate arrays - A ceramic slurry was prepared in advance by mixing alumina powder with appropriate amounts of a resin binder, a solvent, etc., and a plurality of green sheets (not illustrated) were formed from the ceramic slurry through the doctor blade method.
- Subsequently, penetration holes having different inner diameters were formed at specific positions of the green sheets through punching. An electrically conductive paste containing W or Mo powder was filled into a penetration hole of small diameter, to thereby form an unfired via conductor (not illustrated), and the electrically conductive paste was applied to the inner wall of a penetration hole of large diameter under reduced pressure, to thereby form an unfired, circular tubular conductor layer.
- Then, the aforementioned electrically conductive paste was applied through printing to a specific position of at least one of the front surface and back surface of each of the aforementioned green sheets, to thereby form an unfired internal wiring layer or surface wiring layer (not illustrated). A portion of the internal wiring layer may also serve as a wiring layer for plating (not illustrated).
- Next, a plurality of the green sheets each having any of the aforementioned via conductor, tubular conductor layer, and wiring layer were stacked and press-bonded together.
- Thus, as shown in
FIG. 15(a) , there was produced a green sheet laminate gs having a pair of opposite first and secondmain surfaces hole 31h opening only at the firstmain surface 23; a circulartubular conductor layer 12 formed so as to extend on the inner wall of the bottomedhole 31h; and aconductor layer 15 provided at the bottom of thehole 31h. - Subsequently, as shown in
FIG. 15(b) , the firstmain surface 23 of the green sheet laminate gs was irradiated with a laser beam L in a thickness direction of the laminate gs, and the laser beam L was continuously scanned along themain surface 23. The laser beam L employed was, for example, a UV-YAG laser beam. The focal point F of the laser beam L was maintained at a constant depth by means of alens 34, and the laser beam L was scanned at a constant scan rate (about 100 mm/second). In the case where a dividinggroove 23 having a V-shaped cross section was formed so as to have a depth of about 200 µm and an opening width of about 50 µm, irradiation of the laser beam L was carried out under the following conditions (frequency: about 30 to about 100 Hz, repetition number: 2 to 5). - As shown in
FIGs. 16(a) and 16(b) , even when the laser beam L passed through the inside (hollow portion) of the bottomedhole 31h and theconductor layer 12 in a radial direction, the focal point F of the laser beam L, the scan rate, and the aforementioned laser irradiation conditions were maintained constant. Thus, the laser beam L was continuously caused to pass through a center portion of the bottomedhole 31h in a radial direction. In this case, the amount of energy of the laser beam L for processing was temporarily excessive at the inside (hollow portion) of the bottomedhole 31h and theconductor layer 12. - As a result, as shown in
FIGs. 16(a) and 16(b) , symmetrical first curved portions R1 convex toward the firstmain surface 23 were formed on opposite sides of theconductor layer 12 at the bottom 27 of the dividinggroove 26 formed so as to cross with the bottomedhole 31h and theconductor layer 12, and a second curved portion R2 convex toward the secondmain surface 22 was formed below the bottomedhole 31h and theconductor layer 15. Theseparations grooves 26 were formed on the firstmain surface 23 of the green sheet laminate gs so as to be arranged in a lattice shape in plan view. - Separately, a plurality of different green sheets each having any of the aforementioned via conductor, tubular conductor layer, and wiring layer were stacked and press-bonded together. Thus, as shown in
FIG. 17(a) , there was produced a green sheet laminate gs having a pair of opposite first and secondmain surfaces hole 31h opening at the firstmain surface 23; a throughhole 32h having a smaller diameter and located between the throughhole 31h and the secondmain surface 22, the throughhole 32h concentrically communicating with the throughhole 31h; conductor layers 12 and 18 provided on the inner walls of the throughholes conductor layer 15 sandwiched between the conductor layers 12 and 18. - Subsequently, as shown in
FIG. 17(b) , the firstmain surface 23 of the green sheet laminate gs was irradiated with the aforementioned laser beam L in a thickness direction of the laminate gs under the same conditions as described above, and the laser beam L was continuously scanned along themain surface 23. - As shown in
FIGs. 18(a) and 18(b) , even when the laser beam L passed through the inside (hollow portion: through hole) of the throughholes holes holes - As a result, as shown in
FIGs. 18(a) and 18(b) , symmetrical first curved portions R1 convex toward the firstmain surface 23 were formed on opposite sides of theconductor layer 12 at the bottom 27 of the dividinggroove 26 formed so as to cross with the throughholes main surface 22 were formed on opposite sides of the throughhole 32h and theconductor layer 18. Theseparations grooves 26 were formed on the firstmain surface 23 of the green sheet laminate gs so as to be arranged in a lattice shape in plan view. - Subsequently, these two types of green sheet laminates gs were fired at the firing temperature of the aforementioned green sheets. As a result, the green sheets were formed into integrated ceramic layers S, whereby a ceramic laminate (not illustrated) was produced. In this case, the conductor layers 12 and 18, the wiring layer of each
wiring substrate 1n, etc. were also fired in parallel. - Then, by means of the aforementioned electrodes for plating, etc., the above-produced ceramic laminate was subjected to Ni electroplating and Au electroplating by immersing the laminate in specific electroplating baths sequentially. As a result, the inner walls of the conductor layers 12 and 18, etc. were covered with an Ni plating film and an Au plating film, and the end surface (cut surface) of the
conductor layer 18, the surface being located above the third curved portions R3 and exposed to the outside, was also covered with an Ni plating film and an Au plating film. - The multi-piece
wiring substrate array - According to the aforementioned production method for the multi-piece
wiring substrate array wiring substrate array grooves 26 formed on themain surface 23 of theproduct region 24 so as to be arranged in a lattice shape has the symmetrical first curved portions R1 located on opposite sides of theconductor layer 12 in side view, and also has the second curved portion R2 or a pair of the symmetrical third curved portions R3. - In addition, since the dividing
grooves 26 each including the extendingportions 28 to 30 can be accurately and reliably formed through laser processing employing the aforementioned laser beam L, a blade having a special shape is not required to be employed. Therefore, production cost can be reduced, and a groove formation step is readily controlled. - There may be provided a method for producing a multi-piece wiring substrate array (21c or 21g) in which each
wiring substrate unit 1n is to become theaforementioned wiring substrate grooves 26 shown inFIGs. 15 to 18 to cross orthogonally with the bottomedhole 31h and theconductor layer 12, or with center portions of the throughhole - Also, there may be provided a method for producing a multi-piece wiring substrate array (21b, 21d, 21f, or 21h) in which each
wiring substrate unit 1n is to become theaforementioned wiring substrate grooves 26 also on the secondmain surface 22 of the green sheet laminate gs so that they are in line symmetry with respect to those on the firstmain surface 23. - The present invention is not limited to the above-described embodiments.
- For example, the ceramic layers S of the aforementioned wiring substrate or multi-piece wiring substrate array may be formed of a high-temperature fired ceramic material other than alumina (e.g., aluminum nitride or mullite), or may be formed of a low-temperature fired ceramic material such as glass-ceramic material. In the latter case, the aforementioned conductor (e.g., the
conductor layer 12 or 18) is formed of Cu or Ag. - The aforementioned substrate main body or wiring substrate unit may have a rectangular shape in plan view.
- The aforementioned substrate main body kp or
wiring substrate unit 1n may be in such a form that it has a cavity which is open on the second main surface (front surface) 2 or 22 and which has a bottom surface and side surfaces. - In the multi-piece wiring substrate array production method, the laser processing may be appropriately carried out so that the laser irradiation conditions for the inside of the bottomed or through
hole 31h, etc. differ from those for themain surface 23 of the green sheet laminate gs. - The aforementioned multi-piece wiring substrate array production method may be continuously followed by a step of separating the wiring substrate array into individual wiring substrates.
- According to the present invention, there can be reliably provided a wiring substrate exhibiting excellent form and dimensional accuracy and having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed, as well as a multi-piece wiring substrate array for providing a plurality of the wiring substrates.
-
- 1a to 1h: wiring substrate
- 1n: wiring substrate unit
- 2, 22: second main surface/front surface
- 3, 23: first main surface/back surface
- 4: side surface
- 5: fracture surface
- 6: groove surface
- 7: boundary
- 11, 13, 17, 19: notch/first notch to fourth notch
- 12, 14, 18, 20: conductor layer
- 21a, 21c, 21e, 21g: multi-piece wiring substrate array
- 24: product region
- 25: edge portion
- 26: dividing groove
- 27: bottom of dividing groove
- 31, 32: first cylindrical portion, second cylindrical portion
- 31h, 32h: bottomed hole/through hole
- S: ceramic material/ceramic layer
- kp: substrate main body
- R1 to R3: first curved portion to third curved portion
- L: laser beam
Claims (11)
- A wiring substrate (1a) comprising:a substrate main body (kp) which is formed of a plurality of stacked ceramic layers (S), which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces (3, 2), and which has side surfaces (4) each being located between the pair of main surfaces (3, 2), and having a groove surface (6) located on a side toward the first main surface (3) and a fracture surface (5) located between the groove surface (6) and the second main surface (2); anda notch (11) which has a concave shape in plan view, and which is provided on a side surface (4) at least on a side toward the first main surface (3) so as to extend in a thickness direction of the side surface (4), the wiring substrate (1a) being characterized in that:
on opposite sides of the notch (11), the boundary (7) in the side surface (4) between the groove surface (6) and the fracture surface (5) has a first curved portion (R1), the first curved portions (R1) being convex toward the first main surface (3) of the substrate main body (kp) in side view; and a second curved portion (R2) which is convex toward the second main surface (2) of the substrate main body (kp) in side view, such that said boundary (7) is further from the first main surface (3) at the position of the notch (11) than at positions away from the notch (11). - A wiring substrate (1c) according to claim 1, wherein:the notch (13) has a quarter arc shape in plan view, and is provided at the corner portion formed by a pair of adjacent side surfaces (4); andin each of the pair of side surfaces (4) located on opposite sides of the notch (13), the boundary (7) between the groove surface (6) and the fracture surface (5) has one of the first curved portions (R1) on the corresponding side of the notch (13).
- A wiring substrate (1c) according to claim 1 or 2, wherein the second curved portion (R2) is on a second-main-surface side of the notch (11).
- A wiring substrate (1e) according to claim 1, further comprising:
a second notch (17) which has a shape similar to that of the notch (11) in plan view, which has a cross-sectional area smaller than that of the notch (11), and which penetrates between a center portion of a bottom surface (15) of the notch (11) and the second main surface (2) so as to extend in a thickness direction of the side surface (4); wherein:
in the side surface (4) having the notch (11) and the second notch (17), the boundary (7) between the groove surface (6) and the fracture surface (5) has the first curved portions (R1) on opposite sides of the notch (11); and second curved portions (R3) on opposite sides of the second notch (17), the second curved portions (R3) being convex toward the second main surface (2) of the substrate main body (kp) in side view. - A wiring substrate (1g) according to claim 1, wherein:the notch (13) has a quarter arc shape in plan view, and is provided at the corner portion formed by a pair of adjacent side surfaces (4); and further comprisinga second notch (19) which has a shape similar to that of the notch (13) in plan view, which has a cross-sectional area smaller than that of the notch (13), and which penetrates between a center portion of a bottom surface (16) of the notch (13) and the second main surface (2) so as to extend in a thickness direction of the side surfaces (4); wherein:in each of the pair of adjacent side surfaces (4) forming the corner portion and having the notch (13) and the second notch (19), the boundary (7) between the groove surface (6) and the fracture surface (5) has the first curved portions (R1) on opposite sides of the notch (13), and second curved portions (R3) on opposite sides of the second notch (19) .
- A wiring substrate (1b, 1d, 1f, 1h) according to any one of claims 1 to 5, wherein each side surface (4) also has a groove surface (6) located on a side toward the second main surface (2), and the fracture surface (5) is located between the first-main-surface-side groove surface (6) and the second-main-surface-side groove surface (6).
- A wiring substrate (1a to 1h) according to any one of claims 1 to 6, wherein a conductor layer (12, 14, 18, 20) is formed so as to extend on the inner wall of the notch (11, 13) or each of the notches (11, 13, 17, 19).
- A multi-piece wiring substrate array (21a, 21c) comprising:a product region (24) having a plurality of wiring substrate units (1n) which are adjacently arranged in a matrix form, each unit being formed of a plurality of stacked ceramic layers (S), and having a pair of first and second main surfaces (23, 22) and a rectangular shape in plan view;an edge portion (25) which is formed of the ceramic layers (S), which is located around the product region (24), and which has a pair of first and second main surfaces (23, 22) and has a rectangular frame shape in plan view;dividing grooves (26) which are formed at least on the first main surface (23) and are arranged in a lattice shape in plan view, and which are provided between adjacent wiring substrate units (1n) and between the product region (24) and the edge portion (25); andfirst cylindrical portions (31) each having a circular shape in plan view, being open only at the first main surface (23), and crossing with the corresponding dividing groove (26) in a radial direction, the multi-piece wiring substrate array (21a, 21c) being characterized in that:
one or each of two dividing grooves (26) crossing with the corresponding first cylindrical portion (31) in a radial direction has a bottom (27) which has first curved portions (R1) on opposite sides of the first cylindrical portion (31), the first curved portions (R1) being convex toward the first main surface (23) in side view, and which also has a second curved portion (R2) on a second-main-surface side of the first cylindrical portion (31), the second curved portion (R2) being convex toward the second main surface (22) in side view, such that said bottom (27) is further away from the first main surface (23) at the position of the first cylindrical portion (31) than at positions away from the first cylindrical portion. - A multi-piece wiring substrate array (21e, 21g) according to claim 8, which further comprises second cylindrical portions (32) each having a shape similar to that of the first cylindrical portion (31) in plan view, having a cross-sectional area smaller than that of the first cylindrical portion (31), and penetrating between a center portion of a bottom surface (16) of the first cylindrical portion (31) and the second main surface (22) so as to extend in a thickness direction of the product region (24), wherein one or each of two dividing grooves (26) crossing with the corresponding first cylindrical portion (31) and second cylindrical portion (32) in a radial direction has a bottom (27) which has third curved portions (R3) on opposite sides of the second cylindrical portion (32), the third curved portions (R3) being convex toward the first main surface (23) in side view.
- A multi-piece wiring substrate array (21a, 21c, 21e, 21g) according to claim 8 or 9, wherein a conductor layer (12, 14, 18, 20) is formed so as to extend on the inner wall of the first cylindrical portion (31), or on both the inner walls of the first and second cylindrical portions (31, 32) .
- A method for producing a multi-piece wiring substrate array (21a, 21c), the multi-piece wiring substrate array (21a, 21c) comprising:a product region (24) having a plurality of wiring substrate units (1n) which are adjacently arranged in a matrix form, each unit being formed of a plurality of stacked ceramic layers (S), and having a pair of first and second main surfaces (23, 22) and a rectangular shape in plan view;an edge portion (25) which is formed of the ceramic layers (S), which is located around the product region (24), and which has a pair of first and second main surfaces (23, 22) and has a rectangular frame shape in plan view;dividing grooves (26) which are formed at least on the first main surface (23) and are arranged in a lattice shape in plan view, and which are provided between adjacent wiring substrate units (1n) and between the product region (24) and the edge portion (25); andfirst cylindrical portions (31) each having a circular shape in plan view, being open only at the first main surface (23), and crossing with the corresponding dividing groove (26) in a radial direction,the method comprising:a step of forming a plurality of penetration holes having the same or different inner diameters in some or all of a plurality of green sheets each having a rectangular shape in plan view and having a pair of first and second main surfaces; anda step of forming a plurality of dividing grooves (26) at least on the first main surface (23) of a green sheet laminate (gs), the green sheet laminate (gs) being prepared through stacking of the green sheets;characterised in that:
the step of forming the plurality of dividing grooves (26) comprises continuously irradiating the green sheet laminate (gs) with a laser beam (L) under constant irradiation conditions while scanning the laser beam (L) on a position including a bottomed hole (31h) or through hole (31h, 32h) formed through communication of the penetration holes, so that the focal point (F) of the laser beam (L) crosses with the bottomed hole (31h) or the through hole (31h, 32h) in plan view, and so that the dividing grooves (26) are arranged in a lattice shape in plan view so as to be provided around wiring substrate units (1n) and between a product region (24) and an edge portion (25), to form said dividing grooves (26) with a depth which is greater at a position where the dividing grooves (26) cross with a through hole (31h, 32h) or a bottomed hole (31h) than at a position where the dividing grooves (26) do not cross with a through hole (31h, 32h) or a bottomed hole (31h).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2011112398A JP5753734B2 (en) | 2011-05-19 | 2011-05-19 | Wiring board, multi-cavity wiring board, and manufacturing method thereof |
PCT/JP2012/000668 WO2012157152A1 (en) | 2011-05-19 | 2012-02-01 | Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor |
Publications (3)
Publication Number | Publication Date |
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EP2712281A1 EP2712281A1 (en) | 2014-03-26 |
EP2712281A4 EP2712281A4 (en) | 2015-06-24 |
EP2712281B1 true EP2712281B1 (en) | 2020-05-13 |
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EP12785591.4A Active EP2712281B1 (en) | 2011-05-19 | 2012-02-01 | Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor |
Country Status (7)
Country | Link |
---|---|
US (1) | US8952269B2 (en) |
EP (1) | EP2712281B1 (en) |
JP (1) | JP5753734B2 (en) |
KR (1) | KR101536068B1 (en) |
CN (1) | CN103548426B (en) |
TW (1) | TWI495403B (en) |
WO (1) | WO2012157152A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150004118A (en) * | 2013-07-02 | 2015-01-12 | 삼성디스플레이 주식회사 | Substrate for display device, method of manufacturing the same, and display device including the same |
JP6276040B2 (en) * | 2014-01-20 | 2018-02-07 | 日本特殊陶業株式会社 | Manufacturing method of component mounting package |
JP6317115B2 (en) * | 2014-01-21 | 2018-04-25 | 京セラ株式会社 | Multi-cavity wiring board, wiring board, and manufacturing method of multi-cavity wiring board |
JP2015188004A (en) * | 2014-03-26 | 2015-10-29 | キヤノン株式会社 | Package, semiconductor device, and semiconductor module |
JP2016072606A (en) * | 2014-09-30 | 2016-05-09 | 日本特殊陶業株式会社 | Wiring board and multi-piece wiring board |
JP2016201434A (en) * | 2015-04-09 | 2016-12-01 | 日本特殊陶業株式会社 | Ceramic wiring board and manufacturing method thereof |
KR102306719B1 (en) | 2015-04-22 | 2021-09-30 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same, and electronic component module |
JP2017092289A (en) * | 2015-11-11 | 2017-05-25 | Ngkエレクトロデバイス株式会社 | Multi-piece package and ceramic package and manufacturing method therefor |
KR101983630B1 (en) | 2016-01-22 | 2019-05-29 | 쿄세라 코포레이션 | Package for storing electronic components, multi-piece wiring board, electronic device and electronic module |
JP7122939B2 (en) * | 2018-10-30 | 2022-08-22 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
Family Cites Families (21)
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US4963843A (en) * | 1988-10-31 | 1990-10-16 | Motorola, Inc. | Stripline filter with combline resonators |
EP0582881B1 (en) * | 1992-07-27 | 1997-12-29 | Murata Manufacturing Co., Ltd. | Multilayer electronic component, method of manufacturing the same and method of measuring characteristics thereof |
JP2548664B2 (en) * | 1992-08-24 | 1996-10-30 | 東洋通信機株式会社 | Structure of scribe groove on printed circuit board |
JP3212764B2 (en) * | 1993-06-30 | 2001-09-25 | ダイハツ工業株式会社 | Power transmission device seal mechanism |
JP3368645B2 (en) * | 1993-12-27 | 2003-01-20 | 株式会社村田製作所 | LAMINATED ELECTRONIC COMPONENT, ITS MANUFACTURING METHOD AND ITS CHARACTERISTIC MEASUREMENT METHOD |
JP3211609B2 (en) * | 1995-02-23 | 2001-09-25 | 株式会社村田製作所 | Multilayer electronic component and method of manufacturing the same |
JPH10284935A (en) * | 1997-04-09 | 1998-10-23 | Murata Mfg Co Ltd | Voltage-controlled oscillator and its production |
KR100259359B1 (en) * | 1998-02-10 | 2000-06-15 | 김영환 | Substrate for semiconductor device package, semiconductor device package using the same and manufacturing method thereof |
JP4138211B2 (en) * | 2000-07-06 | 2008-08-27 | 株式会社村田製作所 | Electronic component and manufacturing method thereof, collective electronic component, mounting structure of electronic component, and electronic apparatus |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
ES2285634T3 (en) * | 2002-03-12 | 2007-11-16 | Hamamatsu Photonics K. K. | METHOD FOR DIVIDING A SIUSTRATE. |
JP2004088027A (en) * | 2002-08-29 | 2004-03-18 | Murata Mfg Co Ltd | Electronic component assembly and ceramic electronic component, and mthod for manufacturing ceramic electronic component |
JP2005051036A (en) * | 2003-07-28 | 2005-02-24 | Murata Mfg Co Ltd | Castellation structure of multilayer ceramic component and multilayer ceramic substrate for multiple pattern, and its manufacturing method |
US7919717B2 (en) * | 2005-08-19 | 2011-04-05 | Honeywell International Inc. | Three-dimensional printed circuit board |
JP2008198905A (en) * | 2007-02-15 | 2008-08-28 | Hitachi Metals Ltd | Ceramic substrate, manufacturing method of ceramic circuit board, aggregate substrate and semiconductor module |
CN101790787B (en) * | 2007-08-23 | 2012-07-18 | 株式会社大真空 | Electronic parts package, base for electronic parts package, and junction structure of electronic parts package and circuit substrate |
JP2009218319A (en) | 2008-03-10 | 2009-09-24 | Ngk Spark Plug Co Ltd | Method for manufacturing multiply-produced wiring board |
JP5052398B2 (en) | 2008-04-24 | 2012-10-17 | 京セラ株式会社 | Multi-cavity wiring board, wiring board and electronic device |
KR20110036812A (en) * | 2008-06-20 | 2011-04-11 | 히타치 긴조쿠 가부시키가이샤 | Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate |
JP5585013B2 (en) * | 2009-07-14 | 2014-09-10 | 日亜化学工業株式会社 | Light emitting device |
JP5697467B2 (en) | 2011-01-27 | 2015-04-08 | 京セラ株式会社 | Multiple wiring board |
-
2011
- 2011-05-19 JP JP2011112398A patent/JP5753734B2/en not_active Expired - Fee Related
-
2012
- 2012-02-01 CN CN201280023926.1A patent/CN103548426B/en not_active Expired - Fee Related
- 2012-02-01 EP EP12785591.4A patent/EP2712281B1/en active Active
- 2012-02-01 WO PCT/JP2012/000668 patent/WO2012157152A1/en active Application Filing
- 2012-02-01 US US14/111,486 patent/US8952269B2/en not_active Expired - Fee Related
- 2012-02-01 KR KR1020137032636A patent/KR101536068B1/en active IP Right Grant
- 2012-05-18 TW TW101117673A patent/TWI495403B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
WO2012157152A1 (en) | 2012-11-22 |
CN103548426A (en) | 2014-01-29 |
KR101536068B1 (en) | 2015-07-10 |
US8952269B2 (en) | 2015-02-10 |
TW201306677A (en) | 2013-02-01 |
TWI495403B (en) | 2015-08-01 |
EP2712281A1 (en) | 2014-03-26 |
EP2712281A4 (en) | 2015-06-24 |
KR20140013067A (en) | 2014-02-04 |
JP2012243942A (en) | 2012-12-10 |
CN103548426B (en) | 2016-08-10 |
US20140037912A1 (en) | 2014-02-06 |
JP5753734B2 (en) | 2015-07-22 |
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