JP2548664B2 - Structure of scribe groove on printed circuit board - Google Patents
Structure of scribe groove on printed circuit boardInfo
- Publication number
- JP2548664B2 JP2548664B2 JP4247230A JP24723092A JP2548664B2 JP 2548664 B2 JP2548664 B2 JP 2548664B2 JP 4247230 A JP4247230 A JP 4247230A JP 24723092 A JP24723092 A JP 24723092A JP 2548664 B2 JP2548664 B2 JP 2548664B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- groove
- scribe groove
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子回路を搭載するプリ
ント基板を一枚の母材から多枚数切断分離して作製する
のに好適なプリント基板等のスクライブ溝の構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scribe groove structure suitable for producing a printed circuit board on which an electronic circuit is mounted by cutting and separating a plurality of printed circuit boards from a single base material.
【０００２】[0002]
【従来技術】電子回路を形成するプリント基板の材質と
しては、ガラスエポキシや、アルミナ等が一般に用いら
れているが、近年の電子機器の小型化、或は電子部品の
小型化に伴ってプリント基板自体を小型化する要請が高
まっている。例えば、ページャの如き小型受信機や、携
帯無線機等のブロック基板、コンピュータ関連装置とし
てのメモリＩＣモジュール等々に用いるプリント基板は
小型化の要請が高い。2. Description of the Related Art As a material of a printed circuit board for forming an electronic circuit, glass epoxy, alumina or the like is generally used. However, the printed circuit board has been downsized with the recent miniaturization of electronic devices or electronic parts. The demand for miniaturization is increasing. For example, there is a strong demand for miniaturization of printed circuit boards used for small receivers such as pagers, block boards for portable radios, memory IC modules as computer-related devices, and the like.
【０００３】小型プリント基板の量産性を高める方法と
しては、同一形状の基板を多数連結した如き形状を有し
た広面積の板状母材を予め一括製造しておき、この母材
を個々の基板に相当する形状に切断、分割する方法が一
般的に行われている。母材を分割する手段として従来か
ら用いられているのは２枚の刃を擦り合わせて切断する
裁断器（シェアー）であるが、ガラスエポキシ等の比較
的軟質の基板の製造においては、最近では予め母材にス
リットや貫通孔から成るミシン目を格子状に形成するこ
とによって個々の基板が占める領域を確定しておき、各
領域上に対する配線パターンの形成、部品の実装等を完
了してから該スリット等を境界として折り曲げて切り離
す方法が多用されている。As a method for improving the mass productivity of small printed circuit boards, a large-area plate-shaped base material having a shape such as a plurality of boards having the same shape connected to each other is previously manufactured in a batch, and the base materials are individually manufactured. A method of cutting and dividing into a shape corresponding to is generally performed. Conventionally used as a means for dividing the base material is a cutting machine (shear) that rubs two blades to cut, but recently in the production of relatively soft substrates such as glass epoxy, Areas occupied by individual boards are defined in advance by forming perforations in the base material in the form of slits and through holes in a grid pattern, and after forming wiring patterns on each area and mounting components, etc. A method of bending and separating with the slit or the like as a boundary is often used.
【０００４】また、高周波回路用プリント基板や、高密
度実装電子機器に用いられるプリント基板としては、ア
ルミナ等の硬質材料が用いられることが多いが、斯かる
硬質基板においてはガラスエポキシ製母材の場合のよう
にミシン目にて折り曲げ切断することが困難であること
から、母材表面に所定深さの連続溝を形成し、該溝に沿
って折り曲げ切断する方法が採用されている。このよう
な溝は一般にスクライブ溝と呼ばれ、溶融状態にあるア
ルミナ母材が冷却固化する前の比較的軟質な段階で、溝
形成を行う。Further, a hard material such as alumina is often used as a printed circuit board for a high frequency circuit or a printed circuit board used for high density mounting electronic equipment. In such a hard board, a glass epoxy base material is used. Since it is difficult to bend and cut at the perforations as in the case, a method of forming a continuous groove having a predetermined depth on the surface of the base material and bending and cutting along the groove is adopted. Such a groove is generally called a scribe groove, and the groove is formed at a relatively soft stage before the molten alumina base material is cooled and solidified.
【０００５】図３（ａ）及び（ｂ）はスクライブ溝を形
成したアルミナ母材の平面図及び断面図であり、母材１
の表面に所定深さで格子状に形成したスクライブ溝２は
（ｂ）に示すようにＶ溝状に構成されており、図４
（ａ）（ｂ）及び（ｃ）は該母材１をスクライブ溝２に
沿って折ることにより切断する手順を示している。ま
ず、図４（ａ）に示す母材１をスクライブ溝２に沿って
折ることによって基板３を独立分離せしめると、（ｂ）
に示すように溝２の終端部の切断面にスカート状のバリ
４が形成され易くなる。（ｃ）は正常な切断面の状態を
示しており、バリを有した基板はその後の加工工程にお
いては勿論、機器に組み込む際において、種々の不具合
をもたらすため、バリ発生の解消が望まれていた。ま
た、従来スクライブ溝の一部、特に複数の溝が交差する
部分にＶ溝を形成したものが知られているが、この種の
Ｖ溝は傾斜が急であるため、切断時にバリを防止する効
果が極めて薄い。仮に、Ｖ溝がバリ防止効果を有すると
しても、その範囲（急激に傾斜した底面の横方向範囲）
が極めて狭い為、Ｖ溝以外の溝部分ではバリが発生する
虞れが強い。3 (a) and 3 (b) are a plan view and a sectional view of an alumina base material having scribed grooves.
As shown in FIG. 4B, the scribed grooves 2 formed in a lattice pattern on the surface of the V-shaped groove have a V-groove shape.
(A), (b) and (c) show a procedure of cutting the base material 1 by folding it along the scribe groove 2. First, when the base material 1 shown in FIG. 4A is folded along the scribe groove 2 to separate the substrate 3 independently, (b)
As shown in, the skirt-shaped burr 4 is easily formed on the cut surface of the end portion of the groove 2. (C) shows a state of a normal cut surface, and since a substrate having burrs causes various problems not only in the subsequent processing steps but also when incorporated in equipment, it is desired to eliminate the occurrence of burrs. It was Further, conventionally, it is known that a V groove is formed in a part of the scribe groove, particularly in a portion where a plurality of grooves intersect, but since the V groove of this kind has a steep inclination, burr is prevented at the time of cutting. The effect is extremely thin. Even if the V groove has a burr prevention effect, its range (horizontal range of abruptly inclined bottom surface)
Is extremely narrow, there is a strong possibility that burrs will be generated in the groove portion other than the V groove.
【０００６】[0006]
【発明の目的】本発明は上記に鑑みてなされたものであ
り、表面に刻設したスクライブ溝に沿って折り曲げ切断
することにより個々の基板に分割するようにしたアルミ
ナ等の硬質の母材において、スクライブ溝の終端部の切
断面にバリが発生することを防止したプリント基板等の
スクライブ溝の構造を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above, and in a hard base material such as alumina, which is divided into individual substrates by bending and cutting along a scribe groove formed on the surface. An object of the present invention is to provide a structure of a scribe groove, such as a printed circuit board, which prevents burrs from being generated on the cut surface of the end portion of the scribe groove.
【０００７】[0007]
【発明の概要】上記目的を達成するため本発明は、表面
に刻設したスクライブ溝に沿って折り曲げ切断すること
により個々の基板に分割し得るように構成した硬質の母
材において、個々の基板間の境界線をなす各スクライブ
溝の終端部の深さを徐々に大きく、且つ母材を貫通しな
いように構成したことを特徴とする。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a hard base material that can be divided into individual substrates by bending and cutting along a scribe groove formed on the surface of each substrate. It is characterized in that the depth of the terminating end of each scribe groove forming the boundary line between them is gradually increased and the base material is not penetrated.
【０００８】[0008]
【発明の実施例】以下、添付図面に示した実施例により
本発明を詳細に説明する。図１は本発明のスクライブ
溝、即ち母材に設けたスクライブ溝の構成を示す正面図
であり、図２は図１の平面図である。この発明は、母材
１の表面に格子状に形成したスクライブ溝２の終端部２
ａの深さを中央部２ｂの深さよりも深く設定した構成が
特徴的である。図２は本発明のスクライブ溝を備えた母
材の平面図であり、アルミナ等の硬質材料から成る母材
１表面には各基板領域３を区画するためのスクライブ溝
２を格子状に形成すると共に、縦横に延びるスクライブ
溝２の交差部の溝の深さをその交差部に向かう程徐々に
深くなるように傾斜せしめている。換言すれば、この形
態例は、母材１の表面に格子状にスクライブ溝２を刻設
し、該スクライブ溝２に沿って分割することにより個々
の基板３、３、・・・を得る様に構成したものに於て、
各基板３、３、・・・間の境界線となる各スクライブ溝
２の終端部２ａ， ２ａ・・・の深さをスクライブ溝中
央部２ｂの深さよりも徐々に深くなる様に傾斜せしめた
構成が特徴的である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings. FIG. 1 is a front view showing a structure of a scribe groove of the present invention, that is, a scribe groove provided in a base material, and FIG. 2 is a plan view of FIG. According to the present invention, the end portion 2 of the scribe groove 2 formed in a lattice shape on the surface of the base material 1
A characteristic is that the depth of a is set deeper than the depth of the central portion 2b. FIG. 2 is a plan view of a base material having scribed grooves according to the present invention. The scribed grooves 2 for partitioning each substrate region 3 are formed in a grid pattern on the surface of the base material 1 made of a hard material such as alumina. At the same time, the depth of the groove at the intersection of the scribe grooves 2 extending vertically and horizontally is inclined so as to become gradually deeper toward the intersection. In other words, in this embodiment, the scribing grooves 2 are engraved in a lattice pattern on the surface of the base material 1 and divided along the scribing grooves 2 to obtain individual substrates 3, 3, .... In the one configured in
The end portions 2a, 2a, ... Of the scribe grooves 2, which are the boundaries between the substrates 3, 3, ..., Are inclined so as to be gradually deeper than the depth of the scribe groove central portion 2b. The configuration is characteristic.
【０００９】[0009]
【００１０】このように本発明においては、折り曲げ切
断のためのスクライブ溝の終端部の溝深さを他の部分
（中央部）よりも深くし、しかも外側へ向けて徐々に深
くなるように傾斜せしめたため、スクライブ溝に沿って
折り曲げた場合に、溝の終端部も中央部と同様に、基板
面に対して垂直に切断することができ、スカート状のバ
リが形成されることがなくなる。As described above, in the present invention, the groove depth of the terminal end portion of the scribe groove for bending cutting is made deeper than that of the other portion (central portion), and is inclined so as to gradually become deeper toward the outside. Since it is bent, when it is bent along the scribe groove, the end portion of the groove can be cut perpendicularly to the substrate surface, like the central portion, and skirt-shaped burrs are not formed.
【００１１】終端部を除いた他の溝部分は従来通りの適
正な深さに設定してあるため、十分な強度を維持してお
り、母材に対する加工時及び移送時に、母材に加わる負
荷によってスクライブ溝から折れ曲がったり切断するこ
ともない。Since the groove portions other than the terminal end portion are set to a proper depth as in the conventional case, sufficient strength is maintained and a load applied to the base material during processing and transfer of the base material. It does not bend or cut from the scribe groove.
【００１２】[0012]
【発明の効果】以上のように本発明によれば、表面に刻
設したスクライブ溝に沿って折り曲げ切断することによ
り個々の基板に分割するようにしたアルミナ等の硬質の
母材において、スクライブ溝の終端部の切断面にバリが
発生することを防止できる。As described above, according to the present invention, a scribe groove is formed in a hard base material such as alumina, which is divided into individual substrates by bending and cutting along the scribe groove formed on the surface. It is possible to prevent burrs from being generated on the cut surface of the end portion of the.
【図１】本発明のスクライブ溝を備えた母材の正面図。FIG. 1 is a front view of a base material having a scribe groove of the present invention.
【図２】本発明のスクライブ溝を有した母材の一例の平
面図。FIG. 2 is a plan view of an example of a base material having a scribe groove of the present invention.
【図３】（ａ）及び（ｂ）はスクライブ溝を形成した従
来のアルミナ母材の平面図及び断面図。3A and 3B are a plan view and a cross-sectional view of a conventional alumina base material having scribed grooves formed therein.
【図４】（ａ）（ｂ）及び（ｃ）は従来の母材をスクラ
イブ溝に沿って折ることにより切断する手順を示す図で
ある。4 (a), (b) and (c) are diagrams showing a conventional procedure for cutting a base material by folding it along a scribe groove.
１ 母材、２ スクライブ溝、２ａ 終端部，２ｂ 中
央部，３ 基板領域，４ バリ1 Base Material, 2 Scribing Grooves, 2a End Part, 2b Central Part, 3 Substrate Area, 4 Burr
Claims (1)
り曲げ切断することにより個々の基板に分割し得るよう
に構成した硬質の母材において、 個々の基板間の境界線をなす各スクライブ溝の終端部の
深さを徐々に大きく、且つ母材を貫通しないように構成
したことを特徴とするプリント基板等のスクライブ溝の
構造。1. A hard base material constructed so that it can be divided into individual substrates by bending and cutting along the scribed grooves engraved on the surface of each scribe groove forming a boundary line between the individual substrates. A structure of a scribed groove of a printed circuit board or the like, characterized in that the depth of the terminal end is gradually increased and the base material is not penetrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4247230A JP2548664B2 (en) | 1992-08-24 | 1992-08-24 | Structure of scribe groove on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4247230A JP2548664B2 (en) | 1992-08-24 | 1992-08-24 | Structure of scribe groove on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677612A JPH0677612A (en) | 1994-03-18 |
| JP2548664B2 true JP2548664B2 (en) | 1996-10-30 |
Family
ID=17160391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4247230A Expired - Lifetime JP2548664B2 (en) | 1992-08-24 | 1992-08-24 | Structure of scribe groove on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548664B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5753734B2 (en) * | 2011-05-19 | 2015-07-22 | 日本特殊陶業株式会社 | Wiring board, multi-cavity wiring board, and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62204366U (en) * | 1986-06-18 | 1987-12-26 | ||
| JP3057955U (en) * | 1998-09-24 | 1999-06-08 | ツァイ ツァイ チャン | Elevating and rotating desk structure |
-
1992
- 1992-08-24 JP JP4247230A patent/JP2548664B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0677612A (en) | 1994-03-18 |
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