EP2454551A4 - Anisotropes wärmeleitelement und herstellungsverfahren dafür - Google Patents

Anisotropes wärmeleitelement und herstellungsverfahren dafür

Info

Publication number
EP2454551A4
EP2454551A4 EP10800253.6A EP10800253A EP2454551A4 EP 2454551 A4 EP2454551 A4 EP 2454551A4 EP 10800253 A EP10800253 A EP 10800253A EP 2454551 A4 EP2454551 A4 EP 2454551A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
thermal conduction
conduction element
anisotropic thermal
anisotropic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10800253.6A
Other languages
English (en)
French (fr)
Other versions
EP2454551A1 (de
EP2454551B1 (de
Inventor
Richard J Lemak
Robert J Moskaitis
David Pickrell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Specialty Minerals Michigan Inc
Original Assignee
Specialty Minerals Michigan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Specialty Minerals Michigan Inc filed Critical Specialty Minerals Michigan Inc
Publication of EP2454551A1 publication Critical patent/EP2454551A1/de
Publication of EP2454551A4 publication Critical patent/EP2454551A4/de
Application granted granted Critical
Publication of EP2454551B1 publication Critical patent/EP2454551B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
EP10800253.6A 2009-07-14 2010-06-25 Anisotropes wärmeleitelement und herstellungsverfahren dafür Active EP2454551B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/502,561 US8085531B2 (en) 2009-07-14 2009-07-14 Anisotropic thermal conduction element and manufacturing method
PCT/US2010/039949 WO2011008467A1 (en) 2009-07-14 2010-06-25 Anisotropic thermal conduction element and manufacturing method

Publications (3)

Publication Number Publication Date
EP2454551A1 EP2454551A1 (de) 2012-05-23
EP2454551A4 true EP2454551A4 (de) 2016-09-28
EP2454551B1 EP2454551B1 (de) 2017-04-26

Family

ID=43449677

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10800253.6A Active EP2454551B1 (de) 2009-07-14 2010-06-25 Anisotropes wärmeleitelement und herstellungsverfahren dafür

Country Status (10)

Country Link
US (1) US8085531B2 (de)
EP (1) EP2454551B1 (de)
JP (2) JP2012533882A (de)
KR (1) KR20120046744A (de)
CN (1) CN102575914B (de)
CA (1) CA2767807C (de)
MY (1) MY159262A (de)
SG (1) SG177520A1 (de)
TW (1) TWI513592B (de)
WO (1) WO2011008467A1 (de)

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US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
JP2011258755A (ja) * 2010-06-09 2011-12-22 Denso Corp 熱拡散体および発熱体の冷却装置
JP5618851B2 (ja) * 2011-01-28 2014-11-05 株式会社日立ハイテクノロジーズ イオンミリング装置
JP5930604B2 (ja) * 2011-05-12 2016-06-08 株式会社サーモグラフィティクス 異方性熱伝導素子の製造方法
JP5628771B2 (ja) * 2011-09-14 2014-11-19 明智セラミックス株式会社 積層シート
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US10276410B2 (en) * 2011-11-25 2019-04-30 Nhk Spring Co., Ltd. Substrate support device
JP6064886B2 (ja) 2012-12-26 2017-01-25 株式会社豊田中央研究所 熱伝導性応力緩和構造体
US9380733B2 (en) * 2013-02-20 2016-06-28 Mitsubishi Electric Corporation Cooling device and power module equipped with cooling device
US20140284040A1 (en) * 2013-03-22 2014-09-25 International Business Machines Corporation Heat spreading layer with high thermal conductivity
JP6221053B2 (ja) * 2013-06-25 2017-11-01 パナソニックＩｐマネジメント株式会社 異方性熱伝導組成物
JP6120733B2 (ja) * 2013-08-30 2017-04-26 オリンパス株式会社 撮像装置及び内視鏡
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CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
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JP6979270B2 (ja) * 2016-12-16 2021-12-08 デンカ株式会社 グラファイト樹脂複合体
CN116544773A (zh) * 2016-12-22 2023-08-04 京瓷株式会社 电子元件搭载用基板、电子装置以及电子模块
JP6754973B2 (ja) * 2017-02-02 2020-09-16 パナソニックＩｐマネジメント株式会社 グラファイト放熱板
WO2018193492A1 (ja) * 2017-04-17 2018-10-25 オリンパス株式会社 処置具
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US11152279B2 (en) * 2018-03-26 2021-10-19 Raytheon Company Monolithic microwave integrated circuit (MMIC) cooling structure
CN111971789B (zh) 2018-03-28 2024-03-01 株式会社钟化 各向异性石墨、各向异性石墨复合体及其制造方法
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EP3806587B1 (de) * 2018-05-29 2024-05-29 Kyocera Corporation Montagesubstrat für elektronisches element, elektronische vorrichtung und elektronisches modul
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JP7159643B2 (ja) * 2018-06-27 2022-10-25 日本ゼオン株式会社 熱伝導シートの製造方法
JP7055870B2 (ja) * 2018-06-27 2022-04-18 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
EP3850662B1 (de) 2018-09-14 2023-05-17 Raytheon Company Modulbasis mit integriertem wärmeverteiler und kühlkörper zur thermischen und strukturellen verwaltung von integrierten hochleistungsschaltungen oder anderen vorrichtungen
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP7296122B2 (ja) * 2019-01-10 2023-06-22 株式会社アカネ 放熱体及びパワー半導体用放熱体
CN113366925A (zh) * 2019-01-31 2021-09-07 株式会社村田制作所 多层布线基板
US11032947B1 (en) 2020-02-17 2021-06-08 Raytheon Company Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones
US11313631B2 (en) * 2020-07-07 2022-04-26 Hfc Industry Limited Composite heat sink having anisotropic heat transfer metal-graphite composite fins
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材
KR20240069837A (ko) 2022-11-04 2024-05-21 포항공과대학교 산학협력단 열전도성 필러 및 이를 이용한 열 관리용 열전소자와 그 제조방법

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Also Published As

Publication number Publication date
CN102575914A (zh) 2012-07-11
WO2011008467A1 (en) 2011-01-20
KR20120046744A (ko) 2012-05-10
US8085531B2 (en) 2011-12-27
CA2767807C (en) 2017-06-27
SG177520A1 (en) 2012-02-28
TW201107141A (en) 2011-03-01
TWI513592B (zh) 2015-12-21
EP2454551A1 (de) 2012-05-23
CA2767807A1 (en) 2011-01-20
EP2454551B1 (de) 2017-04-26
MY159262A (en) 2016-12-30
JP2016026391A (ja) 2016-02-12
JP2012533882A (ja) 2012-12-27
US20110014417A1 (en) 2011-01-20
CN102575914B (zh) 2014-08-27

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