EP1856309A4 - Selective catalytic activation of non-conductive substrates - Google Patents

Selective catalytic activation of non-conductive substrates

Info

Publication number
EP1856309A4
EP1856309A4 EP06734240A EP06734240A EP1856309A4 EP 1856309 A4 EP1856309 A4 EP 1856309A4 EP 06734240 A EP06734240 A EP 06734240A EP 06734240 A EP06734240 A EP 06734240A EP 1856309 A4 EP1856309 A4 EP 1856309A4
Authority
EP
European Patent Office
Prior art keywords
selective catalytic
conductive substrates
catalytic activation
activation
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06734240A
Other languages
German (de)
French (fr)
Other versions
EP1856309A2 (en
Inventor
Kenneth Crouse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of EP1856309A2 publication Critical patent/EP1856309A2/en
Publication of EP1856309A4 publication Critical patent/EP1856309A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP06734240A 2005-02-03 2006-02-02 Selective catalytic activation of non-conductive substrates Withdrawn EP1856309A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/049,828 US20050241951A1 (en) 2004-04-30 2005-02-03 Selective catalytic activation of non-conductive substrates
PCT/US2006/003730 WO2006084064A2 (en) 2005-02-03 2006-02-02 Selective catalytic activation of non-conductive substrates

Publications (2)

Publication Number Publication Date
EP1856309A2 EP1856309A2 (en) 2007-11-21
EP1856309A4 true EP1856309A4 (en) 2009-10-28

Family

ID=36777926

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06734240A Withdrawn EP1856309A4 (en) 2005-02-03 2006-02-02 Selective catalytic activation of non-conductive substrates

Country Status (6)

Country Link
US (1) US20050241951A1 (en)
EP (1) EP1856309A4 (en)
JP (1) JP2008528812A (en)
CN (1) CN101142343A (en)
BR (1) BRPI0607133B1 (en)
WO (1) WO2006084064A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007037248A1 (en) * 2006-09-15 2008-03-27 Samsung Electro - Mechanics Co., Ltd., Suwon Method for producing a metal film conductor forming body
GB0619539D0 (en) 2006-10-04 2006-11-15 Hexcel Composites Ltd Curable resin films
JP2008184679A (en) * 2007-01-31 2008-08-14 Okuno Chem Ind Co Ltd Activation composition for electroless palladium plating
US20090128417A1 (en) * 2007-11-16 2009-05-21 Rcd Technology, Inc. Electroless/electrolytic seed layer process
JP5418497B2 (en) * 2008-06-11 2014-02-19 コニカミノルタ株式会社 Metal pattern forming method and metal pattern
KR20100013033A (en) * 2008-07-30 2010-02-09 삼성전자주식회사 Conductive ink/paste printed circuit board having plating layer and method for manufacturing the same
JP5396871B2 (en) * 2009-01-20 2014-01-22 コニカミノルタ株式会社 Ink jet ink and metal pattern forming method
EP2227075B1 (en) * 2009-03-03 2012-03-14 Konica Minolta IJ Technologies, Inc. Forming method of metallic pattern
JP5375725B2 (en) * 2010-04-12 2013-12-25 コニカミノルタ株式会社 Metal pattern manufacturing method and metal pattern
JP2011222797A (en) * 2010-04-12 2011-11-04 Konica Minolta Ij Technologies Inc Catalyst pattern manufacturing method and metal pattern manufacturing method
US8620271B2 (en) * 2011-04-29 2013-12-31 Apple Inc. Compact form factor integrated circuit card and methods
CN103041858B (en) * 2011-08-17 2015-12-16 罗门哈斯电子材料有限公司 For the stable not tin-containing catalyst of chemical plating
JP2015523235A (en) * 2012-05-11 2015-08-13 ユニピクセル ディスプレイズ，インコーポレーテッド Ink composition for producing high-definition conductive pattern
CN103572263B (en) * 2012-07-28 2016-05-11 比亚迪股份有限公司 The method of metallization of plastic surface and surface have the plastic product of metal pattern
KR101735223B1 (en) * 2012-07-30 2017-05-12 이스트맨 코닥 캄파니 Ink formulations for flexographic printing of high-resolution conducting patterns
CN103700930A (en) * 2012-09-27 2014-04-02 启碁科技股份有限公司 Manufacturing method for metallic component and manufacturing method for antenna component
USD749062S1 (en) * 2013-01-02 2016-02-09 Callas Enterprises Llc Combined floor mat and EAS antenna
JP6266353B2 (en) * 2013-02-20 2018-01-24 三菱製紙株式会社 Conductive material precursor and method for producing conductive material
CN104637902A (en) * 2013-11-06 2015-05-20 上海蓝沛新材料科技股份有限公司 Intelligent card module
CN104716423A (en) * 2013-12-12 2015-06-17 位速科技股份有限公司 Three-dimensional antenna manufacturing method
CN104407729B (en) * 2014-10-14 2018-01-09 业成光电（深圳）有限公司 Electronic installation, touch screen, the preparation method of nesa coating and nesa coating
KR101681663B1 (en) * 2016-07-12 2016-12-12 문길환 Conductive Pattern Laminate and Producing Method Thereof
EP3364190A1 (en) * 2017-02-20 2018-08-22 Panka Cancer Research AG Method of detecting cancer or cancer cells
GB201805131D0 (en) * 2018-03-29 2018-05-16 Imperial Innovations Ltd Metal fabrics and membranes
CN108624907A (en) * 2018-04-26 2018-10-09 复旦大学 Nonmetal basal body efficient catalytic electrode and preparation method thereof
US11015255B2 (en) 2018-11-27 2021-05-25 Macdermid Enthone Inc. Selective plating of three dimensional surfaces to produce decorative and functional effects

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
US4368281A (en) * 1980-09-15 1983-01-11 Amp Incorporated Printed circuits
WO1992021790A1 (en) * 1991-06-07 1992-12-10 Monsanto Company Fabricating metal articles from printed images
US20020001709A1 (en) * 2000-01-20 2002-01-03 Jochen Voss Primer for metallizing substrate surfaces
US6461678B1 (en) * 1997-04-29 2002-10-08 Sandia Corporation Process for metallization of a substrate by curing a catalyst applied thereto

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063092A (en) * 1964-05-07 1967-03-30 Sperry Gyroscope Co Ltd Improvements in metal plating processes
US3937857A (en) * 1974-07-22 1976-02-10 Amp Incorporated Catalyst for electroless deposition of metals
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
JPS586781B2 (en) * 1975-10-21 1983-02-07 富士写真フイルム株式会社 Kinzoku Haku Makakei Seihou
US4560445A (en) * 1984-12-24 1985-12-24 Polyonics Corporation Continuous process for fabricating metallic patterns on a thin film substrate
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
DE3627256A1 (en) * 1986-08-12 1988-02-18 Bayer Ag METHOD FOR IMPROVING THE ADHESIVITY OF ELECTRICALLY DEPOSED METAL LAYERS ON PLASTIC SURFACES
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4794147A (en) * 1987-07-24 1988-12-27 Basf Corporation, Inmont Division Novel non-ionic polyurethane resins having polyether backbones in water-dilutable basecoats
US5076841A (en) * 1990-05-31 1991-12-31 Shipley Company Inc. Coating composition
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
DE4036591A1 (en) * 1990-11-16 1992-05-21 Bayer Ag PRIMER FOR METALLIZING SUBSTRATE SURFACES
BE1007879A3 (en) * 1994-01-05 1995-11-07 Blue Chips Holding Polymer resin viscosity adjustable for filing on palladium catalyst substrate, method of preparation and use.
US5622652A (en) * 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
US6356234B1 (en) * 1996-06-12 2002-03-12 R T Microwave Limited Electrical circuit
DE19624071A1 (en) * 1996-06-17 1997-12-18 Bayer Ag Process for the production of sheet-like metal-coated foils
US6054507A (en) * 1997-03-10 2000-04-25 Japan Science And Technology Corporation Metal-organic polymer composite structure and production thereof
JP3418322B2 (en) * 1997-08-28 2003-06-23 日本電信電話株式会社 IC card with use status display function and IC card system
GB2336594A (en) * 1998-04-21 1999-10-27 Coates Brothers Plc Radiation-curable Ink Compositions
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
CN1242659C (en) * 1998-12-03 2006-02-15 Rt微波有限公司 Method for depositing conductive layer on substrate
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
JP3614707B2 (en) * 1999-04-28 2005-01-26 住友大阪セメント株式会社 Method for producing translucent conductive film and translucent conductive film
JP2001011643A (en) * 1999-06-25 2001-01-16 Inoac Corp Plating method for nonconductor
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6271793B1 (en) * 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
US6593524B1 (en) * 2000-06-15 2003-07-15 Thomas Toedtman Device and method for providing EMI/RFI shielding
GB0025990D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts and electronic packaging substrates plated therewith
US6697248B1 (en) * 2001-02-06 2004-02-24 Daniel Luch Electromagnetic interference shields and methods of manufacture
JP2004527663A (en) * 2001-06-04 2004-09-09 キネティック リミテッド Patterning method
US6665193B1 (en) * 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
JP2004068119A (en) * 2002-08-08 2004-03-04 Sumitomo Osaka Cement Co Ltd Method for manufacturing metallic pattern film
JP5095909B2 (en) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Catalyst composition and deposition method
JP2005024658A (en) * 2003-06-30 2005-01-27 Taiyo Ink Mfg Ltd Curable composition
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
US4368281A (en) * 1980-09-15 1983-01-11 Amp Incorporated Printed circuits
WO1992021790A1 (en) * 1991-06-07 1992-12-10 Monsanto Company Fabricating metal articles from printed images
US6461678B1 (en) * 1997-04-29 2002-10-08 Sandia Corporation Process for metallization of a substrate by curing a catalyst applied thereto
US20020001709A1 (en) * 2000-01-20 2002-01-03 Jochen Voss Primer for metallizing substrate surfaces

Also Published As

Publication number Publication date
JP2008528812A (en) 2008-07-31
WO2006084064A3 (en) 2007-10-25
CN101142343A (en) 2008-03-12
WO2006084064A2 (en) 2006-08-10
BRPI0607133B1 (en) 2016-11-29
BRPI0607133A2 (en) 2009-08-04
EP1856309A2 (en) 2007-11-21
US20050241951A1 (en) 2005-11-03

Similar Documents

Publication Publication Date Title
EP1856309A4 (en) Selective catalytic activation of non-conductive substrates
EP1751328A4 (en) Selective catalytic activation of non-conductive substrates
GB0614445D0 (en) Control of selective catalytic reduction
GB0507139D0 (en) Catalyst
HK1145022A1 (en) Processes
EP1908520A4 (en) Peroxide-degrading catalyst
GB0603501D0 (en) Catalyst
GB0614909D0 (en) Catalyst
GB0510316D0 (en) Catalyst manufacture
GB0504622D0 (en) Catalytic reactors
GB0515690D0 (en) Asymmetric catalytic reduction
GB0512791D0 (en) Catalysts
EP1947717A4 (en) Electrode catalyst layer
GB0402487D0 (en) Catalytic process
ZA200800967B (en) Supported gold catalyst
EP1961482A4 (en) Catalyst carrier
TWI316095B (en) Plated substrate
GB0501623D0 (en) Reaction method
AP2850A (en) Selective havester
GB0503818D0 (en) Catalysts
GB0506976D0 (en) Catalyst supports
PT1907540E (en) In-solution activation of factor vii
GB0823455D0 (en) Catalytic reaction process
GB2442363B (en) Catalyst
IL197562A0 (en) Selective chemokine modulation

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070628

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

R17D Deferred search report published (corrected)

Effective date: 20071025

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE ES FR GB IT

A4 Supplementary search report drawn up and despatched

Effective date: 20090925

17Q First examination report despatched

Effective date: 20100126

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20200213