EP1856309A4 - Selektive katalytische aktivierung nichtleitender substrate - Google Patents
Selektive katalytische aktivierung nichtleitender substrateInfo
- Publication number
- EP1856309A4 EP1856309A4 EP06734240A EP06734240A EP1856309A4 EP 1856309 A4 EP1856309 A4 EP 1856309A4 EP 06734240 A EP06734240 A EP 06734240A EP 06734240 A EP06734240 A EP 06734240A EP 1856309 A4 EP1856309 A4 EP 1856309A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- selective catalytic
- conductive substrates
- catalytic activation
- activation
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/049,828 US20050241951A1 (en) | 2004-04-30 | 2005-02-03 | Selective catalytic activation of non-conductive substrates |
PCT/US2006/003730 WO2006084064A2 (en) | 2005-02-03 | 2006-02-02 | Selective catalytic activation of non-conductive substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1856309A2 EP1856309A2 (de) | 2007-11-21 |
EP1856309A4 true EP1856309A4 (de) | 2009-10-28 |
Family
ID=36777926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06734240A Withdrawn EP1856309A4 (de) | 2005-02-03 | 2006-02-02 | Selektive katalytische aktivierung nichtleitender substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050241951A1 (de) |
EP (1) | EP1856309A4 (de) |
JP (1) | JP2008528812A (de) |
CN (1) | CN101142343A (de) |
BR (1) | BRPI0607133B1 (de) |
WO (1) | WO2006084064A2 (de) |
Families Citing this family (26)
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DE102007037248A1 (de) * | 2006-09-15 | 2008-03-27 | Samsung Electro - Mechanics Co., Ltd., Suwon | Verfahren zur Herstellung eines eine Metallfilm-Leiterbahn bildenden Körpers |
GB0619539D0 (en) | 2006-10-04 | 2006-11-15 | Hexcel Composites Ltd | Curable resin films |
JP2008184679A (ja) * | 2007-01-31 | 2008-08-14 | Okuno Chem Ind Co Ltd | 無電解パラジウムめっき用活性化組成物 |
US20090128417A1 (en) * | 2007-11-16 | 2009-05-21 | Rcd Technology, Inc. | Electroless/electrolytic seed layer process |
JP5418497B2 (ja) * | 2008-06-11 | 2014-02-19 | コニカミノルタ株式会社 | 金属パターン形成方法及び金属パターン |
KR20100013033A (ko) * | 2008-07-30 | 2010-02-09 | 삼성전자주식회사 | 도금 층을 구비한 도전성 잉크 및 페이스트 인쇄회로기판및 그 제조 방법 |
JP5396871B2 (ja) * | 2009-01-20 | 2014-01-22 | コニカミノルタ株式会社 | インクジェットインクおよび金属パターン形成方法 |
EP2227075B1 (de) * | 2009-03-03 | 2012-03-14 | Konica Minolta IJ Technologies, Inc. | Verfahren zum Formen von metallischen Mustern |
JP5375725B2 (ja) * | 2010-04-12 | 2013-12-25 | コニカミノルタ株式会社 | 金属パターン製造方法及び金属パターン |
JP2011222797A (ja) * | 2010-04-12 | 2011-11-04 | Konica Minolta Ij Technologies Inc | 触媒パターン製造方法および金属パターン製造方法 |
US8620271B2 (en) * | 2011-04-29 | 2013-12-31 | Apple Inc. | Compact form factor integrated circuit card and methods |
US9138733B2 (en) * | 2011-08-17 | 2015-09-22 | Rohm And Haas Electronic Materials Llc | Stable tin free catalysts for electroless metallization |
GB2517314A (en) * | 2012-05-11 | 2015-02-18 | Unipixel Displays Inc | Ink composition for manufacture of high resolution conducting patterns |
CN103572263B (zh) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | 塑料表面金属化的方法和表面具有金属图案的塑料产品 |
JP6161699B2 (ja) * | 2012-07-30 | 2017-07-12 | イーストマン コダック カンパニー | 高精細導電性パターンのフレキソ印刷向けのインク組成 |
CN103700930A (zh) * | 2012-09-27 | 2014-04-02 | 启碁科技股份有限公司 | 含金属组件的制造方法以及天线组件的制造方法 |
USD749062S1 (en) * | 2013-01-02 | 2016-02-09 | Callas Enterprises Llc | Combined floor mat and EAS antenna |
JP6266353B2 (ja) * | 2013-02-20 | 2018-01-24 | 三菱製紙株式会社 | 導電性材料前駆体および導電性材料の製造方法 |
CN104637902A (zh) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | 一种智能卡模块 |
CN104716423A (zh) * | 2013-12-12 | 2015-06-17 | 位速科技股份有限公司 | 立体天线制造方法 |
CN104407729B (zh) * | 2014-10-14 | 2018-01-09 | 业成光电(深圳)有限公司 | 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 |
KR101681663B1 (ko) * | 2016-07-12 | 2016-12-12 | 문길환 | 전도성 패턴 적층체 및 이의 제조방법 |
EP3364190A1 (de) * | 2017-02-20 | 2018-08-22 | Panka Cancer Research AG | Verfahren zum nachweis von krebs oder krebszellen |
GB201805131D0 (en) * | 2018-03-29 | 2018-05-16 | Imperial Innovations Ltd | Metal fabrics and membranes |
CN108624907A (zh) * | 2018-04-26 | 2018-10-09 | 复旦大学 | 非金属基体高效催化电极及其制备方法 |
US11015255B2 (en) | 2018-11-27 | 2021-05-25 | Macdermid Enthone Inc. | Selective plating of three dimensional surfaces to produce decorative and functional effects |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
GB1403197A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
WO1992021790A1 (en) * | 1991-06-07 | 1992-12-10 | Monsanto Company | Fabricating metal articles from printed images |
US20020001709A1 (en) * | 2000-01-20 | 2002-01-03 | Jochen Voss | Primer for metallizing substrate surfaces |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
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GB1063092A (en) * | 1964-05-07 | 1967-03-30 | Sperry Gyroscope Co Ltd | Improvements in metal plating processes |
US3937857A (en) * | 1974-07-22 | 1976-02-10 | Amp Incorporated | Catalyst for electroless deposition of metals |
US4082898A (en) * | 1975-06-23 | 1978-04-04 | Ppg Industries, Inc. | Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates |
JPS586781B2 (ja) * | 1975-10-21 | 1983-02-07 | 富士写真フイルム株式会社 | キンゾクハクマクケイセイホウ |
US4560445A (en) * | 1984-12-24 | 1985-12-24 | Polyonics Corporation | Continuous process for fabricating metallic patterns on a thin film substrate |
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DE3627256A1 (de) * | 1986-08-12 | 1988-02-18 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen |
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US5076841A (en) * | 1990-05-31 | 1991-12-31 | Shipley Company Inc. | Coating composition |
DE4036591A1 (de) * | 1990-11-16 | 1992-05-21 | Bayer Ag | Primer zum metallisieren von substratoberflaechen |
BE1007879A3 (fr) * | 1994-01-05 | 1995-11-07 | Blue Chips Holding | Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation. |
US5622652A (en) * | 1995-06-07 | 1997-04-22 | Img Group Limited | Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid |
US6356234B1 (en) * | 1996-06-12 | 2002-03-12 | R T Microwave Limited | Electrical circuit |
DE19624071A1 (de) * | 1996-06-17 | 1997-12-18 | Bayer Ag | Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien |
DE69819385T2 (de) * | 1997-03-10 | 2004-09-09 | Japan Science And Technology Corp., Kawaguchi | Herstellungverfahren einer Verbundstruktur bestehend aus metallischen Nanopartikeln umhüllt mit einem organischen Polymer |
JP3418322B2 (ja) * | 1997-08-28 | 2003-06-23 | 日本電信電話株式会社 | 使用状態表示機能付きicカードおよびicカードシステム |
GB2336594A (en) * | 1998-04-21 | 1999-10-27 | Coates Brothers Plc | Radiation-curable Ink Compositions |
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WO2000033625A1 (en) * | 1998-12-03 | 2000-06-08 | Rt Microwave Limited | Process for depositing conducting layer on substrate |
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JP3614707B2 (ja) * | 1999-04-28 | 2005-01-26 | 住友大阪セメント株式会社 | 透光性導電膜の製造方法及び透光性導電膜 |
JP2001011643A (ja) * | 1999-06-25 | 2001-01-16 | Inoac Corp | 不導体のめっき方法 |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US6271793B1 (en) * | 1999-11-05 | 2001-08-07 | International Business Machines Corporation | Radio frequency (RF) transponder (Tag) with composite antenna |
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US6665193B1 (en) * | 2002-07-09 | 2003-12-16 | Amerasia International Technology, Inc. | Electronic circuit construction, as for a wireless RF tag |
JP2004068119A (ja) * | 2002-08-08 | 2004-03-04 | Sumitomo Osaka Cement Co Ltd | 金属パターン膜の製造方法 |
JP5095909B2 (ja) * | 2003-06-24 | 2012-12-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 触媒組成物および析出方法 |
JP2005024658A (ja) * | 2003-06-30 | 2005-01-27 | Taiyo Ink Mfg Ltd | 硬化性組成物 |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
-
2005
- 2005-02-03 US US11/049,828 patent/US20050241951A1/en not_active Abandoned
-
2006
- 2006-02-02 WO PCT/US2006/003730 patent/WO2006084064A2/en active Application Filing
- 2006-02-02 JP JP2007554216A patent/JP2008528812A/ja active Pending
- 2006-02-02 EP EP06734240A patent/EP1856309A4/de not_active Withdrawn
- 2006-02-02 CN CNA200680002175XA patent/CN101142343A/zh active Pending
- 2006-02-02 BR BRPI0607133A patent/BRPI0607133B1/pt active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
GB1403197A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
WO1992021790A1 (en) * | 1991-06-07 | 1992-12-10 | Monsanto Company | Fabricating metal articles from printed images |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
US20020001709A1 (en) * | 2000-01-20 | 2002-01-03 | Jochen Voss | Primer for metallizing substrate surfaces |
Also Published As
Publication number | Publication date |
---|---|
EP1856309A2 (de) | 2007-11-21 |
US20050241951A1 (en) | 2005-11-03 |
CN101142343A (zh) | 2008-03-12 |
BRPI0607133B1 (pt) | 2016-11-29 |
WO2006084064A2 (en) | 2006-08-10 |
BRPI0607133A2 (pt) | 2009-08-04 |
WO2006084064A3 (en) | 2007-10-25 |
JP2008528812A (ja) | 2008-07-31 |
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