TWI316095B - Plated substrate - Google Patents
Plated substrateInfo
- Publication number
- TWI316095B TWI316095B TW095111454A TW95111454A TWI316095B TW I316095 B TWI316095 B TW I316095B TW 095111454 A TW095111454 A TW 095111454A TW 95111454 A TW95111454 A TW 95111454A TW I316095 B TWI316095 B TW I316095B
- Authority
- TW
- Taiwan
- Prior art keywords
- plated substrate
- plated
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105625 | 2005-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200643215A TW200643215A (en) | 2006-12-16 |
TWI316095B true TWI316095B (en) | 2009-10-21 |
Family
ID=37114947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095111454A TWI316095B (en) | 2005-04-01 | 2006-03-31 | Plated substrate |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4926053B2 (en) |
KR (1) | KR20070114391A (en) |
CN (2) | CN101942652B (en) |
HK (1) | HK1116838A1 (en) |
TW (1) | TWI316095B (en) |
WO (1) | WO2006112215A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007031740A (en) * | 2005-07-22 | 2007-02-08 | Shinko Electric Ind Co Ltd | Electronic component, and its manufacturing method |
JP5288362B2 (en) * | 2007-01-17 | 2013-09-11 | 奥野製薬工業株式会社 | Multilayer plating film and printed wiring board |
JP5013077B2 (en) | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | Electroless gold plating method and electronic component |
ATE503037T1 (en) * | 2008-10-17 | 2011-04-15 | Atotech Deutschland Gmbh | STRESS-REDUCED NI-P/PD STACKS FOR WAFER SURFACE |
JP5680342B2 (en) | 2009-09-02 | 2015-03-04 | Tdk株式会社 | Plating film, printed wiring board and module substrate |
JPWO2011099597A1 (en) * | 2010-02-15 | 2013-06-17 | 株式会社Jcu | Method for manufacturing printed wiring board |
CN102802364B (en) * | 2012-09-11 | 2014-11-05 | 深圳市和美精艺科技有限公司 | Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof |
JP6466521B2 (en) * | 2017-06-28 | 2019-02-06 | 小島化学薬品株式会社 | Electroless plating process |
JP7046047B2 (en) * | 2017-12-19 | 2022-04-01 | Jx金属株式会社 | Semiconductor wafers and their manufacturing methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04307736A (en) * | 1991-04-04 | 1992-10-29 | Canon Inc | Interconnection method of fine multilayer-structure semiconductor element |
JPH081980B2 (en) * | 1993-11-25 | 1996-01-10 | 大日工業株式会社 | Printed wiring board and manufacturing method thereof |
JP2785102B2 (en) * | 1994-03-31 | 1998-08-13 | 株式会社ジャパンエナジー | Electroless gold plating method |
JP3345529B2 (en) * | 1995-06-20 | 2002-11-18 | 日立化成工業株式会社 | Wire bonding terminal, method of manufacturing the same, and method of manufacturing semiconductor mounting substrate using the wire bonding terminal |
JPH09172236A (en) * | 1995-12-20 | 1997-06-30 | Seiichi Serizawa | Printed-wiring board |
JPH10287994A (en) * | 1997-04-14 | 1998-10-27 | World Metal:Kk | Plating structure of bonding part |
JP2001358164A (en) * | 2000-06-13 | 2001-12-26 | Ne Chemcat Corp | Electrode formed with electroless multilayer plating film thereon, and its manufacturing method |
CN1143656C (en) * | 2001-01-10 | 2004-03-31 | 中国科学院上海原子核研究所 | Radioactive 32P blood vessel support and its manufacture |
JP2003226993A (en) * | 2002-02-01 | 2003-08-15 | Electroplating Eng Of Japan Co | Gold plating solution and gold plating treatment method |
-
2006
- 2006-03-13 CN CN2010101334459A patent/CN101942652B/en active Active
- 2006-03-13 KR KR1020077023727A patent/KR20070114391A/en not_active Application Discontinuation
- 2006-03-13 WO PCT/JP2006/304881 patent/WO2006112215A1/en active Application Filing
- 2006-03-13 CN CN200680009942XA patent/CN101151399B/en active Active
- 2006-03-13 JP JP2007521139A patent/JP4926053B2/en active Active
- 2006-03-31 TW TW095111454A patent/TWI316095B/en active
-
2008
- 2008-06-18 HK HK08106771.4A patent/HK1116838A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
HK1116838A1 (en) | 2009-01-02 |
CN101151399B (en) | 2010-12-29 |
JP4926053B2 (en) | 2012-05-09 |
CN101942652A (en) | 2011-01-12 |
WO2006112215A1 (en) | 2006-10-26 |
CN101942652B (en) | 2012-06-27 |
TW200643215A (en) | 2006-12-16 |
CN101151399A (en) | 2008-03-26 |
KR20070114391A (en) | 2007-12-03 |
JPWO2006112215A1 (en) | 2008-12-04 |
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