EP1476923B1 - Electrotechnical device - Google Patents

Electrotechnical device Download PDF

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Publication number
EP1476923B1
EP1476923B1 EP03742500A EP03742500A EP1476923B1 EP 1476923 B1 EP1476923 B1 EP 1476923B1 EP 03742500 A EP03742500 A EP 03742500A EP 03742500 A EP03742500 A EP 03742500A EP 1476923 B1 EP1476923 B1 EP 1476923B1
Authority
EP
European Patent Office
Prior art keywords
component
chamber
housing
opening
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP03742500A
Other languages
German (de)
French (fr)
Other versions
EP1476923A1 (en
Inventor
Wolfgang Brutschin
Volker Dreyer
Gottfried Hintner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP1476923A1 publication Critical patent/EP1476923A1/en
Application granted granted Critical
Publication of EP1476923B1 publication Critical patent/EP1476923B1/en
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/933—Special insulation
    • Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive

Definitions

  • the invention relates to an electrotechnical device.
  • Modern electrical equipment e.g. Measuring instruments usually have several components. These components, e.g. Sensors, electronic modules, etc., are now preferably modular.
  • a modular design makes it possible to offer the device in a variety of different variants without having to stock all variants in sufficient quantities. Only the components that are combined as needed need to be in stock.
  • a modular design offers advantages in manufacturing. From the components in a short time a special variant of the device can be produced. Preferably, the components are connected by simple plug-in connections.
  • a modular measuring device which comprises a first housing part, a second housing part, which is connected to the first housing part to form a common cavity, a sensor assembly and an electronic module.
  • the sensor assembly is inserted into the first housing part and conductively connected to the electronics assembly.
  • the second housing part has electrical connections projecting into the cavity. These connections are connected to the electronics assembly via a slip connection.
  • a potting material e.g. a silicone rubber
  • the potting material is filled in the liquid state in the device. If the liquid potting compound in the range of electrical connectors, the quality of an electrical connection between the contacts to be connected through the connector can be affected by the potting or even disturbed sustainable.
  • the first component is an electronic module.
  • the second component is a sensor module.
  • the chamber is a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins penetrate the rear wall, so that the rear wall of the chamber where the pins penetrate it, self-sealing by the plastic with low Shore hardness.
  • Fig. 1 shows an exploded view of an electrical device according to the invention.
  • it is an electromechanical level sensor for detecting and / or monitoring a predetermined level in a container, as used in the measurement and control technology.
  • the device has a housing 1.
  • the housing 1 is formed as a Einschraub published with a threaded portion 3 and a hexagonal head 5.
  • a cylindrical interior of the housing 1 is hollow and closed at a lower end by a membrane 7. On the membrane 7 ends of two oscillating rods 9 are formed.
  • the level sensor is mounted in a provided with an internal thread opening of a container wall, that the oscillating rods protrude into the interior of the container and come into contact with a product in the container when it reaches the predetermined level.
  • the first component 11 is an electronic module in the illustrated embodiment. It consists essentially of an arranged on two printed circuit boards 15 electronic circuit.
  • the first component 11 has at least one end protruding contact pin 17. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.
  • the second component 13 is e.g. a sensor assembly.
  • the sensor assembly includes an electromechanical transducer. This consists e.g. from arranged in a stack piezoelectric elements.
  • the electromechanical transducer includes an excitation and a receive transducer. When an AC voltage is applied to the excitation transducer, it causes the diaphragm 7 to vibrate, which in turn is transmitted to the oscillating rods 9 so that they oscillate perpendicularly to their longitudinal axis. When mechanical vibrations are applied to the receiving transducers, they generate an alternating electrical voltage with the frequency of the oscillation.
  • the electronics assembly includes an amplifier which receives at input the AC voltage generated by the receiving transducer and at the output transmits the amplified AC voltage to the excitation transducer.
  • the mechanical vibration system formed by the diaphragm 7 and the oscillating rods 9 is located in the feedback circuit of the amplifier via the electromechanical transducer, so that it is excited to oscillate at a self-resonant frequency. If the oscillating rods 9 are not in contact with the contents, the natural frequency of the mechanical vibration system is higher than when the oscillating rods 9 dive into the medium.
  • the electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the AC voltage delivered by the amplifier is above or below a predetermined threshold value. If the frequency is above the threshold value, the oscillating rods 9 oscillate freely; if it is below it, the oscillating rods 9 are covered by the medium.
  • the first and second components 11, 13 are both arranged in the housing 1.
  • the second component 13 comprises a base element 18 and a base 19 formed thereon.
  • contact plugs 21 are provided which are provided for receiving the contact pins 17.
  • FIGS. 2 and 3 are two cuts of the in Fig. 1 shown illustrated device. For better clarity, the oscillating rods 9 are not shown. The cuts are in cutting planes, which are rotated 90 ° against each other.
  • an insert 23 is arranged.
  • the insert 23 serves to receive the first component 11.
  • the insert 23 has a nearly cylindrical portion 25 into which the electronics assembly is inserted through an end-side first opening 27.
  • a holder for the printed circuit boards 15 is provided in the cylindrical portion 25.
  • a rear wall 29 At a side opposite the opening 27 side of the cylindrical portion 25 is closed by a rear wall 29.
  • a closed chamber 31 is integrally formed on one of the first opening 27 opposite side of the rear wall 29.
  • the chamber 31 preferably forms a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins 17 penetrate the rear wall 29.
  • the chamber 31 is an integral part of the insert 23, which is then preferably completely formed as a two-component injection-molded part.
  • the rear wall 29 of the chamber 31 is formed where the contact pins 17 penetrate it from a plastic with a lower Shore hardness.
  • a soft plastic encloses the Contact pins 17 tight and is thussabêtnd in the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. Just by passing through the contact pins 17, the seal is effected.
  • the insert 23 consists e.g. made of polycarbonate (PC) and as a soft plastic is e.g. a thermoplastic polymer.
  • PC polycarbonate
  • soft plastic e.g. a thermoplastic polymer.
  • the choice of soft plastic is limited to those materials which, where the contact pins 17 penetrate, ensure an airtight self-seal.
  • the chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted.
  • the contact pins 17 are inserted through the opening 33 opposite the rear wall 29 into the contact plug 21 of the base 19.
  • the housing 1 is filled with a potting material from an opening 33 of the chamber 31 opposite side.
  • the potting material is shown in the figures as composed of wagerechten dashed lines hatching.
  • potting material e.g. a gel-type two-component silicone rubber which is liquid after mixing the two components and then vulcanized by addition crosslinking.
  • the device is filled with potting material by placing the device in an upright position. In this case, the opening 33 of the chamber 31 down and the rear wall 29 of the chamber 31 upwards.
  • the potting material is filled in this position from above into the housing 1.
  • the terms above and below refer to the filling positions shown in the drawing.
  • the potting material flows into the housing and penetrates through the opening 27 in the insert 23 a.
  • the cylindrical portion 25 is completely filled with potting material.
  • potting material flows outside the insert 23 around and passes in this way to the base member 18 of the second component 13. If the base member 18 has openings for this purpose, and interior spaces of the base member 18 can be filled with potting material.
  • the potting material fills the entire interior of the device from bottom to top slowly and closes when climbing the chamber 31st
  • the chamber 31 forms a protective sleeve, on which the potting material flows on the outside.
  • the existing in the interior of the chamber 31 plug connection between the contact pins 17 and the contact plugs 21 is covered by the chamber 31.
  • the region of the connector thus remains recessed from the potting material.
  • the device may also have two or more connections between individual components, which are recessed in the inventive manner of potting material.
  • the orientations of the individual chambers it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Casings For Electric Apparatus (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Seal Device For Vehicle (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

An electrotechnical device is provided, having components connected by means of plug connections. The interior of the device is filled with a casting material. The device includes: a housing; arranged in the housing a first components which has at least one terminally-protruding contact pin; a second component which has a socket on which terminally-located contact plugs are provided for receiving the contact pins; and an insert in which the first component is arranged. The insert includes a secluded chamber which has an opening into which the socket of the second component is introduced. The chamber additionally includes a rear wall lying opposite the opening through which the contact pins are stuck into the contact plugs of the socket. An air-tight seal exists between the contact pins and the rear wall. The housing is filled with the casting material from an end lying opposite to the opening of the chamber.

Description

Die Erfindung betrifft ein elektrotechnisches Gerät.The invention relates to an electrotechnical device.

Moderne elektrotechnische Geräte, z.B. Meßgeräte, weisen in der Regel mehrere Komponenten auf. Diese Komponenten, z.B. Sensoren, Elektronikbaugruppen etc., werden heute bevorzugt modular aufgebaut. Ein modularer Aufbau erlaubt es das Gerät in einer Vielzahl verschiedener Varianten anzubieten, ohne das alle Varianten in ausreichender Stückzahl vorrätig sein müssen. Es müssen lediglich die Komponenten, die nach Bedarf kombiniert werden auf Lager sein. Außerdem bietet ein modularer Aufbau Vorteile bei der Fertigung. Aus den Komponenten ist in kurzer Zeit eine spezielle Variante des Geräts herstellbar. Vorzugsweise werden die Komponenten durch einfache Steckverbindungen miteinander verbunden.Modern electrical equipment, e.g. Measuring instruments usually have several components. These components, e.g. Sensors, electronic modules, etc., are now preferably modular. A modular design makes it possible to offer the device in a variety of different variants without having to stock all variants in sufficient quantities. Only the components that are combined as needed need to be in stock. In addition, a modular design offers advantages in manufacturing. From the components in a short time a special variant of the device can be produced. Preferably, the components are connected by simple plug-in connections.

Beispielsweise aus der Schrift EP 0991307 A2 ist ein modular aufgebautes Messgerät bekannt, welches ein erstes Gehäuseteil, ein zweites Gehäuseteil, das mit dem ersten Gehäuseteil zur Bildung eines gemeinsamen Hohlraums verbunden ist, eine Sensorbaugruppe und eine Elektronikbaugruppe umfasst. Die Sensorbaugruppe ist in das erste Gehäuseteil eingebracht, und mit der Elektronikbaugruppe leitfähig verbunden. Das zweite Gehäuseteil weist in den Hohlraum hinein ragende elektrische Anschlüsse auf. Diese Anschlüsse sind mit der Elektronikbaugruppe über eine Rutschverbindung verbunden.For example, from the Scriptures EP 0991307 A2 a modular measuring device is known, which comprises a first housing part, a second housing part, which is connected to the first housing part to form a common cavity, a sensor assembly and an electronic module. The sensor assembly is inserted into the first housing part and conductively connected to the electronics assembly. The second housing part has electrical connections projecting into the cavity. These connections are connected to the electronics assembly via a slip connection.

Häufig ist es erforderlich einen verbleibenden Innenraum des fertigen Geräts mit einem Vergußmaterial, z.B. einem Silikonkautschuk, zu vergießen, um z.B. ein Eindringen von Feuchtigkeit zu verhindern. Das Vergußmaterial wird dabei im flüssigen Zustand in das Gerät eingefüllt. Gelangt die flüssige Vergußmasse in den Bereich von elektrischen Steckverbindungen kann die Qualität einer elektrischen Verbindung zwischen den durch die Steckverbindung zu verbindenden Kontakten durch das Vergußmaterial beeinträchtigt oder sogar nachhaltig gestört werden.Often it is necessary to leave a remaining interior of the finished device with a potting material, e.g. a silicone rubber, to cast, e.g. to prevent moisture from entering. The potting material is filled in the liquid state in the device. If the liquid potting compound in the range of electrical connectors, the quality of an electrical connection between the contacts to be connected through the connector can be affected by the potting or even disturbed sustainable.

Es ist eine Aufgabe der Erfindung ein elektrotechnisches Gerät mit mittels Steckverbindungen verbundener Komponenten anzugeben, dessen Innenraum mit einem Vergußmaterial ausgefüllt ist.It is an object of the invention to provide an electrical device with components connected by means of plug-in connections, the interior of which is filled with a potting material.

Hierzu besteht die Erfindung in einem elektrotechnischen Gerät mit

  • einem Gehäuse,
  • einer in dem Gehäuse angeordneten ersten Komponente,
    • -- die mindestens einen endseitig vorstehenden Kontaktstift aufweist,
  • einer in dem Gehäuse angeordneten zweiten Komponente,
    • -- die einen Sockel aufweist, an dem endseitig Kontaktstecker zur Aufnahme der Kontaktstifte vorgesehen sind,
  • einem in dem Gehäuse angeordneten Einsatz,
    • -- in dem die erste Komponente angeordnet ist,
    • -- der eine abgeschlossene Kammer aufweist,
      • --- die eine Öffnung aufweist, in die der Sockel der Komponente eingeführt ist, und
      • --- die eine der Öffnung gegenüberliegende Rückwand aufweist, durch die die Kontaktstifte hindurch in die Kontaktstecker des Sockel gesteckt sind,
  • bei dem zwischen den Kontaktstiften und der Rückwand eine luftdichte Abdichtung besteht, und
  • bei dem das Gehäuse von einer von der Öffnung der Kammer gegenüberliegenden Seite her mit einem Vergußmaterial aufgefüllt ist.
For this purpose, the invention in an electrical device with
  • a housing,
  • a first component disposed in the housing,
    • having at least one end protruding contact pin,
  • a second component disposed in the housing,
    • - Has a base, are provided at the end contact plug for receiving the contact pins,
  • an insert disposed in the housing,
    • in which the first component is arranged,
    • - which has a closed chamber,
      • --- having an opening into which the base of the component is inserted, and
      • --- having a rear wall opposite the opening, through which the contact pins are inserted into the contact plug of the base,
  • in which between the contact pins and the rear wall an airtight seal, and
  • wherein the housing is filled with a potting material from a side opposite the opening of the chamber side.

Gemäß einer Ausgestaltung ist die erste Komponente eine Elektronikbaugruppe.According to one embodiment, the first component is an electronic module.

Gemäß einer Ausgestaltung ist die zweite Komponente eine Sensorbaugruppe.According to one embodiment, the second component is a sensor module.

Gemäß einer Weiterbildung ist die Kammer ein Zweikomponentenspritzgußteil, das an den Stellen, wo die Kontaktstifte die Rückwand durchdringen aus einem Kunststoff mit geringerer Shorehärte besteht, so dass
die Rückwand der Kammer dort wo die Kontaktstifte sie durchdringen, durch den Kunststoff mit geringer Shorehärte selbstabdichtend.According to a development, the chamber is a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins penetrate the rear wall, so that
the rear wall of the chamber where the pins penetrate it, self-sealing by the plastic with low Shore hardness.

Weiter besteht die Erfindung in einem Verfahren zum Verfüllen eines erfindungsgemäßen elektrotechnischen Geräts mit einem Vergußmaterial, bei dem

  • das Gerät in einer aufrechten Position aufgestellt wird, in der die Öffnung der Kammer nach unten und die Rückwand der Kammer nach oben weist, und
  • das Vergußmaterial von oben eingefüllt wird,
  • so daß eine im Inneren der Kammer bestehende Steckverbindung zwischen den Kontaktstiften und den Kontaktsteckern durch die Kammer abgedeckt ist und ein Bereich der Steckverbindung vom Vergußmaterial ausgespart bleibt.
The invention further relates to a method for filling an electrotechnical device according to the invention with a potting material, in which
  • the appliance is placed in an upright position, in which the opening of the chamber faces downwards and the rear wall of the chamber faces upwards, and
  • the potting material is filled from above,
  • so that an existing inside the chamber plug connection between the contact pins and the contact plugs is covered by the chamber and a portion of the connector is recessed from the potting material.

Die Erfindung und weitere Vorteile werden nun anhand der Figuren der Zeichnung, in denen ein Ausführungsbeispiel dargestellt ist, näher erläutert; gleiche Elemente sind in den Figuren mit gleichen Bezugszeichen versehen.

  • Fig. 1 zeigt eine Explosionsdarstellung eines elektrotechnischen Geräts;
  • Fig. 2 zeigt einen Schnitt durch das Gehäuse mit zwei durch eine Steckverbindung verbundene Komponenten; und
  • Fig. 3 zeigt einen Schnitt durch das Gehäuse mit den beiden Komponenten, wobei die Schnittebene gegenüber der in Fig. 2 dargestellten Schnittebene um 90° gedreht ist.
The invention and further advantages will now be explained in more detail with reference to the figures of the drawing, in which an embodiment is shown; the same elements are provided in the figures with the same reference numerals.
  • Fig. 1 shows an exploded view of an electrical device;
  • Fig. 2 shows a section through the housing with two connected by a connector components; and
  • Fig. 3 shows a section through the housing with the two components, wherein the sectional plane opposite to in Fig. 2 Section shown rotated by 90 °.

Fig. 1 zeigt eine Explosionsdarstellung eines erfindungsgemäßen elektrotechnischen Geräts. Fig. 1 shows an exploded view of an electrical device according to the invention.

Bei dem dargestellten Ausführungsbeispiel handelt es sich um einen elektromechanischen Füllstandssensor für die Feststellung und/oder Überwachung eines vorbestimmten Füllstands in einem Behälter, wie er in der Meß- und Regeltechnik eingesetzt wird.In the illustrated embodiment, it is an electromechanical level sensor for detecting and / or monitoring a predetermined level in a container, as used in the measurement and control technology.

Das Gerät weist ein Gehäuse 1 auf. Das Gehäuse 1 ist als ein Einschraubstück mit einem Gewindeabschnitt 3 und einem Sechskantkopf 5 ausgebildet.The device has a housing 1. The housing 1 is formed as a Einschraubstück with a threaded portion 3 and a hexagonal head 5.

Ein zylindrischer Innenraum des Gehäuses 1 ist hohl und an einem unteren Ende durch eine Membran 7 verschlossen. An der Membran 7 sind Enden von zwei Schwingstäben 9 angeformt. Mittels des Einschraubstücks wird der Füllstandssensor so in einer mit einem Innengewinde versehenen Öffnung einer Behälterwand befestigt, daß die Schwingstäbe in das Innere des Behälters ragen und mit einem in dem Behälter befindlichen Füllgut in Berührung kommen, wenn dieses den vorbestimmten Füllstand erreicht.A cylindrical interior of the housing 1 is hollow and closed at a lower end by a membrane 7. On the membrane 7 ends of two oscillating rods 9 are formed. By means of the Einschraubstücks the level sensor is mounted in a provided with an internal thread opening of a container wall, that the oscillating rods protrude into the interior of the container and come into contact with a product in the container when it reaches the predetermined level.

In dem Innenraum ist eine erste Komponente 11 und eine zweite Komponente 13 des elektrotechnischen Geräts angeordnet. Die erste Komponente 11 ist in dem dargestellten Ausführungsbeispiel eine Elektronikbaugruppe. Sie besteht im wesentlichen aus einer auf zwei Leiterplatten 15 angeordneten elektronischen Schaltung. Die erste Komponente 11 weist mindestens einen endseitig vorstehenden Kontaktstift 17 auf. In dem dargestellten Ausführungsbeispiel sind mehrere Kontaktstifte 17 in einer Doppelreihe angeordnet.In the interior, a first component 11 and a second component 13 of the electrical device is arranged. The first component 11 is an electronic module in the illustrated embodiment. It consists essentially of an arranged on two printed circuit boards 15 electronic circuit. The first component 11 has at least one end protruding contact pin 17. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.

Die zweite Komponente 13 ist z.B. eine Sensorbaugruppe. In dem dargestellten Ausführungsbeispiel umfaßt die Sensorbaugruppe einen elektromechanischen Wandler. Dieser besteht z.B. aus in einem Stapel angeordneten piezoelektrischen Elementen. Der elektromechanische Wandler enthält einen Erregungs- und einen Empfangswandler. Wenn an dem Erregungswandler eine Wechselspannung angelegt wird, versetzt er die Membran 7 in Schwingungen, die wiederum auf die Schwingstäbe 9 übertragen werden, so daß diese Schwingungen senkrecht zu deren Längsachse ausführen. Wenn auf den Empfangswandler mechanische Schwingungen einwirken, erzeugen diese eine elektrische Wechselspannung mit der Frequenz der Schwingung.The second component 13 is e.g. a sensor assembly. In the illustrated embodiment, the sensor assembly includes an electromechanical transducer. This consists e.g. from arranged in a stack piezoelectric elements. The electromechanical transducer includes an excitation and a receive transducer. When an AC voltage is applied to the excitation transducer, it causes the diaphragm 7 to vibrate, which in turn is transmitted to the oscillating rods 9 so that they oscillate perpendicularly to their longitudinal axis. When mechanical vibrations are applied to the receiving transducers, they generate an alternating electrical voltage with the frequency of the oscillation.

Die Elektronikbaugruppe enthält einen Verstärker, der am Eingang die von dem Empfangswandler erzeugte Wechselspannung empfängt und am Ausgang die verstärkte Wechselspannung zu dem Erregungswandler überträgt. Somit liegt das von der Membran 7 und den Schwingstäben 9 gebildete mechanische Schwingungssystem über den elektromechanischen Wandler im Rückkopplungskreis des Verstärkers, so daß es sich zu Schwingungen mit einer Eigenresonanzfrequenz erregt. Wenn die Schwingstäbe 9 nicht mit dem Füllgut in Berührung stehen, ist die Eigenfrequenz des mechanischen Schwingungssystems höher als wenn die Schwingstäbe 9 in das Füllgut eintauchen. Die zu der Sensorbaugruppe zugeordnete Elektronikbaugruppe enthält eine zusätzliche Auswerteschaltung, die feststellt, ob die Frequenz der vom Verstärkter abgegebenen Wechselspannung über oder unter einem vorgegebenen Schwellenwert liegt. Liegt die Frequenz oberhalb des Schwellenwerts, so schwingen die Schwingstäbe 9 frei, liegt er unterhalb, so sind die Schwingstäbe 9 vom Füllgut bedeckt.The electronics assembly includes an amplifier which receives at input the AC voltage generated by the receiving transducer and at the output transmits the amplified AC voltage to the excitation transducer. Thus, the mechanical vibration system formed by the diaphragm 7 and the oscillating rods 9 is located in the feedback circuit of the amplifier via the electromechanical transducer, so that it is excited to oscillate at a self-resonant frequency. If the oscillating rods 9 are not in contact with the contents, the natural frequency of the mechanical vibration system is higher than when the oscillating rods 9 dive into the medium. The electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the AC voltage delivered by the amplifier is above or below a predetermined threshold value. If the frequency is above the threshold value, the oscillating rods 9 oscillate freely; if it is below it, the oscillating rods 9 are covered by the medium.

Die erste und die zweite Komponente 11, 13 sind beide in dem Gehäuse 1 angeordnet. Die zweite Komponente 13 umfaßt ein Grundelement 18 und einen daran angeformten Sockel 19. An dem Sockel 19 sind endseitig Kontaktstecker 21 angeordnet, die zur Aufnahme der Kontaktstifte 17 vorgesehen sind.The first and second components 11, 13 are both arranged in the housing 1. The second component 13 comprises a base element 18 and a base 19 formed thereon. On the base 19, contact plugs 21 are provided which are provided for receiving the contact pins 17.

In den Figuren 2 und 3 sind zwei Schnitte des in Fig. 1 dargestellten Geräts dargestellt. Der besseren Übersicht halber sind die Schwingstäbe 9 nicht mit eingezeichnet. Die Schnitte liegen in Schnittebenen, die gegeneinander um 90° gedreht sind.In the FIGS. 2 and 3 are two cuts of the in Fig. 1 shown illustrated device. For better clarity, the oscillating rods 9 are not shown. The cuts are in cutting planes, which are rotated 90 ° against each other.

In dem Gehäuse 1 ist ein Einsatz 23 angeordnet. Der Einsatz 23 dient der Aufnahme der ersten Komponente 11. In dem dargestellten Ausführungsbeispiel weist der Einsatz 23 einen nahezu zylindrischen Abschnitt 25 auf, in den die Elektronikbaugruppe durch eine endseitige erste Öffnung 27 hindurch eingeführt ist. Hierzu ist in dem zylindrischen Abschnitt 25 eine Halterung für die Leiterplatten 15 vorgesehen.In the housing 1, an insert 23 is arranged. The insert 23 serves to receive the first component 11. In the illustrated embodiment, the insert 23 has a nearly cylindrical portion 25 into which the electronics assembly is inserted through an end-side first opening 27. For this purpose, a holder for the printed circuit boards 15 is provided in the cylindrical portion 25.

An einer der Öffnung 27 gegenüberliegenden Seite ist der zylindrische Abschnitt 25 durch eine Rückwand 29 verschlossen.At a side opposite the opening 27 side of the cylindrical portion 25 is closed by a rear wall 29.

An den zylindrischen Abschnitt 25 ist auf einer der ersten Öffnung 27 gegenüberliegenden Seite der Rückwand 29 eine abgeschlossene Kammer 31 angeformt. Beim Einführen der ersten Baugruppe 11 in den Einsatz 23 durchstechen die Kontaktstifte 17 die Rückwand 29 und ragen in die Kammer 31 hinein.On the cylindrical portion 25, a closed chamber 31 is integrally formed on one of the first opening 27 opposite side of the rear wall 29. When inserting the first assembly 11 into the insert 23, the contact pins 17 pierce the rear wall 29 and protrude into the chamber 31.

Zwischen den Kontaktstiften 17 und der Rückwand 29 besteht eine luftdichte Abdichtung.Between the contact pins 17 and the rear wall 29 there is an airtight seal.

Die Kammer 31 bildet vorzugsweise ein Zweikomponentenspritzgußteil, das an den Stellen, wo die Kontaktstifte 17 die Rückwand 29 durchdringen aus einem Kunststoff mit geringerer Shorehärte besteht. Selbstverständlich kann die Kammer 31 integraler Bestandteil des Einsatzes 23, der dann vorzugsweise vollständig als Zweikomponentenspritzgußteil ausgebildet ist.The chamber 31 preferably forms a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins 17 penetrate the rear wall 29. Of course, the chamber 31 is an integral part of the insert 23, which is then preferably completely formed as a two-component injection-molded part.

Vorzugsweise ist bei diesem Zweikomponentenspritzgußteil die Rückwand 29 der Kammer 31 dort wo die Kontaktstifte 17 sie durchdringen aus einem Kunststoff mit geringerer Shorehärte ausgebildet. Ein solcher weicher Kunststoff umschließt die Kontaktstifte 17 eng und ist dadurch im Bereich der Kontaktstifte 17 selbstabdichtend. Dies bietet den Vorteil, daß zur Erzielung einer luftdichten Abdichtung keinerlei Maßnahmen erforderlich sind. Allein durch das Hindurchstecken der Kontaktstifte 17 ist die Abdichtung bewirkt.Preferably, in this two-component injection-molded part, the rear wall 29 of the chamber 31 is formed where the contact pins 17 penetrate it from a plastic with a lower Shore hardness. Such a soft plastic encloses the Contact pins 17 tight and is thus selbstabdichtend in the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. Just by passing through the contact pins 17, the seal is effected.

Der Einsatz 23 besteht z.B. aus Polycarbonat (PC) und als weicher Kunststoff eignet sich z.B. ein thermoplastisches Polymer. Bei der Auswahl des Kunststoffs für den Einsatz 23 ist man relativ frei. Die Wahl des weichen Kunststoff ist jedoch eingeschränkt auf solche Materialien, die dort wo die Kontaktstifte 17 sie durchdringen eine luftdichte Selbstabdichtung gewährleisten.The insert 23 consists e.g. made of polycarbonate (PC) and as a soft plastic is e.g. a thermoplastic polymer. When selecting the plastic for the insert 23 is relatively free. However, the choice of soft plastic is limited to those materials which, where the contact pins 17 penetrate, ensure an airtight self-seal.

Die Kammer 31 weist eine der Rückwand 29 gegenüber angeordnete Öffnung 33 auf, in die der Sockel 19 der zweiten Komponente 13 eingeführt ist. Dabei werden die Kontaktstifte 17 durch die der Öffnung 33 gegenüberliegende Rückwand 29 hindurch in die Kontaktstecker 21 des Sockel 19 gesteckt.The chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted. In this case, the contact pins 17 are inserted through the opening 33 opposite the rear wall 29 into the contact plug 21 of the base 19.

Das Gehäuse 1 ist von einer von der Öffnung 33 der Kammer 31 gegenüberliegenden Seite her mit einem Vergußmaterial aufgefüllt. Das Vergußmaterial ist in den Figuren als aus wagerechten gestrichelten Linien zusammengesetzte Schraffur dargestellt.The housing 1 is filled with a potting material from an opening 33 of the chamber 31 opposite side. The potting material is shown in the figures as composed of wagerechten dashed lines hatching.

Als Vergußmaterial eignet sich z.B. ein gelartiger Zweikomponenten-Silikonkautschuk, der nach dem Mischen der beiden Komponenten flüssig ist und dann durch Additionsvernetzung vulkanisiert.As potting material is suitable, e.g. a gel-type two-component silicone rubber which is liquid after mixing the two components and then vulcanized by addition crosslinking.

Das Gerät wird mit Vergußmaterial verfüllt, indem das Gerät in einer aufrechten Position aufgestellt wird. Dabei weist die Öffnung 33 der Kammer 31 nach unten und die Rückwand 29 der Kammer 31 nach oben.The device is filled with potting material by placing the device in an upright position. In this case, the opening 33 of the chamber 31 down and the rear wall 29 of the chamber 31 upwards.

Das Vergußmaterial wird in dieser Position von oben in das Gehäuse 1 eingefüllt. Die Begriffe oben und unten beziehen sich auf die in der Zeichnung dargestellten Einfüllpositionen.The potting material is filled in this position from above into the housing 1. The terms above and below refer to the filling positions shown in the drawing.

Das Vergußmaterial fließt in das Gehäuse und dringt durch die Öffnung 27 in den Einsatz 23 ein. Dabei wird der zylindrische Bereich 25 vollständig mit Vergußmaterial ausgefüllt. Zusätzlich fließt Vergußmaterial außen um den Einsatz 23 herum und gelangt auf diesem Weg zu dem Grundelement 18 der zweiten Komponente 13. Sofern das Grundelement 18 Öffnungen hierfür aufweist, können auch Innenräume des Grundelements 18 mit Vergußmaterial aufgefüllt werden.The potting material flows into the housing and penetrates through the opening 27 in the insert 23 a. In this case, the cylindrical portion 25 is completely filled with potting material. In addition, potting material flows outside the insert 23 around and passes in this way to the base member 18 of the second component 13. If the base member 18 has openings for this purpose, and interior spaces of the base member 18 can be filled with potting material.

Das Vergußmaterial füllt den gesamten Innenraum des Geräts von unten nach oben langsam auf und verschließt beim Hochsteigen die Kammer 31.The potting material fills the entire interior of the device from bottom to top slowly and closes when climbing the chamber 31st

In die Kammer 31 kann dagegen kein Vergußmaterial eindringen. Beim Einfüllen des Vergußmaterials von oben bildet die Kammer 31 eine Schutzhülse, an der das Vergußmaterial außen abfließt.In contrast, no potting material can penetrate into the chamber 31. When filling the potting material from above, the chamber 31 forms a protective sleeve, on which the potting material flows on the outside.

Von unten durch die Öffnung 33 kann ebenfalls kein Vergußmaterial eindringen, da die eingeschlossene Luft dem entgegenwirkt. Genau wie bei einem Becher, den man mit der Öffnung nach unten in Wasser taucht, verhindert der Druck der eingeschlossenen Luft auch hier ein Eindringen von Flüssigkeit. Eine Abdichtung der Öffnung 33 ist nicht erforderlich.From below through the opening 33 can also penetrate no potting material, since the trapped air counteracts. Just as with a cup that you dive into the water with the opening down, the pressure of the trapped air also prevents ingress of liquid. A seal of the opening 33 is not required.

Die im Inneren der Kammer 31 bestehende Steckverbindung zwischen den Kontaktstiften 17 und den Kontaktsteckern 21 ist durch die Kammer 31 abgedeckt. Der Bereich der Steckverbindung bleibt folglich vom Vergußmaterial ausgespart.The existing in the interior of the chamber 31 plug connection between the contact pins 17 and the contact plugs 21 is covered by the chamber 31. The region of the connector thus remains recessed from the potting material.

Selbstverständlich kann das Gerät auch zwei oder mehr Steckverbindungen zwischen einzelnen Komponenten aufweisen, die auf die erfindungsgemäße Weise von Vergußmaterial ausgespart sind. Hierzu ist es lediglich erforderlich die Orientierungen der einzelnen Kammern so anzuordnen, daß deren Rückwände in die gleiche Richtung weisen.Of course, the device may also have two or more connections between individual components, which are recessed in the inventive manner of potting material. For this purpose, it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.

Claims (5)

  1. Electrotechnical device with
    - a housing (1)
    - a first component (11) arranged in the housing (1)
    -- where said component has at least one contact pin (17) projecting at the end
    - a second component (13) arranged in the housing (1)
    -- where said component has a base (18) on which contact plugs (21) to accommodate the contact pins (17) are arranged at the end, characterized in that an insert (23) arranged in the housing (1)
    -- in which the first component (11) is arranged
    -- which has a sealed chamber (31)
    --- which has an opening (33) into which the base (18) of the second component (13) is inserted and
    --- which has a rear panel (29) opposite the opening (33) through which the contact pins (17) are inserted into the contact plugs (21) of the base (18)
    - where there is an air-tight seal between the contact pins (17) and the rear panel (29)
    - where the housing (1) is filled with a sealing material from a side opposite the opening (33) in the chamber (31).
  2. Device as per Claim 1 where the first component (11) is an electronics assembly.
  3. Device as per Claim 1 where the second component (12) is a sensor assembly.
  4. Device as per Claim 1, where the chamber (31) is a dual-component injection molding part which, at the points where the contact pins (17) penetrate the rear panel (29), are made from a plastic with a low Shore hardness such that the plastic ensures air-tight self-sealing in the places where it is penetrated by the contact points.
  5. Method for filling a device as per one of the previous claims with a sealing material where
    - the device is put in an upright position in which the opening (33) of the chamber (31) points downwards and the rear panel (29) of the chamber (31) points upwards and
    - the sealing material is poured in from the top
    - such that a plug connection - inside the chamber - between the contact pins (17) and the contact plugs (21) is covered by the chamber (31) and a part of the plug connection is left free from the sealing material.
EP03742500A 2002-02-23 2003-01-24 Electrotechnical device Expired - Lifetime EP1476923B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10207762A DE10207762A1 (en) 2002-02-23 2002-02-23 Electrotechnical device
DE10207762 2002-02-23
PCT/EP2003/000712 WO2003071636A1 (en) 2002-02-23 2003-01-24 Electrotechnical device

Publications (2)

Publication Number Publication Date
EP1476923A1 EP1476923A1 (en) 2004-11-17
EP1476923B1 true EP1476923B1 (en) 2011-05-04

Family

ID=27674898

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03742500A Expired - Lifetime EP1476923B1 (en) 2002-02-23 2003-01-24 Electrotechnical device

Country Status (7)

Country Link
US (1) US6991475B2 (en)
EP (1) EP1476923B1 (en)
CN (1) CN100352107C (en)
AT (1) ATE508500T1 (en)
AU (1) AU2003247310A1 (en)
DE (2) DE10207762A1 (en)
WO (1) WO2003071636A1 (en)

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Also Published As

Publication number Publication date
WO2003071636A1 (en) 2003-08-28
ATE508500T1 (en) 2011-05-15
AU2003247310A1 (en) 2003-09-09
DE10207762A1 (en) 2003-09-04
US6991475B2 (en) 2006-01-31
EP1476923A1 (en) 2004-11-17
US20050255733A1 (en) 2005-11-17
CN1639924A (en) 2005-07-13
DE50313664D1 (en) 2011-06-16
CN100352107C (en) 2007-11-28

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