EP1476923A1 - Electrotechnical device - Google Patents

Electrotechnical device

Info

Publication number
EP1476923A1
EP1476923A1 EP03742500A EP03742500A EP1476923A1 EP 1476923 A1 EP1476923 A1 EP 1476923A1 EP 03742500 A EP03742500 A EP 03742500A EP 03742500 A EP03742500 A EP 03742500A EP 1476923 A1 EP1476923 A1 EP 1476923A1
Authority
EP
European Patent Office
Prior art keywords
chamber
component
housing
contact pins
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03742500A
Other languages
German (de)
French (fr)
Other versions
EP1476923B1 (en
Inventor
Wolfgang Brutschin
Volker Dreyer
Gottfried Hintner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP1476923A1 publication Critical patent/EP1476923A1/en
Application granted granted Critical
Publication of EP1476923B1 publication Critical patent/EP1476923B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/933—Special insulation
    • Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive

Definitions

  • the invention relates to an electrotechnical device.
  • Modern electrotechnical devices e.g. Measuring devices usually have several components. These components, e.g. Sensors, electronic assemblies, etc., are preferably modular today.
  • a modular structure allows the device to be offered in a large number of different variants without all variants having to be available in sufficient quantities. Only the components that are combined as required need to be in stock.
  • a modular structure offers advantages in manufacturing.
  • a special variant of the device can be produced from the components in a short time. The components are preferably connected to one another by simple plug connections.
  • a potting material e.g. a silicone rubber, for example to prevent moisture penetration.
  • the potting material is poured into the device in the liquid state. If the liquid casting compound reaches the area of electrical plug-in connections, the quality of an electrical connection between the contacts to be connected by the plug-in connection can be impaired or even permanently disturbed by the potting material.
  • the invention consists in an electrotechnical device
  • a second component arranged in the housing, which has a base on which contact plugs are provided at the end for receiving the contact pins,
  • the housing is filled with a potting material from a side opposite the opening of the chamber.
  • the first component is an electronic assembly.
  • the second component is a sensor assembly.
  • the chamber is a two-component injection molded part which, at the points where the contact pins penetrate the rear wall, consists of a plastic with a lower Shore hardness.
  • the rear wall of the chamber is self-sealing where the contact pins penetrate through the plastic with a low Shore hardness.
  • the invention consists in a method for filling an electrotechnical device according to the invention with a potting material, in which
  • the unit is placed in an upright position with the opening of the chamber facing downwards and the rear wall of the chamber facing upwards, and
  • the potting material is filled in from above, - So that an existing inside the chamber plug connection between the contact pins and the contact plugs is covered by the chamber and an area of the plug connection is spared from the potting material.
  • FIG. 1 shows an exploded view of an electrotechnical device
  • Fig. 2 shows a section through the housing with two components connected by a plug connection
  • FIG. 3 shows a section through the housing with the two components, the section plane being rotated by 90 ° with respect to the section plane shown in FIG. 2.
  • FIG. 1 shows an exploded view of an electrical device according to the invention.
  • the exemplary embodiment shown is an electromechanical fill level sensor for determining and / or monitoring a predetermined fill level in a container, such as is used in measurement and control technology.
  • the device has a housing 1.
  • the housing 1 is designed as a screw-in piece with a threaded section 3 and a hexagon head 5.
  • a cylindrical interior of the housing 1 is hollow and closed at its lower end by a membrane 7. Ends of two vibrating rods 9 are formed on the membrane 7.
  • the level sensor is fastened in an internally threaded opening of a container wall in such a way that the vibrating rods protrude into the interior of the container and come into contact with a filling material in the container when it reaches the predetermined filling level.
  • a first component 11 and a second component 13 of the electrotechnical device are arranged in the interior.
  • the first component 11 is an electronic assembly in the exemplary embodiment shown. It essentially consists of an electronic circuit arranged on two printed circuit boards 15.
  • the first component 11 has at least one contact pin 17 projecting at the end. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.
  • the second component 13 is e.g. a sensor assembly.
  • the sensor assembly comprises an electromechanical converter. This consists e.g. of piezoelectric elements arranged in a stack.
  • the electromechanical converter contains an excitation and a reception converter. When an AC voltage is applied to the excitation transducer, it sets the membrane 7 in vibrations, which in turn are transmitted to the vibrating rods 9, so that these vibrations are perpendicular to the longitudinal axis thereof. If mechanical vibrations act on the receiving transducer, these generate an electrical alternating voltage with the frequency of the vibration.
  • the electronic assembly contains an amplifier which receives the AC voltage generated by the receive converter at the input and transmits the amplified AC voltage to the excitation converter at the output.
  • the mechanical vibration system formed by the membrane 7 and the vibrating rods 9 via the electromechanical transducer in the feedback circuit of the amplifier, so that it excites to vibrations with its own resonance frequency. If the vibrating rods 9 are not in contact with the filling material, the natural frequency of the mechanical vibration system is higher than when the vibrating rods 9 are immersed in the filling material.
  • the electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the alternating voltage emitted by the amplifier is above or below a predetermined threshold value.
  • the first and the second component 11, 13 are both arranged in the housing 1.
  • the second component 13 comprises a base element 18 and a base 19 molded thereon.
  • contact plugs 21 are arranged at the ends, which are provided for receiving the contact pins 17.
  • FIGS. 2 and 3 show two sections of the device shown in FIG. 1. For the sake of clarity, the vibrating rods 9 are not shown. The cuts are in cutting planes that are rotated 90 ° against each other.
  • An insert 23 is arranged in the housing 1.
  • the insert 23 serves to receive the first component 11.
  • the insert 23 has an almost cylindrical section 25, into which the electronic assembly is inserted through an end-side first opening 27.
  • a holder for the printed circuit boards 15 is provided in the cylindrical section 25.
  • the cylindrical section 25 is closed by a rear wall 29.
  • a closed chamber 31 is formed on the cylindrical section 25 on a side of the rear wall 29 opposite the first opening 27.
  • the chamber 31 preferably forms a two-component injection molded part which, at the points where the contact pins 17 penetrate the rear wall 29, consists of a plastic with a lower Shore hardness.
  • the chamber 31 can be an integral part of the insert 23, which is then preferably designed entirely as a two-component injection molded part.
  • the rear wall 29 of the chamber 31 is preferably formed from a plastic with a lower Shore hardness where the contact pins 17 penetrate it.
  • a soft plastic encloses the Contact pins 17 closely and is therefore self-sealing in the area of the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. The sealing is brought about simply by inserting the contact pins 17.
  • the insert 23 is e.g. made of polycarbonate (PC) and as a soft plastic, e.g. a thermoplastic polymer.
  • PC polycarbonate
  • soft plastic e.g. a thermoplastic polymer.
  • the choice of plastic for insert 23 is relatively free.
  • the choice of the soft plastic is limited to those materials which ensure an airtight self-sealing where the contact pins 17 penetrate them.
  • the chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted.
  • the contact pins 17 are inserted through the rear wall 29 opposite the opening 33 into the contact plug 21 of the base 19.
  • the housing 1 is filled with a potting material from a side opposite the opening 33 of the chamber 31.
  • the potting material is shown in the figures as hatching composed of horizontal dashed lines.
  • Suitable potting material is e.g. a gel-like two-component silicone rubber that is liquid after mixing the two components and then vulcanized by addition crosslinking.
  • the device is filled with potting material by placing the device in an upright position.
  • the opening 33 of the chamber 31 points downwards and the rear wall 29 of the chamber 31 points upwards.
  • the potting material is filled into the housing 1 from above in this position.
  • the terms above and below refer to the filling positions shown in the drawing.
  • the potting material flows into the housing and penetrates through the opening 27 into the insert 23.
  • the cylindrical region 25 is completely filled with potting material.
  • potting material flows around the insert 23 and reaches the base element 18 of the second component 13 in this way. If the base element 18 has openings for this, interior spaces of the base element 18 can also be filled with potting material.
  • the potting material slowly fills the entire interior of the device from the bottom up and closes the chamber 31 when climbing up.
  • the chamber 31 forms a protective sleeve on which the potting material flows off on the outside.
  • No potting material can penetrate from below through the opening 33 either, since the enclosed air counteracts this. Just like a cup that is immersed in water with the opening facing downwards, the pressure of the enclosed air also prevents liquid from penetrating here. Sealing of the opening 33 is not necessary.
  • the plug connection existing in the interior of the chamber 31 between the contact pins 17 and the contact plugs 21 is covered by the chamber 31.
  • the area of the plug connection is therefore left free from the potting material.
  • the device can also have two or more plug connections between individual components which are spared from potting material in the manner according to the invention. To do this, it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Casings For Electric Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Seal Device For Vehicle (AREA)

Abstract

An electrotechnical device is provided, having components connected by means of plug connections. The interior of the device is filled with a casting material. The device includes: a housing; arranged in the housing a first components which has at least one terminally-protruding contact pin; a second component which has a socket on which terminally-located contact plugs are provided for receiving the contact pins; and an insert in which the first component is arranged. The insert includes a secluded chamber which has an opening into which the socket of the second component is introduced. The chamber additionally includes a rear wall lying opposite the opening through which the contact pins are stuck into the contact plugs of the socket. An air-tight seal exists between the contact pins and the rear wall. The housing is filled with the casting material from an end lying opposite to the opening of the chamber.

Description

Elektrotechnisches Gerät Electrotechnical device
Die Erfindung betrifft ein elektrotechnisches Gerät.The invention relates to an electrotechnical device.
Moderne elektrotechnische Geräte, z.B. Meßgeräte, weisen in der Regel mehrere Komponenten auf. Diese Komponenten, z.B. Sensoren, Elektronikbaugruppen etc., werden heute bevorzugt modular aufgebaut. Ein modularer Aufbau erlaubt es das Gerät in einer Vielzahl verschiedener Varianten anzubieten, ohne das alle Varianten in ausreichender Stückzahl vorrätig sein müssen. Es müssen lediglich die Komponentnen, die nach Bedarf kombiniert werden auf Lager sein. Außerdem bietet ein modularer Aufbau Vorteile bei der Fertigung. Aus den Komponenten ist in kurzer Zeit eine spezielle Variante des Geräts herstellbar. Vorzugsweise werden die Komponenten durch einfache Steckverbindungen miteinander verbunden.Modern electrotechnical devices, e.g. Measuring devices usually have several components. These components, e.g. Sensors, electronic assemblies, etc., are preferably modular today. A modular structure allows the device to be offered in a large number of different variants without all variants having to be available in sufficient quantities. Only the components that are combined as required need to be in stock. In addition, a modular structure offers advantages in manufacturing. A special variant of the device can be produced from the components in a short time. The components are preferably connected to one another by simple plug connections.
Häufig ist es erforderlich einen verbleibenden Innenraum des fertigen Geräts mit einem Vergußmaterial, z.B. einem Silikonkautschuk, zu vergießen, um z.B. ein Eindringen von Feuchtigkeit zu verhindern. Das Vergußmaterial wird dabei im flüssigen Zustand in das Gerät eingefüllt. Gelangt die flüssige Vergußmasse in den Bereich von elektrischen Steckverbindungen kann die Qualität einer elektrischen Verbindung zwischen den durch die Steckverbindung zu verbindenden Kontakten durch das Vergußmaterial beeinträchtigt oder sogar nachhaltig gestört werden.It is often necessary to have a remaining interior of the finished device with a potting material, e.g. a silicone rubber, for example to prevent moisture penetration. The potting material is poured into the device in the liquid state. If the liquid casting compound reaches the area of electrical plug-in connections, the quality of an electrical connection between the contacts to be connected by the plug-in connection can be impaired or even permanently disturbed by the potting material.
Es ist eine Aufgabe der Erfindung ein elektrotechnisches Gerät mit mittels Steckverbindungen verbundener Komponenten anzugeben, dessen Innenraum mit einem Vergußmaterial ausgefüllt ist.It is an object of the invention to provide an electrotechnical device with components connected by means of plug connections, the interior of which is filled with a potting material.
Hierzu besteht die Erfindung in einem elektrotechnischen Gerät mitFor this purpose, the invention consists in an electrotechnical device
- einem Gehäuse,- a housing,
- einer in dem Gehäuse angeordneten ersten Komponente,a first component arranged in the housing,
- die mindestens einen endseitig vorstehenden Kontaktstift aufweist,which has at least one contact pin projecting at the end,
- einer in dem Gehäuse angeordneten zweiten Komponente, - die einen Sockel aufweist, an dem endseitig Kontaktstecker zur Aufnahme der Kontaktstifte vorgesehen sind,a second component arranged in the housing, which has a base on which contact plugs are provided at the end for receiving the contact pins,
- einem in dem Gehäuse angeordneten Einsatz, -- in dem die erste Komponente angeordnet ist,an insert arranged in the housing, in which the first component is arranged,
- der eine abgeschlossene Kammer aufweist,- which has a closed chamber,
- die eine Öffnung aufweist, in die der Sockel der Komponente eingeführt ist, und- Which has an opening into which the base of the component is inserted, and
- die eine der Öffnung gegenüberliegende Rückwand aufweist, durch die die Kontaktstifte hindurch in die Kontaktstecker des Sockel gesteckt sind,which has a rear wall opposite the opening, through which the contact pins are inserted into the contact plugs of the base,
- bei dem zwischen den Kontaktstiften und der Rückwand eine luftdichte Abdichtung besteht, und- in which there is an airtight seal between the contact pins and the rear wall, and
- bei dem das Gehäuse von einer von der Öffnung der Kammer gegenüberliegenden Seite her mit einem Vergußmaterial aufgefüllt ist.- In which the housing is filled with a potting material from a side opposite the opening of the chamber.
Gemäß einer Ausgestaltung ist die erste Komponente eine Elektronikbaugruppe.According to one embodiment, the first component is an electronic assembly.
Gemäß einer Ausgestaltung ist die zweite Komponente eine Sensorbaugruppe.According to one embodiment, the second component is a sensor assembly.
Gemäß einer Weiterbildung ist die Kammer ein Zweikomponentenspritzgußteil, das an den Stellen, wo die Kontaktstifte die Rückwand durchdringen aus einem Kunststoff mit geringerer Shorehärte besteht.According to a further development, the chamber is a two-component injection molded part which, at the points where the contact pins penetrate the rear wall, consists of a plastic with a lower Shore hardness.
Gemäß einer Weiterbildung ist die Rückwand der Kammer dort wo die Kontaktstifte sie durchdringen durch den Kunststoff mit geringer Shorehärte selbstabdichtend.According to a further development, the rear wall of the chamber is self-sealing where the contact pins penetrate through the plastic with a low Shore hardness.
Weiter besteht die Erfindung in einem Verfahren zum Verfüllen eines erfindungsgemäßen elektrotechnischen Geräts mit einem Vergußmaterial, bei demFurthermore, the invention consists in a method for filling an electrotechnical device according to the invention with a potting material, in which
- das Gerät in einer aufrechten Position aufgestellt wird, in der die Öffnung der Kammer nach unten und die Rückwand der Kammer nach oben weist, und- the unit is placed in an upright position with the opening of the chamber facing downwards and the rear wall of the chamber facing upwards, and
- das Vergußmaterial von oben eingefüllt wird, - so daß eine im Inneren der Kammer bestehende Steckverbindung zwischen den Kontaktstiften und den Kontaktsteckern durch die Kammer abgedeckt ist und ein Bereich der Steckverbindung vom Vergußmaterial ausgespart bleibt.- the potting material is filled in from above, - So that an existing inside the chamber plug connection between the contact pins and the contact plugs is covered by the chamber and an area of the plug connection is spared from the potting material.
Die Erfindung und weitere Vorteile werden nun anhand der Figuren der Zeichnung, in denen ein Ausführungsbeispiel dargestellt ist, näher erläutert; gleiche Elemente sind in den Figuren mit gleichen Bezugszeichen versehen.The invention and further advantages will now be explained in more detail with reference to the figures of the drawing, in which an exemplary embodiment is shown; Identical elements are provided with the same reference symbols in the figures.
Fig. 1 zeigt eine explosionsdarstelltung eines elektrotechnischen Geräts;1 shows an exploded view of an electrotechnical device;
Fig. 2 zeigt einen Schnitt durch das Gehäuse mit zwei durch eine Steckverbindung verbundene Komonenten; undFig. 2 shows a section through the housing with two components connected by a plug connection; and
Fig. 3 zeigt einen Schnitt durch das Gehäuse mit den beiden Komponeneten, wobei die Schnittebene gegenüber der in Fig. 2 dargestellten Schnittebene um 90° gedreht ist.FIG. 3 shows a section through the housing with the two components, the section plane being rotated by 90 ° with respect to the section plane shown in FIG. 2.
Fig. 1 zeigt eine Explosionsdarstelltung eines erfindungsgemäßen ektrotechnischen Geräts.1 shows an exploded view of an electrical device according to the invention.
Bei dem dargestellten Ausführungsbeispiel handelt es sich um einen elektromechanischen Füllstandssensor für die Feststellung und/oder Überwachung eines vorbestimmten Füllstands in einem Behälter, wie er in der Meß- und Regeltechnik eingesetzt wird.The exemplary embodiment shown is an electromechanical fill level sensor for determining and / or monitoring a predetermined fill level in a container, such as is used in measurement and control technology.
Das Gerät weist ein Gehäuse 1 auf. Das Gehäuse 1 ist als ein Einschraubstück mit einem Gewindeabschnitt 3 und einem Sechskantkopf 5 ausgebildet.The device has a housing 1. The housing 1 is designed as a screw-in piece with a threaded section 3 and a hexagon head 5.
Ein zylindrischer Innenraum des Gehäuses 1 ist hohl und an einem unteren Ende durch eine Membran 7, verschlossen. An der Membran 7 sind Enden von zwei Schwingstäben 9 angeformt. Mittels des Einschraubstücks wird der Füllstandssensor so in einer mit einem Innengewinde versehenen Öffnung einer Behälterwand befestigt, daß die Schwingstäbe in das Innere des Behälters ragen und mit einem in dem Behälter befindlichen Füllgut in Berührung kommen, wenn dieses den vorbestimmten Füllstand erreicht. In dem Innenraum ist eine erste Komponente 11 und eine zweite Komponente 13 des elektrotechnischen Geräts angeordnet. Die erste Komponente 11 ist in dem dargestellten Ausführungsbeispiel eine Elektronikbaugruppe. Sie besteht im wesentlichen aus einer auf zwei Leiterplatten 15 angeordneten elektronischen Schaltung. Die erste Komponente 11 weist mindestens einen endseitig vorstehenden Kontaktstift 17 auf. In dem dargestellten Ausführungsbeispiel sind mehrere Kontaktstifte 17 in einer Doppelreihe angeordnet.A cylindrical interior of the housing 1 is hollow and closed at its lower end by a membrane 7. Ends of two vibrating rods 9 are formed on the membrane 7. By means of the screw-in piece, the level sensor is fastened in an internally threaded opening of a container wall in such a way that the vibrating rods protrude into the interior of the container and come into contact with a filling material in the container when it reaches the predetermined filling level. A first component 11 and a second component 13 of the electrotechnical device are arranged in the interior. The first component 11 is an electronic assembly in the exemplary embodiment shown. It essentially consists of an electronic circuit arranged on two printed circuit boards 15. The first component 11 has at least one contact pin 17 projecting at the end. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.
Die zweite Komponente 13 ist z.B. eine Sensorbaugruppe. In dem dargestellten Ausführungsbeispiel umfaßt die Sensorbaugruppe einen elektromechanischen Wandler. Dieser besteht z.B. aus in einem Stapel angeordneten piezoelektrischen Elementen. Der elektromechanische Wandler enthält einen Erregungs- und einen Empfangswandler. Wenn an dem Erregungswandler eine Wechselspannung angelegt wird, versetzt er die Membran 7 in Schwingungen, die wiederum auf die Schwingstäbe 9 übertragen werden, so daß diese Schwingungen senkrecht zu deren Längsachse ausführen. Wenn auf den Empfangswandler mechanische Schwingungen einwirken, erzeugen diese eine elektrische Wechselspannung mit der Frequenz der Schwingung.The second component 13 is e.g. a sensor assembly. In the exemplary embodiment shown, the sensor assembly comprises an electromechanical converter. This consists e.g. of piezoelectric elements arranged in a stack. The electromechanical converter contains an excitation and a reception converter. When an AC voltage is applied to the excitation transducer, it sets the membrane 7 in vibrations, which in turn are transmitted to the vibrating rods 9, so that these vibrations are perpendicular to the longitudinal axis thereof. If mechanical vibrations act on the receiving transducer, these generate an electrical alternating voltage with the frequency of the vibration.
Die Elektronikbaugruppe enthält einen Verstärker, der am Eingang die von dem Empfangswandler erzeugte Wechselspannung empfängt und am Ausgang die verstärkte Wechselspannung zu dem Erregungswandler überträgt. Somit liegt das von der Membran 7 und den Schwingstäben 9 gebildete mechanische Schwingungssystem über den elektromechanischen Wandler im Rückkopplungskreis des Verstärkers, so daß es sich zu Schwingungen mit einer Eigen resonanzfrequenz erregt. Wenn die Schwingstäbe 9 nicht mit dem Füllgut in Berührung stehen, ist die Eigenfrequenz des mechanischen Schwingungssystems höher als wenn die Schwingstäbe 9 in das Füllgut eintauchen. Die zu der Sensorbaugruppe zugeordnete Elektronikbaugruppe enthält eine zusätzliche Auswerteschaltung, die feststellt, ob die Frequenz der vom Verstärkter abgegebenen Wechselspannung über oder unter einem vorgegebenen Schwellenwert liegt. Liegt die Frequenz oberhalb des Schwellenwerts, so schwingen die Schwingstäbe 9 frei, liegt er unterhalb, so sind die Schwingstäbe 9 vom Füllgut bedeckt. Die erste und die zweite Komponente 11 , 13 sind beide in dem Gehäuse 1 angeordnet. Die zweite Komponente 13 umfaßt ein Grundelement 18 und einen daran angeformten Sockel 19. An dem Sockel 19 sind endseitig Kontaktstecker 21 angeordnet, die zur Aufnahme der Kontaktstifte 17 vorgesehen sind.The electronic assembly contains an amplifier which receives the AC voltage generated by the receive converter at the input and transmits the amplified AC voltage to the excitation converter at the output. Thus, the mechanical vibration system formed by the membrane 7 and the vibrating rods 9 via the electromechanical transducer in the feedback circuit of the amplifier, so that it excites to vibrations with its own resonance frequency. If the vibrating rods 9 are not in contact with the filling material, the natural frequency of the mechanical vibration system is higher than when the vibrating rods 9 are immersed in the filling material. The electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the alternating voltage emitted by the amplifier is above or below a predetermined threshold value. If the frequency is above the threshold value, the vibrating rods 9 oscillate freely; if it is below, the vibrating rods 9 are covered by the filling material. The first and the second component 11, 13 are both arranged in the housing 1. The second component 13 comprises a base element 18 and a base 19 molded thereon. On the base 19, contact plugs 21 are arranged at the ends, which are provided for receiving the contact pins 17.
In den Figuren 2 und 3 sind zwei Schnitte des in Fig. 1 dargestellten Geräts dargestellt. Der besseren Übersicht halber sind die Schwingstäbe 9 nicht mit eingezeichnet. Die Schnitte liegen in Schnittebenen, die gegeneinander um 90 ° gedreht sind.FIGS. 2 and 3 show two sections of the device shown in FIG. 1. For the sake of clarity, the vibrating rods 9 are not shown. The cuts are in cutting planes that are rotated 90 ° against each other.
In dem Gehäuse 1 ist ein Einsatz 23 angeordnet. Der Einsatz 23 dient der Aufnahme der ersten Komponente 11. In dem dargestellten Ausführungsbeispiel weist der Einsatz 23 einen nahezu zylindrischen Abschnitt 25 auf, in den die Elektronikbaugruppe durch eine endseitige erste Öffnung 27 hindurch eingeführt ist. Hierzu ist in dem zylindrischen Abschnitt 25 eine Halterung für die Leiterplatten 15 vorgesehen.An insert 23 is arranged in the housing 1. The insert 23 serves to receive the first component 11. In the exemplary embodiment shown, the insert 23 has an almost cylindrical section 25, into which the electronic assembly is inserted through an end-side first opening 27. For this purpose, a holder for the printed circuit boards 15 is provided in the cylindrical section 25.
An einer der Öffnung 27 gegenüberliegenden Seite ist der zylindrische Abschnitt 25 durch eine Rückwand 29 verschlossen.On a side opposite the opening 27, the cylindrical section 25 is closed by a rear wall 29.
An den zylindrischen Abschnitt 25 ist auf einer der ersten Öffnung 27 gegenüberliegenden Seite der Rückwand 29 eine abgeschlossene Kammer 31 angeformt. Beim Einführen der ersten Baugruppe 11 in den Einsatz 23 durchstechen die Kontaktstifte 17 die Rückwand 29 und ragen in die Kammer 31 hinein.A closed chamber 31 is formed on the cylindrical section 25 on a side of the rear wall 29 opposite the first opening 27. When the first assembly 11 is inserted into the insert 23, the contact pins 17 pierce the rear wall 29 and protrude into the chamber 31.
Zwischen den Kontaktstiften 17 und der Rückwand 29 besteht eine luftdichteThere is an airtight between the contact pins 17 and the rear wall 29
Abdichtung.Seal.
Die Kammer 31 bildet vorzugsweise ein Zweikomponentenspritzgußteil, das an den Stellen, wo die Kontaktstifte 17 die Rückwand 29 durchdringen aus einem Kunststoff mit geringerer Shorehärte besteht. Selbstverständlich kann die Kammer 31 integraler Bestandteil des Einsatzes 23, der dann vorzugsweise vollständig als Zweikomponentenspritzgußteil ausgebildet ist.The chamber 31 preferably forms a two-component injection molded part which, at the points where the contact pins 17 penetrate the rear wall 29, consists of a plastic with a lower Shore hardness. Of course, the chamber 31 can be an integral part of the insert 23, which is then preferably designed entirely as a two-component injection molded part.
Vorzugsweise ist bei diesem Zweikomponentenspritzgußteil die Rückwand 29 der Kammer 31 dort wo die Kontaktstifte 17 sie durchdringen aus einem Kunststoff mit geringerer Shorehärte ausgebildet. Ein solcher weicher Kunststoff umschließt die Kontaktstifte 17 eng und ist dadurch im Bereich der Kontaktstifte 17 selbstabdichtend. Dies bietet den Vorteil, daß zur Erzielung einer luftdichten Abdichtung keinerlei Maßnahmen erforderlich sind. Allein durch das Hindurchstecken der Kontaktstifte 17 ist die Abdichtung bewirkt.In this two-component injection molded part, the rear wall 29 of the chamber 31 is preferably formed from a plastic with a lower Shore hardness where the contact pins 17 penetrate it. Such a soft plastic encloses the Contact pins 17 closely and is therefore self-sealing in the area of the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. The sealing is brought about simply by inserting the contact pins 17.
Der Einsatz 23 besteht z.B. aus Polycarbonat (PC) und als weicher Kunststoff eignet sich z.B. ein thermoplastisches Polymer. Bei der Auswahl des Kunststoffs für den Einsatz 23 ist man relativ frei. Die Wahl des weichen Kunststoff ist jedoch eingeschränkt auf solche Materialien, die dort wo die Kontaktstifte 17 sie durchdringen eine luftdichte Selbstabdichtung gewährleisten.The insert 23 is e.g. made of polycarbonate (PC) and as a soft plastic, e.g. a thermoplastic polymer. The choice of plastic for insert 23 is relatively free. However, the choice of the soft plastic is limited to those materials which ensure an airtight self-sealing where the contact pins 17 penetrate them.
Die Kammer 31 weist eine der Rückwand 29 gegenüber angeordnete Öffnung 33 auf, in die der Sockel 19 der zweiten Komponente 13 eingeführt ist. Dabei werden die Kontaktstifte 17 durch die der Öffnung 33 gegenüberliegende Rückwand 29 hindurch in die Kontaktstecker 21 des Sockel 19 gesteckt.The chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted. The contact pins 17 are inserted through the rear wall 29 opposite the opening 33 into the contact plug 21 of the base 19.
Das Gehäuse 1 ist von einer von der Öffnung 33 der Kammer 31 gegenüberliegenden Seite her mit einem Vergußmaterial aufgefüllt. Das Vergußmaterial ist in den Figuren als aus wagerechten gestrichelten Linien zusammengesetzte Schraffur dargestellt.The housing 1 is filled with a potting material from a side opposite the opening 33 of the chamber 31. The potting material is shown in the figures as hatching composed of horizontal dashed lines.
Als Vergußmaterial eignet sich z.B. ein gelartiger Zweikomponenten- Silikonkautschuk, der nach dem Mischen der beiden Komponenten flüssig ist und dann durch Additionsvernetzung vulkanisiert.Suitable potting material is e.g. a gel-like two-component silicone rubber that is liquid after mixing the two components and then vulcanized by addition crosslinking.
Das Gerät wird mit Vergußmaterial verfüllt, indem das Gerät in einer aufrechten Position aufgestellt wird. Dabei weist die Öffnung 33 der Kammer 31 nach unten und die Rückwand 29 der Kammer 31 nach oben.The device is filled with potting material by placing the device in an upright position. The opening 33 of the chamber 31 points downwards and the rear wall 29 of the chamber 31 points upwards.
Das Vergußmaterial wird in dieser Position von oben in das Gehäuse 1 eingefüllt. Die Begriffe oben und unten beziehen sich auf die in der Zeichnung dargestellten Einfüllpositionen.The potting material is filled into the housing 1 from above in this position. The terms above and below refer to the filling positions shown in the drawing.
Das Vergußmaterial fließt in das Gehäuse und dringt durch die Öffnung 27 in den Einsatz 23 ein. Dabei wird der zylindrische Bereich 25 vollständig mit Vergußmaterial ausgefüllt. Zusätzlich fließt Vergußmaterial außen um den Einsatz 23 herum und gelangt auf diesem Weg zu dem Grundelement 18 der zweiten Komponente 13. Sofern das Grundelement 18 Öffnungen hierfür aufweist, können auch Innenräume des Grundelements 18 mit Vergußmaterial aufgefüllt werden.The potting material flows into the housing and penetrates through the opening 27 into the insert 23. The cylindrical region 25 is completely filled with potting material. In addition, potting material flows around the insert 23 and reaches the base element 18 of the second component 13 in this way. If the base element 18 has openings for this, interior spaces of the base element 18 can also be filled with potting material.
Das Vergußmaterial füllt den gesamten Innenraum des Geräts von unten nach oben langsam auf und verschließt beim Hochsteigen die Kammer 31.The potting material slowly fills the entire interior of the device from the bottom up and closes the chamber 31 when climbing up.
In die Kammer 31 kann dagegen kein Vergußmaterial eindringen. Beim Einfüllen des Vergußmaterials von oben bildet die Kammer 31 eine Schutzhülse, an der das Vergußmaterial außen abfließt.In contrast, no potting material can penetrate into the chamber 31. When the potting material is poured in from above, the chamber 31 forms a protective sleeve on which the potting material flows off on the outside.
Von unten durch die Öffnung 33 kann ebenfalls kein Vergußmaterial eindringen, da die eingeschlossene Luft dem entgegenwirkt. Genau wie bei einem Becher, den man mit der Öffnung nach unten in Wasser taucht, verhindert der Druck der eingeschlossenen Luft auch hier ein Eindringen von Flüssigkeit. Eine Abdichtung der Öffnung 33 ist nicht erforderlich.No potting material can penetrate from below through the opening 33 either, since the enclosed air counteracts this. Just like a cup that is immersed in water with the opening facing downwards, the pressure of the enclosed air also prevents liquid from penetrating here. Sealing of the opening 33 is not necessary.
Die im Inneren der Kammer 31 bestehende Steckverbindung zwischen den Kontaktstiften 17 und den Kontaktsteckern 21 ist durch die Kammer 31 abgedeckt. Der Bereich der Steckverbindung bleibt folglich vom Vergußmaterial ausgespart.The plug connection existing in the interior of the chamber 31 between the contact pins 17 and the contact plugs 21 is covered by the chamber 31. The area of the plug connection is therefore left free from the potting material.
Selbstverständlich kann das Gerät auch zwei oder mehr Steckverbindungen zwischen einzelnen Komponenten aufweisen, die auf die erfindungsgemäße Weise von Vergußmaterial ausgespart sind. Hierzu ist es lediglich erforderlich die Orientierungen der einzelnen Kammern so anzuordnen, daß deren Rückwände in die gleiche Richtung weisen. Of course, the device can also have two or more plug connections between individual components which are spared from potting material in the manner according to the invention. To do this, it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.

Claims

Patentansprüche claims
1. Elektrotechnisches Gerät mit - einem Gehäuse (1),1. Electrotechnical device with - a housing (1),
- einer in dem Gehäuse (1) angeordneten ersten Komponente (11),- a first component (11) arranged in the housing (1),
- die mindestens einen endseitig vorstehenden Kontaktstift (17) aufweist,- which has at least one contact pin (17) projecting at the end,
- einer in dem Gehäuse (1) angeordneten zweiten Komponente (13),- a second component (13) arranged in the housing (1),
- die einen Sockel (18) aufweist, an dem endseitig Kontaktstecker (21) zur Aufnahme der Kontaktstifte (17) vorgesehen sind,- which has a base (18) on which contact plugs (21) are provided at the end for receiving the contact pins (17),
- einem in dem Gehäuse (1) angeordneten Einsatz (23),an insert (23) arranged in the housing (1),
- in dem die erste Komponente (11) angeordnet ist,- in which the first component (11) is arranged,
- der eine abgeschlossene Kammer (31) aufweist,- Which has a closed chamber (31),
- die eine Öffnung (33) aufweist, in die der Sockel (18)der zweiten Komponente (13) eingeführt ist, und- Which has an opening (33) into which the base (18) of the second component (13) is inserted, and
- die eine der Öffnung (33) gegenüberliegende Rückwand (29) aufweist, durch die die Kontaktstifte (17) hindurch in die Kontaktstecker (21) des Sockels (18) gesteckt sind,- Which has an opening (33) opposite rear wall (29) through which the contact pins (17) are inserted into the contact plug (21) of the base (18),
- bei dem zwischen den Kontaktstiften (17) und der Rückwand (29) eine luftdichte Abdichtung besteht, und- In which there is an airtight seal between the contact pins (17) and the rear wall (29), and
- bei dem das Gehäuse (1) von einer von der Öffnung (33) der Kammer (31) gegenüberliegenden Seite her mit einem Vergußmaterial aufgefüllt ist.- In which the housing (1) from one of the opening (33) of the chamber (31) opposite side is filled with a potting material.
2. Gerät nach Anspruch 1 , bei dem die erste Komponente (11) eine Elektronikbaugruppe ist.2. Apparatus according to claim 1, wherein the first component (11) is an electronic assembly.
3. Gerät nach Anspruch 1 , bei dem die zweite Komponente (13) eine Sensorbaugruppe ist. 3. Apparatus according to claim 1, wherein the second component (13) is a sensor assembly.
4. Gerät nach Anspruch 1 , bei dem die Kammer (31) eine Zweikomponentenspritzgußteil ist, das an den Stellen, wo die Kontaktstifte (17) die Rückwand (29) durchdringen aus einem Kunststoff mit geringerer Shorehärte besteht.4. Apparatus according to claim 1, wherein the chamber (31) is a two-component injection molded part, which at the points where the contact pins (17) penetrate the rear wall (29) consists of a plastic with a lower Shore hardness.
5. Gerät nach Anspruch 4, bei dem die Rückwand (29) der Kammer (31) dort wo die Kontaktstifte (17) sie durchdringen durch den Kunststoff mit geringer Shorehärte selbstabdichtend ist.5. Apparatus according to claim 4, wherein the rear wall (29) of the chamber (31) where the contact pins (17) penetrate through the plastic with low Shore hardness is self-sealing.
6. Verfahren zum Verfüllen eines Geräts gemäß einem der vorangehenden Ansprüche mit einem Vergußmaterial, bei dem6. A method for filling a device according to one of the preceding claims with a potting material, in which
- das Gerät in einer aufrechten Position aufgestellt wird, in der die Öffnung (33) der Kammer (31) nach unten und die Rückwand (29) der Kammer (31) nach oben weist, und- The device is set up in an upright position in which the opening (33) of the chamber (31) down and the rear wall (29) of the chamber (31) faces up, and
- das Vergußmaterial von oben eingefüllt wird,- the potting material is filled in from above,
- so daß eine im Inneren der Kammer (31) bestehende Steckverbindung zwischen den Kontaktstiften (17) und den Kontaktsteckern (21) durch die Kammer (31) abgedeckt ist und ein Bereich der Steckverbindung vom Vergußmaterial ausgespart bleibt. - So that an inside the chamber (31) existing plug connection between the contact pins (17) and the contact plugs (21) is covered by the chamber (31) and an area of the plug connection is spared from the potting material.
EP03742500A 2002-02-23 2003-01-24 Electrotechnical device Expired - Lifetime EP1476923B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10207762 2002-02-23
DE10207762A DE10207762A1 (en) 2002-02-23 2002-02-23 Electrotechnical device
PCT/EP2003/000712 WO2003071636A1 (en) 2002-02-23 2003-01-24 Electrotechnical device

Publications (2)

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EP1476923A1 true EP1476923A1 (en) 2004-11-17
EP1476923B1 EP1476923B1 (en) 2011-05-04

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US (1) US6991475B2 (en)
EP (1) EP1476923B1 (en)
CN (1) CN100352107C (en)
AT (1) ATE508500T1 (en)
AU (1) AU2003247310A1 (en)
DE (2) DE10207762A1 (en)
WO (1) WO2003071636A1 (en)

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US6991475B2 (en) 2006-01-31
AU2003247310A1 (en) 2003-09-09
DE50313664D1 (en) 2011-06-16
WO2003071636A1 (en) 2003-08-28
CN1639924A (en) 2005-07-13
EP1476923B1 (en) 2011-05-04
DE10207762A1 (en) 2003-09-04
CN100352107C (en) 2007-11-28
US20050255733A1 (en) 2005-11-17
ATE508500T1 (en) 2011-05-15

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