CN1167423A - Electronic circuit (or products) packaging at normal temp. - Google Patents
Electronic circuit (or products) packaging at normal temp. Download PDFInfo
- Publication number
- CN1167423A CN1167423A CN 96107839 CN96107839A CN1167423A CN 1167423 A CN1167423 A CN 1167423A CN 96107839 CN96107839 CN 96107839 CN 96107839 A CN96107839 A CN 96107839A CN 1167423 A CN1167423 A CN 1167423A
- Authority
- CN
- China
- Prior art keywords
- electronic circuit
- curing agent
- packaging
- electronic product
- normal temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Organic Insulating Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The present invention uses unsaturated polyester resin (or other colloid material) and quartz powder (or other non-conductor mateiral with good heat conductance), adds hardening agent and catalyst, and mixes them and pours their mixture on electronic circuit (or electronic product) so as to obtain the package at normal temp. to attain the goal of improving working quality of electronic circuit (or electronic product) and prolonging its service life.
Description
The invention provides a kind of method that will install electronic devices and components and carry out packaging at normal temp through suitably processing, adjusted qualified electronic circuit (or electronic product).
The method that the present invention uses normal temperature cure transformer (as: power transformer factory in Jiangxi Province's produce solid-state transformer) realizes the packaging at normal temp of electronic circuit (or electronic product).
The reliability of electronic circuit (or electronic product) work depends on to a great extent whether solder joint can collapse because of vibration, and whether certain components and parts can damage because of overheated, and how are its insulation and heat dispersion, and how the adaptability of adverse circumstances such as soda acid is waited.More than various phenomenons just constitute problem to be solved by this invention.
The normal temperature cure method that the present invention used is what to realize electronic circuit (or electronic product) packaging at normal temp like this:
At first be equipped with die clamper good and that electronic circuit (or electronic product) adapts, and electronic circuit (or electronic product) is relatively stable in die clamper a certain appropriate location the use and the appearance of " note electronic circuit (or electronic product) ", again the mixed liquor of unsaturated polyester resin (or other colloidal materials) and curing agent and catalytic curing agent is blended into silica flour (or its thermal conductivity non-conductive material) altogether preferably and fully stirs evenly; Cast at normal temperatures immediately, the demoulding after about 20 minutes, the electronic circuit of sealing (or electronic product).
As: cyclohexanone peroxide 4g and cobalt naphthenate 2g mixing back adding are contained 306# and each 40g of 307# unsaturated polyester resin, in the mixed liquor of 182# unsaturated polyester resin 20g, to contain again and add 100g behind the mixed liquor homogeneous of above five kinds of compositions more than or equal at once electronic circuit or (electronic product) being carried out the normal temperature cast after fully stirring evenly in the 200 purpose silica flours, through the demoulding after 20 minutes.
The present invention to the packaging at normal temp of electronic circuit (or electronic product) can make electronic circuit (or electronic product) have stronger vibration resistance, than homogeneous heat conduction and heat radiation, good insulation, preferably to the adaptability of adverse circumstances such as soda acid, technological achievement confidentiality etc. preferably.Thereby fundamentally solved problem proposed by the invention, and improved the reliability of electronic circuit (or electronic product) work, prolonged useful life.
Claims (4)
1, the present invention carries out packaging at normal temp to electronic circuit (or electronic product), it is characterized in that using unsaturated polyester resin (or other colloidal materials) and silica flour (or the good non-conductive material of other thermal conductivity) adding curing agent and urges curing agent to realize that packaging at normal temp embodies the inventive method.
2, the unsaturated polyester resin of claim 1 (or other colloidal materials) can be the mixture of unsaturated polyester resin and other colloidal materials.
3, the silica flour of claim 1 (or the good non-conductive material of other thermal conductivity) can be the mixture of the good non-conductive material of silica flour and other thermal conductivity.
4, the curing agent of claim 1 and urge curing agent can be singly with curing agent or single with urging curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96107839 CN1167423A (en) | 1996-06-03 | 1996-06-03 | Electronic circuit (or products) packaging at normal temp. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96107839 CN1167423A (en) | 1996-06-03 | 1996-06-03 | Electronic circuit (or products) packaging at normal temp. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1167423A true CN1167423A (en) | 1997-12-10 |
Family
ID=5119800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 96107839 Pending CN1167423A (en) | 1996-06-03 | 1996-06-03 | Electronic circuit (or products) packaging at normal temp. |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1167423A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352107C (en) * | 2002-02-23 | 2007-11-28 | 恩德莱斯和豪瑟尔两合公司 | Electrotechnical device |
| CN103545104A (en) * | 2013-11-06 | 2014-01-29 | 宁夏银利电器制造有限公司 | Pouring method of transformer |
| CN107129744A (en) * | 2017-04-27 | 2017-09-05 | 广东歌丽斯化学有限公司 | A kind of encapsulating material and its preparation method and application |
-
1996
- 1996-06-03 CN CN 96107839 patent/CN1167423A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352107C (en) * | 2002-02-23 | 2007-11-28 | 恩德莱斯和豪瑟尔两合公司 | Electrotechnical device |
| CN103545104A (en) * | 2013-11-06 | 2014-01-29 | 宁夏银利电器制造有限公司 | Pouring method of transformer |
| CN107129744A (en) * | 2017-04-27 | 2017-09-05 | 广东歌丽斯化学有限公司 | A kind of encapsulating material and its preparation method and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |