EP1476923B1 - Appareil electrotechnique - Google Patents

Appareil electrotechnique Download PDF

Info

Publication number
EP1476923B1
EP1476923B1 EP03742500A EP03742500A EP1476923B1 EP 1476923 B1 EP1476923 B1 EP 1476923B1 EP 03742500 A EP03742500 A EP 03742500A EP 03742500 A EP03742500 A EP 03742500A EP 1476923 B1 EP1476923 B1 EP 1476923B1
Authority
EP
European Patent Office
Prior art keywords
component
chamber
housing
opening
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP03742500A
Other languages
German (de)
English (en)
Other versions
EP1476923A1 (fr
Inventor
Wolfgang Brutschin
Volker Dreyer
Gottfried Hintner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP1476923A1 publication Critical patent/EP1476923A1/fr
Application granted granted Critical
Publication of EP1476923B1 publication Critical patent/EP1476923B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/933—Special insulation
    • Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive

Definitions

  • the invention relates to an electrotechnical device.
  • Modern electrical equipment e.g. Measuring instruments usually have several components. These components, e.g. Sensors, electronic modules, etc., are now preferably modular.
  • a modular design makes it possible to offer the device in a variety of different variants without having to stock all variants in sufficient quantities. Only the components that are combined as needed need to be in stock.
  • a modular design offers advantages in manufacturing. From the components in a short time a special variant of the device can be produced. Preferably, the components are connected by simple plug-in connections.
  • a modular measuring device which comprises a first housing part, a second housing part, which is connected to the first housing part to form a common cavity, a sensor assembly and an electronic module.
  • the sensor assembly is inserted into the first housing part and conductively connected to the electronics assembly.
  • the second housing part has electrical connections projecting into the cavity. These connections are connected to the electronics assembly via a slip connection.
  • a potting material e.g. a silicone rubber
  • the potting material is filled in the liquid state in the device. If the liquid potting compound in the range of electrical connectors, the quality of an electrical connection between the contacts to be connected through the connector can be affected by the potting or even disturbed sustainable.
  • the first component is an electronic module.
  • the second component is a sensor module.
  • the chamber is a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins penetrate the rear wall, so that the rear wall of the chamber where the pins penetrate it, self-sealing by the plastic with low Shore hardness.
  • Fig. 1 shows an exploded view of an electrical device according to the invention.
  • it is an electromechanical level sensor for detecting and / or monitoring a predetermined level in a container, as used in the measurement and control technology.
  • the device has a housing 1.
  • the housing 1 is formed as a Einschraub published with a threaded portion 3 and a hexagonal head 5.
  • a cylindrical interior of the housing 1 is hollow and closed at a lower end by a membrane 7. On the membrane 7 ends of two oscillating rods 9 are formed.
  • the level sensor is mounted in a provided with an internal thread opening of a container wall, that the oscillating rods protrude into the interior of the container and come into contact with a product in the container when it reaches the predetermined level.
  • the first component 11 is an electronic module in the illustrated embodiment. It consists essentially of an arranged on two printed circuit boards 15 electronic circuit.
  • the first component 11 has at least one end protruding contact pin 17. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.
  • the second component 13 is e.g. a sensor assembly.
  • the sensor assembly includes an electromechanical transducer. This consists e.g. from arranged in a stack piezoelectric elements.
  • the electromechanical transducer includes an excitation and a receive transducer. When an AC voltage is applied to the excitation transducer, it causes the diaphragm 7 to vibrate, which in turn is transmitted to the oscillating rods 9 so that they oscillate perpendicularly to their longitudinal axis. When mechanical vibrations are applied to the receiving transducers, they generate an alternating electrical voltage with the frequency of the oscillation.
  • the electronics assembly includes an amplifier which receives at input the AC voltage generated by the receiving transducer and at the output transmits the amplified AC voltage to the excitation transducer.
  • the mechanical vibration system formed by the diaphragm 7 and the oscillating rods 9 is located in the feedback circuit of the amplifier via the electromechanical transducer, so that it is excited to oscillate at a self-resonant frequency. If the oscillating rods 9 are not in contact with the contents, the natural frequency of the mechanical vibration system is higher than when the oscillating rods 9 dive into the medium.
  • the electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the AC voltage delivered by the amplifier is above or below a predetermined threshold value. If the frequency is above the threshold value, the oscillating rods 9 oscillate freely; if it is below it, the oscillating rods 9 are covered by the medium.
  • the first and second components 11, 13 are both arranged in the housing 1.
  • the second component 13 comprises a base element 18 and a base 19 formed thereon.
  • contact plugs 21 are provided which are provided for receiving the contact pins 17.
  • FIGS. 2 and 3 are two cuts of the in Fig. 1 shown illustrated device. For better clarity, the oscillating rods 9 are not shown. The cuts are in cutting planes, which are rotated 90 ° against each other.
  • an insert 23 is arranged.
  • the insert 23 serves to receive the first component 11.
  • the insert 23 has a nearly cylindrical portion 25 into which the electronics assembly is inserted through an end-side first opening 27.
  • a holder for the printed circuit boards 15 is provided in the cylindrical portion 25.
  • a rear wall 29 At a side opposite the opening 27 side of the cylindrical portion 25 is closed by a rear wall 29.
  • a closed chamber 31 is integrally formed on one of the first opening 27 opposite side of the rear wall 29.
  • the chamber 31 preferably forms a two-component injection-molded part, which consists of a plastic with a lower Shore hardness at the points where the contact pins 17 penetrate the rear wall 29.
  • the chamber 31 is an integral part of the insert 23, which is then preferably completely formed as a two-component injection-molded part.
  • the rear wall 29 of the chamber 31 is formed where the contact pins 17 penetrate it from a plastic with a lower Shore hardness.
  • a soft plastic encloses the Contact pins 17 tight and is thussabêtnd in the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. Just by passing through the contact pins 17, the seal is effected.
  • the insert 23 consists e.g. made of polycarbonate (PC) and as a soft plastic is e.g. a thermoplastic polymer.
  • PC polycarbonate
  • soft plastic e.g. a thermoplastic polymer.
  • the choice of soft plastic is limited to those materials which, where the contact pins 17 penetrate, ensure an airtight self-seal.
  • the chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted.
  • the contact pins 17 are inserted through the opening 33 opposite the rear wall 29 into the contact plug 21 of the base 19.
  • the housing 1 is filled with a potting material from an opening 33 of the chamber 31 opposite side.
  • the potting material is shown in the figures as composed of wagerechten dashed lines hatching.
  • potting material e.g. a gel-type two-component silicone rubber which is liquid after mixing the two components and then vulcanized by addition crosslinking.
  • the device is filled with potting material by placing the device in an upright position. In this case, the opening 33 of the chamber 31 down and the rear wall 29 of the chamber 31 upwards.
  • the potting material is filled in this position from above into the housing 1.
  • the terms above and below refer to the filling positions shown in the drawing.
  • the potting material flows into the housing and penetrates through the opening 27 in the insert 23 a.
  • the cylindrical portion 25 is completely filled with potting material.
  • potting material flows outside the insert 23 around and passes in this way to the base member 18 of the second component 13. If the base member 18 has openings for this purpose, and interior spaces of the base member 18 can be filled with potting material.
  • the potting material fills the entire interior of the device from bottom to top slowly and closes when climbing the chamber 31st
  • the chamber 31 forms a protective sleeve, on which the potting material flows on the outside.
  • the existing in the interior of the chamber 31 plug connection between the contact pins 17 and the contact plugs 21 is covered by the chamber 31.
  • the region of the connector thus remains recessed from the potting material.
  • the device may also have two or more connections between individual components, which are recessed in the inventive manner of potting material.
  • the orientations of the individual chambers it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Casings For Electric Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Seal Device For Vehicle (AREA)

Claims (5)

  1. Appareil électrotechnique avec
    - un corps (1);
    - un premier composant (11) logé dans le corps (1)
    -- qui présente au moins une broche de contact (17) dépassant côté extrémité,
    - un deuxième composant (13) logé dans le boîtier (1),
    -- qui présente un socle (18), sur lequel sont prévues, côté extrémité, des fiches de contact (21) destinées au logement des broches de contact (17),
    caractérisé par
    - un insert (23) disposé dans le corps (1),
    -- dans lequel est disposé le premier composant (11),
    -- lequel présente une chambre (31) fermée,
    --- qui présente une ouverture (33), dans laquelle le socle (18) du deuxième composant (13) est introduit, et
    --- qui présente une paroi arrière située à l'opposé de l'ouverture (33), paroi à travers laquelle les broches de contact (17) sont enfichées dans les fiches de contact (21) du socle (18),
    - pour lequel il existe, entre les broches de contact (17) et la paroi arrière (29) une étanchéité imperméable à l'air, et
    - pour lequel le corps (1) est rempli d'une matière de scellement depuis le côté opposé à l'ouverture (33) de la chambre (31).
  2. Appareil selon la revendication 1, pour lequel le premier composant (11) est un module électronique.
  3. Appareil selon la revendication 1, pour lequel le deuxième composant (13) est un module capteur.
  4. Appareil selon la revendication 1, pour lequel
    la chambre (31) est une pièce moulée par injection bi-composant, laquelle est disposée aux endroits, au niveau desquels les broches de contact (17) traversent la paroi arrière (29), et se compose d'une matière plastique d'une faible dureté Shore, si bien que la matière plastique, aux endroits où elle est traversée par les broches de contact, garantit une auto-étanchéité imperméable à l'air.
  5. Procédé destiné au remplissage d'un appareil conformément à l'une des revendications précédentes avec une matière de scellement, au cours duquel
    - l'appareil est placé dans une position debout, dans laquelle l'ouverture (33) de la chambre (31) est orientée vers le bas et la paroi arrière (29) de la chambre (31) vers le haut, et
    - la matière de scellement est remplie par le haut,
    - si bien qu'une connexion présente dans l'intérieur de la chambre (31), entre les broches de contact (17) et les fiches de contact (21), est recouverte par la chambre (31) et une zone de la connexion est laissée libre de matière de scellement.
EP03742500A 2002-02-23 2003-01-24 Appareil electrotechnique Expired - Lifetime EP1476923B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10207762 2002-02-23
DE10207762A DE10207762A1 (de) 2002-02-23 2002-02-23 Elektrotechnisches Gerät
PCT/EP2003/000712 WO2003071636A1 (fr) 2002-02-23 2003-01-24 Appareil electrotechnique

Publications (2)

Publication Number Publication Date
EP1476923A1 EP1476923A1 (fr) 2004-11-17
EP1476923B1 true EP1476923B1 (fr) 2011-05-04

Family

ID=27674898

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03742500A Expired - Lifetime EP1476923B1 (fr) 2002-02-23 2003-01-24 Appareil electrotechnique

Country Status (7)

Country Link
US (1) US6991475B2 (fr)
EP (1) EP1476923B1 (fr)
CN (1) CN100352107C (fr)
AT (1) ATE508500T1 (fr)
AU (1) AU2003247310A1 (fr)
DE (2) DE10207762A1 (fr)
WO (1) WO2003071636A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005128870A (ja) * 2003-10-24 2005-05-19 Jatco Ltd 車両の制御装置
US7247056B2 (en) * 2004-09-27 2007-07-24 Lockheed Martin Corporation Rugged, removable, electronic device
DE102007009403B4 (de) 2007-02-23 2022-05-05 Endress+Hauser SE+Co. KG Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße
DE102007036456B4 (de) 2007-08-03 2021-12-16 Endress+Hauser SE+Co. KG Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße
TWI352463B (en) * 2008-01-23 2011-11-11 Waterproof connector and method for the same
DE102008022371A1 (de) * 2008-05-06 2009-11-12 Endress + Hauser Gmbh + Co. Kg Vergussdichte Steckverbindung
DE102009031652A1 (de) * 2009-07-03 2011-01-05 Westfalia-Automotive Gmbh Steckdose einer Anhängekupplung
DE102013217892A1 (de) 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
HUE031423T2 (en) * 2013-01-30 2017-07-28 Grieshaber Vega Kg Adapter with mechanical connection surface for connection to meter housing
JP6384383B2 (ja) 2015-03-30 2018-09-05 株式会社デンソー 電子装置
TWI569529B (zh) * 2015-10-06 2017-02-01 飛宏科技股份有限公司 電源插頭裝置及其製造方法
DE102017119358A1 (de) * 2017-08-24 2019-02-28 Endress+Hauser SE+Co. KG Modulares Feldgerät
DE102017218659B3 (de) * 2017-10-19 2019-04-25 Audi Ag Verfahren zur Herstellung einer elektronischen Komponente, insbesondere einer Mechatronikkomponente sowie verfahrensgemäß hergestellte elektronische Komponente
DE102022104763A1 (de) 2022-02-28 2023-08-31 Endress+Hauser SE+Co. KG Modulares Feldgerät

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335932A (en) * 1980-02-29 1982-06-22 Amp Incorporated Elastomeric potting shell
GB2076843B (en) * 1980-05-20 1983-11-16 Standard Telephones Cables Ltd Hydrophobic gel composition
DE3818499A1 (de) * 1988-05-31 1989-12-07 Ifm Electronic Gmbh Elektronisches schaltgeraet, insbesondere naeherungsschalter
DE4023792C2 (de) * 1990-07-26 2000-05-11 Siemens Ag Verfahren zur Herstellung eines Näherungsschalters mit Befestigungshülse
JPH05226051A (ja) * 1992-02-07 1993-09-03 Ichikoh Ind Ltd バルブソケットのシール方法および同シール構造
DE19504608C2 (de) * 1995-02-11 2002-03-21 Balluff Gebhard Feinmech Positionssensor und Verfahren zur Herstellung desselben
EP0766073B1 (fr) * 1995-09-28 2002-01-02 Endress + Hauser GmbH + Co. Boítier électronique
CN2264405Y (zh) * 1995-11-29 1997-10-08 黄维枢 户外式低压电流互感器
CN1167423A (zh) * 1996-06-03 1997-12-10 陶夏根 电子线路(或电子产品)的常温封固
GB9819918D0 (en) * 1998-09-11 1998-11-04 Meggitt Mobrey Limited Method of assembling an electronics housing and a housing formed thereby
DE19852730C2 (de) * 1998-11-16 2001-08-16 Harting Kgaa Baugruppe zur gas- und flüssigkeitsdichten Durchführung elektrischer Leiter aus einem Halteteil und einem darin eingegossenen Kontaktstift
EP1076479A1 (fr) * 1999-07-23 2001-02-14 Ford Motor Company Capteur et dispositif de commande intégré et son procédé de fabrication
DE10021672B4 (de) * 2000-05-05 2007-01-11 Balluff Gmbh Hermetisch verkapselter Sensor und Verfahren zu seiner Herstellung
US6854996B2 (en) * 2002-12-20 2005-02-15 Tyco Electronics Corporation Electrical connectors and methods for using the same

Also Published As

Publication number Publication date
US6991475B2 (en) 2006-01-31
AU2003247310A1 (en) 2003-09-09
DE50313664D1 (de) 2011-06-16
WO2003071636A1 (fr) 2003-08-28
CN1639924A (zh) 2005-07-13
EP1476923A1 (fr) 2004-11-17
DE10207762A1 (de) 2003-09-04
CN100352107C (zh) 2007-11-28
US20050255733A1 (en) 2005-11-17
ATE508500T1 (de) 2011-05-15

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