EP0802028B1 - Device for emplacing slices obtained by sawing of a block in storage elements - Google Patents

Device for emplacing slices obtained by sawing of a block in storage elements Download PDF

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Publication number
EP0802028B1
EP0802028B1 EP19970105331 EP97105331A EP0802028B1 EP 0802028 B1 EP0802028 B1 EP 0802028B1 EP 19970105331 EP19970105331 EP 19970105331 EP 97105331 A EP97105331 A EP 97105331A EP 0802028 B1 EP0802028 B1 EP 0802028B1
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EP
European Patent Office
Prior art keywords
slices
fact
cutting
heel
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19970105331
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German (de)
French (fr)
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EP0802028A3 (en
EP0802028A2 (en
Inventor
Charles Hauser
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Applied Materials Switzerland SARL
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HCT Shaping Systems SA
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Publication of EP0802028A2 publication Critical patent/EP0802028A2/en
Publication of EP0802028A3 publication Critical patent/EP0802028A3/en
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Publication of EP0802028B1 publication Critical patent/EP0802028B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the present invention relates to a device for putting in storage element of slices of a sawn block attached by a heel to a cutting support (see e.g. JP-A-06-039 831).
  • the block to be cut is generally mounted glued on a plate intended for use unique, if possible a material with characteristics approaching the material to be cut.
  • This plate is mechanically mounted on a second support cutting which serves as a link with the cutting machine.
  • the block of material will be cut completely and the cutting tool will open into the operating plate unique.
  • the block will appear as a set of separate parallel slices from each other by the saw cut but attached at their base by a partially cut heel and always part of the single use plate mounted on a cutting support. It will then be necessary to separate the slices of the single use plate.
  • the use of the slices thus obtained requires keep them separate and put them in items storage often called cassettes for processing subsequent such as for example washing, polishing or simply removing the remnants of glue.
  • the setting up manual storage is long and tedious with in addition significant risks of breakage.
  • the object of the present invention is to remedy to the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged to cut out said heel and a member displacement likely to produce relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a recovery mechanism arranged to resume each detached slice and place it in an empty box of the storage element.
  • the setting operation storage item is made easier and faster, reliable and streamlined. Slices, even thick very reduced, can be treated easily and without risk of being damaged.
  • the operating device slice by slice is better suited and offers better performance, increased productivity and superior reliability.
  • the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged to cut said heel or single use plate according to a direction substantially perpendicular to the edges for separate them one by one from the heel.
  • the recovery mechanism comprises a conveyor belt for transferring the wafers separated from the heel towards the storage element.
  • the device comprises an installation with one or more nozzles intended inject a pressurized fluid to facilitate detachment of the released tranche.
  • the device for placing in cassette attached slices by a heel to a cutting support, object of the present invention therefore includes a table on which is fixed the cutting support with its cut block and stuck on the single use plate, a mechanism cutting allowing the cutting of the heel edge by slice consisting of a cutting tool, an element of relative displacement of all the slices allowing to present them one by one to the cutting tool, a slice and system recovery element carrier for subsequent storage item.
  • Slice by slice can be cut either by moving the block, the cutting tool being fixed, either by advancing the tool, the block then being fixed. he however, it can happen that both movements are required.
  • Figure 1 schematically illustrates the principle of application of the present invention.
  • the edge 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water.
  • the storage element 11 will receive the slice in one of its boxes empty 12 and then moves along column 13 thanks to the motor 14 in a substantially perpendicular direction on the plane of the ramp 10.
  • the single use plate 4 advantageously consists of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is also partially sawn by wires or blades during training slices. Separation of slices 2 from heel 3 by the cutting tool 7 is therefore carried out at the single use plate 4 in a perpendicular direction slices 2.
  • Figure 2 illustrates more particularly a solution cutting by a band saw 15 driven by wheels 16.
  • the cut edge 2 is separated here by a jet liquid from nozzle 17.
  • Figure 3 shows more particularly block 1 with its edges 2 partially supported by their heel 3 sawn in the single use plate 4 fixed on the cutting support 5.
  • the cutting tool 7 could for example be constituted by a mechanical cutting tool, such than a milling cutter, disc saw, wire saw, band saw or ribbon, or any other cutting system, for example thermal such as laser, plasma, torch, etc., or even a liquid pressure attack or dissolving system chemical.
  • the device according to the invention is advantageously used in the case of block of axial symmetry as by example of single crystals of silicon or semiconductor materials of great production. Any block of cut material by wire saws or multi-blades can however be processed by the device which is the subject of the present invention.
  • the embodiments described above are in no way limiting and that they can receive any desirable changes to inside the frame as defined by claim 1.
  • the cutting tool 7 could be arranged to move perpendicular to slices 2 compared to block 1 which would be stationary.
  • Nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a fluid under pressure to facilitate detachment of the last tranche released.
  • the device could have a tank containing a liquid, for example water, in which all or part of the device is submerged to prevent drying of slices 2 during the procedure.
  • the band conveyor 9 could be replaced by any other means of transport.
  • Ramp 10 could be devoid of water cushion or even be removed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

La présente invention concerne un dispositif pour la mise en élément de stockage de tranches d'un bloc scié attachées par un talon à un support de découpage (voir p.ex. le JP-A-06-039 831).The present invention relates to a device for putting in storage element of slices of a sawn block attached by a heel to a cutting support (see e.g. JP-A-06-039 831).

Lors du sciage de matériaux sous forme de blocs par des dispositifs de sciage à outils multiples, par exemple multi-lames ou multi-fils, le bloc à découper est généralement monté collé sur une plaque destinée à une utilisation unique, si possible un matériau ayant des caractéristiques approchantes du matériau à découper. Cette plaque est montée de manière mécanique sur un deuxième support de découpage qui lui sert de liaison avec la machine de découpage. Le bloc de matériau sera découpé complètement et l'outil de découpe débouchera dans la plaque d'utilisation unique. Une fois la découpe terminée le bloc se présentera sous la forme d'un ensemble de tranches parallèles séparées les unes des autres par le trait de scie, mais attachées à leur base par un talon partiellement découpé et faisant partie de la plaque d'utilisation unique toujours montée sur un support de découpage. Il faudra alors séparer les tranches de la plaque d'utilisation unique. En général, l'utilisation des tranches ainsi obtenues nécessite de les garder séparées et de les mettre dans des éléments de stockage souvent appelés cassettes en vue de traitements subséquents tels que par exemple un lavage, un polissage ou simplement l'enlèvement des restes de colle. La mise en élément de stockage manuelle est longue et fastidieuse avec en plus des risques de casse non négligeables.When sawing materials in the form of blocks by multi-tool sawing devices, for example multi-blade or multi-wire, the block to be cut is generally mounted glued on a plate intended for use unique, if possible a material with characteristics approaching the material to be cut. This plate is mechanically mounted on a second support cutting which serves as a link with the cutting machine. The block of material will be cut completely and the cutting tool will open into the operating plate unique. Once the cutting is finished the block will appear as a set of separate parallel slices from each other by the saw cut but attached at their base by a partially cut heel and always part of the single use plate mounted on a cutting support. It will then be necessary to separate the slices of the single use plate. In general, the use of the slices thus obtained requires keep them separate and put them in items storage often called cassettes for processing subsequent such as for example washing, polishing or simply removing the remnants of glue. The setting up manual storage is long and tedious with in addition significant risks of breakage.

Il existe des dispositifs de mise en éléments de stockage, mais ces derniers travaillent en paquet, c'est-à-dire toutes les tranches sont d'abord détachées puis reprises par un robot et mises dans l'élément de stockage. Cette technique présente le désavantage que les tranches adhérent les unes aux autres par capillarité, ce qui dans le cas de tranches très fines est une source de déchets. De plus, cela nécessite quelques opérations supplémentaires, telles que la reprise du paquet de tranches après décollage et sa mise en position pour reprise par le robot.There are storage storage devices, but the latter work in bundles, that is to say all slices are first detached and then resumed by a robot and put in the storage element. This technique has the disadvantage that slices adhere to each other by capillary action, which in very thin slices are a source of waste. In addition, it requires some additional operations, such as resumption of the package of slices after takeoff and its positioning for recovery by the robot.

Le but de la présente invention consiste à remédier aux inconvénients précités et le dispositif selon l'invention est caractérisé, à cet effet, par le fait qu'il comprend un mécanisme de découpe comportant un outil de découpe agencé de façon à découper ledit talon et un organe de déplacement susceptible de produire un déplacement relatif entre l'ensemble des tranches et l'outil de découpe pour présenter les tranches une à une à l'outil de découpe et pour détacher les tranches une à une du talon, et un mécanisme de récupération agencé de façon à reprendre chaque tranche détachée et à la placer dans une case vide de l'élément de stockage.The object of the present invention is to remedy to the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged to cut out said heel and a member displacement likely to produce relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a recovery mechanism arranged to resume each detached slice and place it in an empty box of the storage element.

Par ces caractéristiques, l'opération de mise en élément de stockage est facilitée et rendue plus rapide, fiable et rationalisée. Les tranches, même d'épaisseur très réduite, peuvent être traitées aisément et sans risque d'être endommagées. Le dispositif à fonctionnement tranche par tranche est mieux adapté et offre un meilleur rendement, une productivité accrue et une fiabilité supérieure.By these characteristics, the setting operation storage item is made easier and faster, reliable and streamlined. Slices, even thick very reduced, can be treated easily and without risk of being damaged. The operating device slice by slice is better suited and offers better performance, increased productivity and superior reliability.

Selon un mode d'exécution préféré, le dispositif comprend une plaque d'utilisation unique sur laquelle le bloc est fixé et qui est monté sur le support de découpage et le mécanisme de découpe est agencé de façon à découper ledit talon ou la plaque d'utilisation unique suivant une direction sensiblement perpendiculaire aux tranches pour les séparer une à une du talon.According to a preferred embodiment, the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged to cut said heel or single use plate according to a direction substantially perpendicular to the edges for separate them one by one from the heel.

Par ces caractéristiques, on obtient un détachement par découpe précis, rapide et fiable des tranches.By these characteristics, we obtain a detachment by precise, fast and reliable cutting of the slices.

Avantageusement, le mécanisme de récupération comprend une bande transporteuse destinée à transférer les tranches séparées du talon vers l'élément de stockage.Advantageously, the recovery mechanism comprises a conveyor belt for transferring the wafers separated from the heel towards the storage element.

Le transport individuel et la mise en élément de stockage sont ainsi particulièrement bien adaptés et exécutés de manière continue et fiable.Individual transport and storage are thus particularly well adapted and executed continuously and reliably.

Selon une variante avantageuse, le dispositif comprend une installation présentant une ou plusieurs buses destinées à injecter un fluide sous pression pour faciliter le détachement de la tranche libérée.According to an advantageous variant, the device comprises an installation with one or more nozzles intended inject a pressurized fluid to facilitate detachment of the released tranche.

Un risque de collage de la tranche supérieure en voie de séparation est ainsi évité de façon active, contribuant à la sécurité générale du dispositif.A risk of sticking of the upper section on track separation is thus actively avoided, contributing to the general security of the device.

Le dispositif pour la mise en cassette de tranches attachées par un talon à un support découpage, objet de la présente invention, comprend donc une table sur laquelle est fixé le support de découpe avec son bloc découpé et collé sur la plaque d'utilisation unique, d'un mécanisme de découpe permettant la découpe du talon tranche par tranche constitué par un outil de découpe, d'un élément de déplacement relatif de l'ensemble des tranches permettant de les présenter une à une à l'outil de découpe, d'un élément de récupération des tranches et d'un système transporteur pour la mise en élément de stockage subséquente. La découpe tranche par tranche peut se faire soit par le déplacement du bloc, l'outil de découpe étant fixe, soit par l'avance de l'outil, le bloc étant alors fixe. Il peut toutefois arriver que les deux mouvements s'avèrent nécessaires.The device for placing in cassette attached slices by a heel to a cutting support, object of the present invention, therefore includes a table on which is fixed the cutting support with its cut block and stuck on the single use plate, a mechanism cutting allowing the cutting of the heel edge by slice consisting of a cutting tool, an element of relative displacement of all the slices allowing to present them one by one to the cutting tool, a slice and system recovery element carrier for subsequent storage item. Slice by slice can be cut either by moving the block, the cutting tool being fixed, either by advancing the tool, the block then being fixed. he however, it can happen that both movements are required.

D'autres particularités et avantages ressortent des caractéristiques exprimées dans les revendications dépendantes et de la description exposant ci-après l'invention plus en détail à l'aide de dessins qui représentent schématiquement et à titre d'exemple un mode d'exécution et une variante.

  • La figure 1 est une vue latérale de ce mode d'exécution.
  • La figure 2 est une vue partielle en perspective d'une variante.
  • La figure 3 est une vue partielle agrandie d'une partie de la figure 1.
    • Other features and advantages emerge from the characteristics expressed in the dependent claims and from the description setting out the invention below in more detail with the aid of drawings which schematically represent by way of example an embodiment and a variant.
  • Figure 1 is a side view of this embodiment.
  • Figure 2 is a partial perspective view of a variant.
  • FIG. 3 is a partial enlarged view of part of FIG. 1.

    • La figure 1 illustre schématiquement le principe d'application de la présente invention. Le bloc 1 découpé en tranches 2 retenues par leur talon 3 sur la plaque d'utilisation unique 4, elle-même fixée sur le support de découpage 5, se déplace grâce à un moteur d'avance 6 contre l'outil de découpe 7 entraíné par le moteur 8. La tranche 2 tombe sur la bande transporteuse 9 qui va la déposer dans une rampe 10 sur un coussin d'eau. L'élément de stockage 11 va recevoir la tranche dans l'une de ses cases vides 12, puis se déplace le long de la colonne 13 grâce au moteur 14 suivant une direction sensiblement perpendiculaire au plan de la rampe 10.Figure 1 schematically illustrates the principle of application of the present invention. Block 1 cut into slices 2 retained by their heel 3 on the use plate single 4, itself fixed on the cutting support 5, moves by means of a feed motor 6 against the cutting tool 7 driven by the motor 8. The edge 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water. The storage element 11 will receive the slice in one of its boxes empty 12 and then moves along column 13 thanks to the motor 14 in a substantially perpendicular direction on the plane of the ramp 10.

    Il est à noter que la plaque d'utilisation unique 4 est avantageusement constituée par un matériau dont les propriétés physiques et/ou chimiques sont proches de celles du bloc 1. Cette plaque 4 est par ailleurs partiellement sciée par les fils ou les lames lors de la formation des tranches. La séparation des tranches 2 du talon 3 par l'outil de découpe 7 s'effectue donc au niveau de la plaque d'utilisation unique 4 suivant une direction perpendiculaire aux tranches 2.Note that the single use plate 4 advantageously consists of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is also partially sawn by wires or blades during training slices. Separation of slices 2 from heel 3 by the cutting tool 7 is therefore carried out at the single use plate 4 in a perpendicular direction slices 2.

    La figure 2 illustre plus particulièrement une solution de découpe par une scie à bande 15 entraínée par les roues 16. La tranche découpée 2 est séparée ici par un jet de liquide provenant de la buse 17.Figure 2 illustrates more particularly a solution cutting by a band saw 15 driven by wheels 16. The cut edge 2 is separated here by a jet liquid from nozzle 17.

    La figure 3 montre plus particulièrement le bloc 1 avec ses tranches 2 supportées par leur talon 3 partiellement scié dans la plaque d'utilisation unique 4 fixée sur le support de découpage 5.Figure 3 shows more particularly block 1 with its edges 2 partially supported by their heel 3 sawn in the single use plate 4 fixed on the cutting support 5.

    Naturellement, d'autres dispositifs de découpe peuvent être envisagés. L'outil de découpe 7 pourrait par exemple être constitué par un outil de découpe mécanique, tel qu'une fraise, une scie à disque, à fil, à bande ou à ruban, ou tout autre système de découpe, par exemple thermique tel que laser, plasma, chalumeau, etc., voire un système à pression de liquide à attaque ou à dissolution chimique.Naturally, other cutting devices can be considered. The cutting tool 7 could for example be constituted by a mechanical cutting tool, such than a milling cutter, disc saw, wire saw, band saw or ribbon, or any other cutting system, for example thermal such as laser, plasma, torch, etc., or even a liquid pressure attack or dissolving system chemical.

    Le dispositif selon l'invention est avantageusement utilisé dans le cas de bloc de symétrie axiale comme par exemple des monocristaux de silicium ou de matériaux semiconducteurs de grande production. Tout bloc de matière découpé par des scies à fils ou multi-lames peut cependant être traité par le dispositif objet de la présente invention.The device according to the invention is advantageously used in the case of block of axial symmetry as by example of single crystals of silicon or semiconductor materials of great production. Any block of cut material by wire saws or multi-blades can however be processed by the device which is the subject of the present invention.

    Il est bien entendu que les modes de réalisation décrits ci-dessus ne présentent aucun caractère limitatif et qu'ils peuvent recevoir toutes modifications désirables à l'intérieur du cadre tel que défini par la revendication 1. En particulier, l'outil de découpe 7 pourrait être agencé de façon à se déplacer perpendiculairement aux tranches 2 par rapport au bloc 1 qui serait stationnaire. La buse 17 pourrait être remplacée par une installation comportant plusieurs buses destinées à injecter un fluide sous pression pour faciliter le détachement de la dernière tranche libérée. Le dispositif pourrait présenter une cuve contenant un liquide, par exemple de l'eau, dans lequel tout ou partie du dispositif est immergé pour prévenir le séchage des tranches 2 en cours de procédure. La bande transporteuse 9 pourrait être remplacée par tout autre moyen de transport. La rampe 10 pourrait être dépourvue de coussin d'eau ou même être supprimée.It is understood that the embodiments described above are in no way limiting and that they can receive any desirable changes to inside the frame as defined by claim 1. In particular, the cutting tool 7 could be arranged to move perpendicular to slices 2 compared to block 1 which would be stationary. Nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a fluid under pressure to facilitate detachment of the last tranche released. The device could have a tank containing a liquid, for example water, in which all or part of the device is submerged to prevent drying of slices 2 during the procedure. The band conveyor 9 could be replaced by any other means of transport. Ramp 10 could be devoid of water cushion or even be removed.

    Claims (9)

    1. Device for emplacing in a storage element (11) slices (2) of a sawed block (1) attached by a heel (3) to a cutting support (4, 5), characterized by the fact that it comprises a cutting mechanism (6, 7, 8) comprising a cutting tool (7, 15) arranged so as to cut said heel (3) and a displacement means (6) adapted to produce relative displacement between the assembly of slice (2) and the cutting tool (7, 5) in order to present the slices (2) one by one to the cutting tool and in order to detach the slices one by one from the heel (3), and a recovery mechanism (9, 10) arranged to take each detached slice (2) and to position it in an empty compartment of the storage element (11).
    2. Device according to claim 1, characterized by the fact that it comprises a single-use plate (4) on which the block (1) is fixed and which is mounted on the cutting support (5) and by the fact that the cutting mechanism (6, 7, 8) is arranged so as to cut said heel (3) or the single-use plate (4) in a direction substantially perpendicular to the slices (2) to separate them one by one from the heel.
    3. Device according to claim 1 or 2, characterized by the fact that the cutting mechanism is arranged so as to move the cutting support (4, 5) against the cutting tool (7, 15) which is stationary.
    4. Device according to claim 1 or 2, characterized by the fact that the cutting tool (7) is arranged so as to move relative to the block (1) perpendicularly to the slices (2).
    5. Device according to one of the preceding claims, characterized by the fact that the recovery mechanism comprises a conveyor belt (9) adapted to transfer the slices (2) separated from the heel toward the storage element (11).
    6. Device according to one of the preceding claims, characterized by the fact that the recovery mechanism comprises a ramp (10) on which the separated slices (2) are adapted to slide with or without a water cushion, to be disposed in a compartment of the storage element (11) which is mounted movably in a direction substantially perpendicular to the plane of the ramp (10).
    7. Device according to claim 1, characterized by the fact that the cutting tool is an abrasive disc (7), a band, scroll or wire saw (15), a milling tool or a member operating according to a thermal or fluid pressure process.
    8. Device according to claim 1, characterized by the fact that it comprises an installation having one or several nozzles (17) adapted to inject a fluid under pressure to facilitate the detachment of the freed slice (2).
    9. Device according to one of the preceding claims, characterized by the fact that it comprises a vat containing liquid in which all or a portion of the device is immersed to prevent drying of the slices (2) in the course of the operation.
    EP19970105331 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements Expired - Lifetime EP0802028B1 (en)

    Applications Claiming Priority (3)

    Application Number Priority Date Filing Date Title
    CH95696 1996-04-16
    CH95696A CH691169A5 (en) 1996-04-16 1996-04-16 Device for storage element slices obtained by cutting a block.
    CH956/96 1996-04-16

    Publications (3)

    Publication Number Publication Date
    EP0802028A2 EP0802028A2 (en) 1997-10-22
    EP0802028A3 EP0802028A3 (en) 1998-04-08
    EP0802028B1 true EP0802028B1 (en) 2003-05-21

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    EP19970105331 Expired - Lifetime EP0802028B1 (en) 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements

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    EP (1) EP0802028B1 (en)
    JP (1) JPH1070095A (en)
    CH (1) CH691169A5 (en)
    DE (1) DE69722071T2 (en)

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    DE19900671C2 (en) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Method and device for separating disk-shaped substrates, in particular for wafer production
    DE19950068B4 (en) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Method and device for separating and detaching substrate disks
    DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
    DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
    DE102005023618B3 (en) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Device for separating silicon wafers from a stack
    DE102005053410B4 (en) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
    DE102006021647A1 (en) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
    DE102006059809B4 (en) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Device and method for separating and transporting substrates
    DE102009060575B9 (en) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Method and device for separating wafers from an ingot
    DE102010045098A1 (en) 2010-09-13 2012-03-15 Rena Gmbh Device and method for separating and transporting substrates
    DE102011090053A1 (en) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Separation device and method for separating a metallic or ceramic blank

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    JPS61125767A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of taking out wafer by wire saw
    JPH0639831A (en) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd Housing equipment for wafer in slicing machine
    JPH07205140A (en) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd Wafer taking-out method for wire saw

    Also Published As

    Publication number Publication date
    EP0802028A3 (en) 1998-04-08
    JPH1070095A (en) 1998-03-10
    EP0802028A2 (en) 1997-10-22
    CH691169A5 (en) 2001-05-15
    DE69722071D1 (en) 2003-06-26
    DE69722071T2 (en) 2004-03-18

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