EP0802028A3 - Device for detaching wafers from ingot support and stocking individualized wafers - Google Patents

Device for detaching wafers from ingot support and stocking individualized wafers Download PDF

Info

Publication number
EP0802028A3
EP0802028A3 EP97105331A EP97105331A EP0802028A3 EP 0802028 A3 EP0802028 A3 EP 0802028A3 EP 97105331 A EP97105331 A EP 97105331A EP 97105331 A EP97105331 A EP 97105331A EP 0802028 A3 EP0802028 A3 EP 0802028A3
Authority
EP
European Patent Office
Prior art keywords
wafers
stocking
storage element
slices
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97105331A
Other languages
German (de)
French (fr)
Other versions
EP0802028B1 (en
EP0802028A2 (en
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Hauser Charles
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauser Charles filed Critical Hauser Charles
Publication of EP0802028A2 publication Critical patent/EP0802028A2/en
Publication of EP0802028A3 publication Critical patent/EP0802028A3/en
Application granted granted Critical
Publication of EP0802028B1 publication Critical patent/EP0802028B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Le dispositif pour la mise en élément de stockage (11) de tranches (2) d'un bloc scié (1) attachées par un talon (3) à un support de découpage (4,5) comprend un outil de découpe (7,8) destiné à découper le talon (3) afin de détacher une à une les tranches (2). Ces dernières sont récupérées sur une bande transporteuse (9) et, en glissant sur une rampe (10) sont placées dans une case vide de l'élément de stockage (11) déplacé au fur et à mesure par le moteur (14). On obtient ainsi une mise en élément de stockage automatique fiable, précise, à grand rendement et à productivité accrue, sans risque de casse des tranches séparées.

Figure 00000001
The device for placing in storage element (11) slices (2) of a sawn block (1) attached by a heel (3) to a cutting support (4,5) comprises a cutting tool (7, 8) intended to cut the heel (3) in order to detach one by one the slices (2). The latter are recovered on a conveyor belt (9) and, by sliding on a ramp (10) are placed in an empty box of the storage element (11) moved progressively by the motor (14). This results in a reliable, precise, high-performance and increased productivity automatic storage element, without the risk of breaking the separate slices.
Figure 00000001
EP19970105331 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements Expired - Lifetime EP0802028B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH95696 1996-04-16
CH95696A CH691169A5 (en) 1996-04-16 1996-04-16 Device for storage element slices obtained by cutting a block.
CH956/96 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802028A2 EP0802028A2 (en) 1997-10-22
EP0802028A3 true EP0802028A3 (en) 1998-04-08
EP0802028B1 EP0802028B1 (en) 2003-05-21

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970105331 Expired - Lifetime EP0802028B1 (en) 1996-04-16 1997-03-29 Device for emplacing slices obtained by sawing of a block in storage elements

Country Status (4)

Country Link
EP (1) EP0802028B1 (en)
JP (1) JPH1070095A (en)
CH (1) CH691169A5 (en)
DE (1) DE69722071T2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671C2 (en) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Method and device for separating disk-shaped substrates, in particular for wafer production
DE19950068B4 (en) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Method and device for separating and detaching substrate disks
DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
DE102005023618B3 (en) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Device for separating silicon wafers from a stack
DE102005053410B4 (en) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
DE102006021647A1 (en) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
DE102006059809B4 (en) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Device and method for separating and transporting substrates
DE102009060575B9 (en) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Method and device for separating wafers from an ingot
DE102010045098A1 (en) 2010-09-13 2012-03-15 Rena Gmbh Device and method for separating and transporting substrates
DE102011090053A1 (en) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Separation device and method for separating a metallic or ceramic blank

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (en) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Method and apparatus for cutting wooden rods used as weft in mats and the like
JPS61125767A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of taking out wafer by wire saw
JPH0639831A (en) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd Housing equipment for wafer in slicing machine
JPH07205140A (en) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd Wafer taking-out method for wire saw

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (en) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Method and apparatus for cutting wooden rods used as weft in mats and the like
JPS61125767A (en) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd Method of taking out wafer by wire saw
JPH0639831A (en) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd Housing equipment for wafer in slicing machine
JPH07205140A (en) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd Wafer taking-out method for wire saw

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 258 (M - 1606) 17 May 1994 (1994-05-17) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 011 26 December 1995 (1995-12-26) *

Also Published As

Publication number Publication date
EP0802028B1 (en) 2003-05-21
JPH1070095A (en) 1998-03-10
EP0802028A2 (en) 1997-10-22
CH691169A5 (en) 2001-05-15
DE69722071D1 (en) 2003-06-26
DE69722071T2 (en) 2004-03-18

Similar Documents

Publication Publication Date Title
EP0802028A3 (en) Device for detaching wafers from ingot support and stocking individualized wafers
FR2823373B1 (en) DEVICE FOR CUTTING LAYER OF SUBSTRATE, AND ASSOCIATED METHOD
EP0798091A3 (en) Wire saw and method of slicing a cylindrical workpiece, e.g. an ingot
AU2003292305A1 (en) Method for forming a brittle zone in a substrate by co-implantation
EP0283311A3 (en) Thin film forming method and thin film forming apparatus
CL2009000783A1 (en) Automatic apparatus and method to peel, extract the core and cut the cell of the seeds of a pear, which consists of a feeder cup means and a height pusher and fixer means that arrange the pear in said glass for processing. Divisional patent application for invention no. 416-1994.
EP0798092A3 (en) Method of slicing semiconductor single crystal ingot
BR0114234A (en) Metal Casting Method and Apparatus
EP1326266A3 (en) Protective tape applying and separating method
EP1273402A3 (en) Device and Method for automatically cutting tablets
EP1170088A3 (en) Semiconductor wafer grinding method and machine
CA2443692A1 (en) Device for the mechanical separation of cuttings from a plant branch
EP0812932A3 (en) Production of diamond film
FR2768952B1 (en) METHOD FOR THE OXYCOUPAGE OF CONTINUOUS CASTING BALLS, AND DEVICE FOR CARRYING OUT SAID METHOD
EP0798090A3 (en) Method of cutting a workpiece with a wire saw
JPH05329798A (en) Cutting device for scallion
NZ233338A (en) Removing top of fallen tree by placing explosive charge round trunk
EP1125705A3 (en) A machine for making grooves in edges of slabs or tiles
FR2826899B1 (en) MONITORING DEVICE FOR THE IMPLEMENTATION OF A METHOD FOR RECTIFICATION OF A CUTTING SHAFT
CA2509582C (en) Magnetically attachable magnetic wedge separator
CA2595384A1 (en) Removal of material from a preformed tablet
FR2806872B1 (en) SUPPORT DEVICE FOR CUTTING TOOL FOR SHEARING THE VINE
FR2501551A1 (en) Cut=off device for multistrand continuous caster - with automatic measurement and computer control
CN216193894U (en) Road surface grooving machine for highway engineering construction
ATE241505T1 (en) METHOD AND DEVICE FOR REMOVAL OF COVERS FROM OBJECTS

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HCT SHAPING SYSTEMS SA

RIN1 Information on inventor provided before grant (corrected)

Inventor name: HAUSER, CHARLES

17P Request for examination filed

Effective date: 19980724

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

17Q First examination report despatched

Effective date: 20020307

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

RTI1 Title (correction)

Free format text: DEVICE FOR EMPLACING SLICES OBTAINED BY SAWING OF A BLOCK IN STORAGE ELEMENTS

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Designated state(s): DE FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 69722071

Country of ref document: DE

Date of ref document: 20030626

Kind code of ref document: P

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20030715

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20040224

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20110324

Year of fee payment: 15

Ref country code: FR

Payment date: 20110404

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20110321

Year of fee payment: 15

Ref country code: DE

Payment date: 20110325

Year of fee payment: 15

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20120329

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20121130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 69722071

Country of ref document: DE

Effective date: 20121002

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120329

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20121002