JPH0639831A - Housing equipment for wafer in slicing machine - Google Patents
Housing equipment for wafer in slicing machineInfo
- Publication number
- JPH0639831A JPH0639831A JP4250891A JP4250891A JPH0639831A JP H0639831 A JPH0639831 A JP H0639831A JP 4250891 A JP4250891 A JP 4250891A JP 4250891 A JP4250891 A JP 4250891A JP H0639831 A JPH0639831 A JP H0639831A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- conveyor
- wafer
- cut
- suction plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Warehouses Or Storage Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は回転する環状切断刃内に
被切断部材を挿入し、薄片状に切断された切断片（以下
ウエハーという）をカセットに収納するスライシングマ
シンにおける切断片の収納装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for storing cut pieces in a slicing machine which inserts a member to be cut into a rotating annular cutting blade and stores cut pieces (hereinafter referred to as wafers) cut into thin pieces in a cassette. Regarding
【０００２】[0002]
【従来の技術】上記スライシングマシンにより切断され
た高硬度脆性材料をもってするウエハーは、人手により
これを取り出し、カセットまたはこれに類する容器に各
葉毎に区分して収納する手段が採られている。2. Description of the Related Art A wafer having a high hardness brittle material cut by the above slicing machine is manually taken out and stored in a cassette or a similar container for each leaf.
【０００３】[0003]
【発明が解決しようとする課題】この方法による時は、
手数を要し自動化の隘路となっている。かつ狭い場所で
のウエハーの取り外しは往々にしてこれを落とし、ある
いは損傷する等の問題がある。When this method is used,
It is a bottleneck of automation that requires labor. Moreover, the removal of a wafer in a narrow space often causes a problem such as dropping or damaging the wafer.
【０００４】本発明は上記の点に鑑みてなされたもの
で、ウエハーの取り出しとカセットへの収納の自動化を
図ることを目的とする。また上記高硬度脆性の切断に際
し、これに損傷を与えないために、一般にダミー材を添
着し、このダミー材において切り落とす手段が採られて
いる。The present invention has been made in view of the above points, and an object thereof is to automate the taking-out of a wafer and the storage in a cassette. In addition, in order to prevent damage to the high hardness brittleness cutting, a dummy material is generally attached and the dummy material is cut off.
【０００５】従ってウエハーには切断されたダミー材が
付着しており、後行程においてこれを除去する必要があ
る。このためダミー材の位置を所定位置、例えばカセッ
トの奥、または前方に向けて収納することが好ましい。Therefore, the cut dummy material adheres to the wafer, and it is necessary to remove it in the subsequent process. For this reason, it is preferable to store the dummy material at a predetermined position, for example, toward the back of the cassette or toward the front.
【０００６】第２の発明は、上記カセットへの供給にあ
たり、ウエハーに付着するダミー材の位置を自動的に所
定方向に指向することを目的とする。A second object of the present invention is to automatically orient the position of the dummy material attached to the wafer in a predetermined direction when supplying it to the cassette.
【０００７】[0007]
【課題を解決するための手段】本発明は上記目的を達成
するためになしたもので、環状切断刃により切断され搬
送機構により搬送された薄片状切断片を吸着保持する吸
着盤と、この吸着盤を先端に備えた回動アームと、多数
の仕切片を設けた切断片収納カセット及び吸着盤に保持
された切断片を受け取りカセット側に搬送するコンベア
とを備え、吸着盤により吸着した切断片をコンベアに供
給し、コンベアによりカセットに供給するとともに、カ
セットには切断片の供給と同期して仕切片を１段づつ上
昇する昇降機構を備え、各仕切片に順次切断片を供給す
るようにしたものである。SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and is a suction plate for sucking and holding thin flaky cutting pieces cut by an annular cutting blade and conveyed by a conveying mechanism, and this suction plate. A turning arm equipped with a board at the tip, a cutting piece storage cassette provided with a large number of partitions, and a conveyor for receiving the cutting pieces held on the suction board and conveying them to the cassette side, and the cutting pieces sucked by the suction board To the conveyor, and to the cassette by the conveyor, the cassette is equipped with an elevating mechanism that raises the pieces one by one in synchronization with the supply of the cut pieces, so that the cut pieces are sequentially supplied to each piece. It was done.
【０００８】また第２の発明は吸着盤は自転機構を備
え、回動アームの回動による公転とこれに関連して自転
を行い、切断片に付着するダミー材をカセットに対し所
定方向に指向してコンベアに供給するようにしたもので
ある。According to a second aspect of the present invention, the suction cup is provided with a rotation mechanism, and revolves around the rotation of the rotation arm and rotates in association therewith to direct the dummy material adhering to the cut piece in a predetermined direction with respect to the cassette. Then, it is supplied to the conveyor.
【０００９】[0009]
【作用】吸着盤はウエハーを吸着した状態で、回動アー
ムの回動によりコンベア上に移行し、ウエハーをコンベ
アに供給する。コンベアはこれをカセット内に移送す
る。これに伴い、昇降機溝はカセットを仕切片の１ピッ
チ上昇し、ウエハーを仕切片により受け取る。この際、
吸着盤を公転とともに自転させることにより、ウエハー
に付着するダミー材を所定方向に指向して収納すること
ができる。With the suction plate sucking the wafer, it moves onto the conveyor by the rotation of the rotating arm and supplies the wafer to the conveyor. The conveyor transfers this into the cassette. Along with this, the elevator groove raises the cassette by one pitch of the partition and receives the wafer by the partition. On this occasion,
By rotating the suction disk along with the revolution, the dummy material attached to the wafer can be stored in a predetermined direction.
【００１０】[0010]
【実施例】図は本発明の実施例に関し、Ａはスライシン
グマシンに設けられる周知の環状切断刃であり、被切断
部材Ｗは下部にダミー材Ｄを取り付けて切断刃の内孔に
挿入し、適宜の送り機構により所定量づつ送り出しと昇
降を行い、薄片状に切断してウエハーｗを形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings relate to an embodiment of the present invention, in which A is a well-known annular cutting blade provided in a slicing machine, and a member W to be cut has a dummy material D attached to the lower part thereof and is inserted into the inner hole of the cutting blade. The wafer w is formed by cutting it into thin pieces by raising and lowering by a predetermined amount by an appropriate feeding mechanism.
【００１１】１は上記ウエハーｗの取り出し装置であ
る。この取り出し装置１はウエハーｗに対する取り出し
用の吸着盤２と、この吸着盤２を支持する保持体３と、
この保持体３を先端に取り付けるベース板４、及びこの
ベース板４を支承するスライド板５とを備える。Reference numeral 1 is a device for taking out the wafer w. The take-out device 1 includes a suction board 2 for taking out the wafer w, a holder 3 that supports the suction board 2,
A base plate 4 for attaching the holding body 3 to the tip and a slide plate 5 for supporting the base plate 4 are provided.
【００１２】保持体３はベース板４先端に取り付けた軸
受６に支持される支軸７に固定され、支軸７は揺動シリ
ンダー８に連結されており、この揺動シリンダー８の作
動により垂直の吸着位置（実線位置）と水平の移送位置
（鎖線位置）とに往復移行される。９は垂直位置保持用
ストッパ、１０は水平位置保持用ストッパである。The holding body 3 is fixed to a support shaft 7 supported by a bearing 6 attached to the tip of the base plate 4, and the support shaft 7 is connected to an oscillating cylinder 8. Is reciprocated between the suction position (solid line position) and the horizontal transfer position (chain line position). Reference numeral 9 is a vertical position holding stopper, and 10 is a horizontal position holding stopper.
【００１３】なお上記ベース板４はスライド板５に設け
た固定支軸１１を中心として回動可能に支持され、調整
手段１２により支軸１１を中心として回動し、吸着盤２
をウエハーｗに対し、左右の傾斜を調整する。また１３
はベース位置４を前後させ吸着盤２とウエハーｗとの間
隔を調整するものである。ただし、これらの構造は本願
とは関係はなく、その説明は省略する。The base plate 4 is supported so as to be rotatable about a fixed support shaft 11 provided on the slide plate 5, and is rotated about the support shaft 11 by an adjusting means 12, so that the suction plate 2 is held.
With respect to the wafer w, the inclination of the left and right is adjusted. Again 13
Is to move the base position 4 back and forth to adjust the distance between the suction plate 2 and the wafer w. However, these structures are not related to the present application, and the description thereof will be omitted.
【００１４】１４はスライド板５を移行する搬送機構で
あり、例えばロッドレスシリンダをもって構成し、上記
取り出し用吸着盤２をウエハーｗの吸着位置と後方適所
の受け渡し位置とに往復移行するようにしたものであ
る。Reference numeral 14 denotes a transfer mechanism for moving the slide plate 5, which is constituted by, for example, a rodless cylinder so that the pick-up suction plate 2 can be reciprocated between a suction position of the wafer w and a delivery position at an appropriate rear position. It is a thing.
【００１５】２０は切断片収納装置である。この収納装
置２０は上記搬送機構１４により移送した水平状態のウ
エハーｗを吸着する受け取り用吸着盤２１と、この吸着
盤２１を先端に備える回動アーム２２と、ウエハー収納
用カセット２３及びカセットにウエハーｗを供給するコ
ンベア２４とを備える。上記吸着盤は、回動アーム２２
の先端に回動自在に支持される支持軸２５に取り付けら
れた昇降シリンダ２６に取り付けられている。Reference numeral 20 is a cut piece storage device. The storage device 20 has a receiving suction plate 21 for sucking the horizontal wafer w transferred by the transfer mechanism 14, a rotating arm 22 having the suction plate 21 at its tip, a wafer storing cassette 23, and a wafer storing cassette. and a conveyor 24 for supplying w. The suction plate is a rotating arm 22.
It is attached to an elevating cylinder 26 attached to a support shaft 25 that is rotatably supported at the tip of the.
【００１６】回動アーム２２の基端は垂直の回動軸２７
に固定され、回動軸２７は駆動機２８に接続される。駆
動機２８は電動機を用いてもよいが、所定角度の回動に
は、例えばエアー式ロータリアクチュエータを用いるこ
とが好ましい。The base end of the rotating arm 22 has a vertical rotating shaft 27.
The rotary shaft 27 is connected to the driving machine 28. An electric motor may be used as the drive unit 28, but it is preferable to use, for example, an air type rotary actuator for rotating the drive unit 28 at a predetermined angle.
【００１７】カセット２３は前方を開口し、ウエハーｗ
を載置する多数の仕切片３０を備える。またこのカセッ
ト２３は昇降機構３１に取り付けている。この昇降機構
３１はカセット２３を載置する枠体３２と、この枠体３
２の昇降用モータ３３と、この昇降用モータ３３により
ベルト３４を介して回動される螺軸３５及びこの螺軸３
５に螺合し、基端を枠体３２に取り付ける螺筒３６とを
備える。３７はフレームＦに取り付けたガイドレール、
３８は枠体３２に取り付け、このガイドレール３７に嵌
合するガイドシューである。The cassette 23 is opened at the front, and the wafer w
It is equipped with a large number of partitions 30 for mounting. The cassette 23 is attached to the lifting mechanism 31. The elevating mechanism 31 includes a frame body 32 on which the cassette 23 is placed, and a frame body 3
2, the lifting motor 33, the screw shaft 35 rotated by the lifting motor 33 via the belt 34, and the screw shaft 3
5, and a screw cylinder 36 that is screwed into the frame 5 and has its base end attached to the frame 32. 37 is a guide rail attached to the frame F,
Reference numeral 38 is a guide shoe attached to the frame 32 and fitted to the guide rail 37.
【００１８】また３９はウエハーｗが供給されたか否か
を検知するウエハー検知センサーである。また４０は枠
体３２の所定ピッチの上昇を規制する昇降検知センサ
ー、４１は枠体３２の最下部及び最上部の位置検知用セ
ンサーであり、上記螺筒３６にストライカ等の突子４２
を取り付け、枠体３２を仕切片間隔、すなわち１ピッチ
毎に順次上昇し、最上部の位置まで上昇したとき信号を
発するようにしたものである。Further, 39 is a wafer detection sensor for detecting whether or not the wafer w is supplied. Further, 40 is a lift detection sensor for restricting the rise of the frame 32 by a predetermined pitch, 41 is a position detection sensor for the lowermost and uppermost parts of the frame 32, and the screw tube 36 has a protrusion 42 such as a striker.
Is attached, the frame body 32 is sequentially raised at intervals of partitions, that is, every pitch, and a signal is emitted when the frame body 32 is raised to the uppermost position.
【００１９】コンベア２４は上記搬送機構１４とカセッ
ト２３との間に敷設される。４４はコンベア駆動モータ
であり、ベルト４５によりコンベア２４に連結されてい
る。このコンベア２４は一端を搬送機構１４側に位置
し、他端はカセット２３内部にまで延長して設けられ
る。このため仕切片３０はコンベア挿入のため切込み４
３を形成する。The conveyor 24 is laid between the transport mechanism 14 and the cassette 23. A conveyor drive motor 44 is connected to the conveyor 24 by a belt 45. The conveyor 24 has one end located on the transport mechanism 14 side and the other end extended to the inside of the cassette 23. Therefore, the partition 30 is notched 4 for inserting the conveyor.
3 is formed.
【００２０】また５０は自転機構である。この自転機構
は回動アーム２２の回動軸２７と同芯に設けられる固定
プーリ５２と、吸着盤２１を支持する支持軸２５に取り
付けられる従動プーリ５４及び両プーリ間に懸架される
ベルト５５とからなる。Reference numeral 50 is a rotation mechanism. This rotation mechanism includes a fixed pulley 52 provided concentrically with the rotation shaft 27 of the rotation arm 22, a driven pulley 54 attached to the support shaft 25 supporting the suction plate 21, and a belt 55 suspended between both pulleys. Consists of.
【００２１】これにより吸着盤２１は回動アーム２２に
より回動（公転）されるとともに、回動を阻止されたベ
ルト５５により回転（自転）を行う。As a result, the suction plate 21 is rotated (revolved) by the rotating arm 22 and is rotated (rotated) by the belt 55 which is prevented from rotating.
【００２２】この自転は吸着盤２１が搬送機構１４から
送られたウエハーｗを受け取るとき、これに付着する切
断されたダミー材ｄをカセット２３に所定方向に指向さ
せて供給するために行うものである。図例ではそのまま
コンベア２４を介してカセット２３に送り込むときは、
ダミー材ｄは仕切片の側方に位置することとなり、好ま
しくない場合がある。このため送り込みに際し、ダミー
材を前方に位置して供給するためには回動アーム２２の
直角の回動（９０度）とともに１８０度の自転を行なわ
しめ、相対的にダミ−材を９０度反転させている。この
自転角度は固定プーリ５２と従動プーリ５４との径の比
により任意に設定する。This rotation is performed so that when the suction disk 21 receives the wafer w sent from the transfer mechanism 14, the cut dummy material d adhering to the wafer w is directed to the cassette 23 in a predetermined direction and supplied. is there. In the example shown in FIG.
The dummy material d is located on the side of the partition, which is not preferable in some cases. For this reason, in order to feed the dummy material to the front during feeding, the rotary arm 22 is rotated at a right angle (90 degrees) and rotated by 180 degrees, and the dummy material is relatively inverted by 90 degrees. I am letting you. This rotation angle is arbitrarily set by the ratio of the diameters of the fixed pulley 52 and the driven pulley 54.
【００２３】上記構成において、切断されたウエハーｗ
は取り出し装置１の取り出し用吸着盤２により吸着し、
次いで揺動シリンダー８の作動にて水平状態に回動し、
搬送機構１４により所定の受け渡しの位置に移行され
る。In the above structure, the cut wafer w
Is sucked by the pickup suction plate 2 of the pickup device 1,
Then, the rocking cylinder 8 is actuated to rotate horizontally,
It is moved to a predetermined delivery position by the transport mechanism 14.
【００２４】しかる後、回動アーム２２を回動し、受け
取り用吸着盤２１をウエハーｗ上に移行し、昇降シリン
ダ２６を作動して吸着盤２１を下降し、ウエハーｗを吸
着して所定位置に上昇する。次いで回動アーム２２を回
動して吸着盤２１をコンベア２４上に移行する。この
際、自転機構を設けることにより吸着盤２１は公転とと
もに自転し、ウエハーｗに付着するダミー材ｄを所定方
向に指向する。次いで吸着盤２１の吸気作用を開放し、
ウエハーｗをコンベア２４に供給する。Thereafter, the rotating arm 22 is rotated, the receiving suction plate 21 is moved onto the wafer w, the elevating cylinder 26 is operated to lower the suction plate 21, and the wafer w is sucked to a predetermined position. Rise to. Next, the rotating arm 22 is rotated to move the suction plate 21 onto the conveyor 24. At this time, by providing a rotation mechanism, the suction plate 21 rotates about its revolution and directs the dummy material d adhering to the wafer w in a predetermined direction. Next, the suction action of the suction board 21 is released,
The wafer w is supplied to the conveyor 24.
【００２５】コンベア２４はこれを受け取り、カセット
内に移送する。ウエハーｗの移行は検知センサー３９に
より検知し、設定時間後、コンベア２４を停止し昇降機
構３１を作動し、カセット２３を１ピッチ上昇し、ウエ
ハーｗを仕切片３０に供給する。以下この動作を繰り返
し、カセット２３のすべての仕切片３０上にウエハーｗ
が供給されたとき、昇降機構３１は信号を発して停止す
る。The conveyor 24 receives this and transfers it into the cassette. The movement of the wafer w is detected by the detection sensor 39, and after the set time, the conveyor 24 is stopped, the elevating mechanism 31 is operated, the cassette 23 is raised by one pitch, and the wafer w is supplied to the partition 30. After this operation is repeated, the wafer w is placed on all the partitions 30 of the cassette 23.
Is supplied, the elevating mechanism 31 gives a signal and stops.
【００２６】なお、上記実施例は切断部、及び取り出し
装置１は水平に配置した例を示したが、これは垂直に配
置した場合も同様である。ただし、この場合ウエハーｗ
は水平に保持することが好ましい。そのため、取り出し
用吸着盤は揺動シリンダー８による回動を必要とせず、
そのまま下降させればよい。In the above embodiment, the cutting section and the take-out device 1 are arranged horizontally, but this is also the case when they are arranged vertically. However, in this case the wafer w
Are preferably held horizontally. Therefore, the suction suction plate does not need to be rotated by the swing cylinder 8,
Just lower it.
【００２７】[0027]
【発明の効果】以上の如く本発明による時は、供給され
るウエハーを吸着盤により吸着し、これをコンベアを介
してカセット内に移送し、カセットを仕切片の１ピッチ
上昇することによりこれを受け取るようにしたから、ウ
エハーの受け取り及び収納を自動的、かつ能率よく行う
ことができる。この際、吸着盤を回動アームの先端に取
り付け、回動アームを回動してウエハーをコンベアに供
給するに際し、吸着盤の自転機構を設けるときはウエハ
ーに付着する切断されたダミー材を所定方向に指向する
ことができ、次行程の作業に便利である。As described above, according to the present invention, the wafer to be supplied is sucked by the suction plate, transferred to the cassette through the conveyor, and the cassette is raised by one pitch of the partition. Since the wafers are received, the wafers can be received and stored automatically and efficiently. At this time, when the suction plate is attached to the tip of the rotation arm and the rotation arm is rotated to supply the wafer to the conveyor, when the rotation mechanism of the suction plate is provided, the cut dummy material attached to the wafer is predetermined. It can be oriented in any direction, which is convenient for the next work.
【図１】全体正面図である。FIG. 1 is an overall front view.
【図２】平面図である。FIG. 2 is a plan view.
【図３】カセットを切断して示す図１の右側面図であ
る。FIG. 3 is a right side view of FIG. 1 showing the cassette in a cut state.
【図４】カセットの昇降機構の側面説明図である。FIG. 4 is a side view of a cassette lifting mechanism.
１４ 搬送機構 ２０ 切断片収納装置 ２１ 吸着盤 ２２ 回動アーム ２３ カセット ２４ コンベア ３０ 仕切片 ３１ 昇降機構 ５０ 回転機構 ５１ 回転軸 ５２ 固定プーリ ５４ 従動プーリ ５５ ベルト Ａ 環状切断刃 ｗ ウエハー ｄ ダミー材 14 Conveyance Mechanism 20 Cutting Piece Storage Device 21 Suction Plate 22 Rotating Arm 23 Cassette 24 Conveyor 30 Partition 31 Elevating Mechanism 50 Rotating Mechanism 51 Rotating Shaft 52 Fixed Pulley 54 Driven Pulley 55 Belt A Annular Cutting Blade w Wafer d Dummy Material
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/304 ３１１ Ｚ 8728−4Ｍ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 21/304 311 Z 8728-4M
Claims (2)
り搬送された薄片状切断片を吸着保持する吸着盤と、こ
の吸着盤を先端に備えた回動アームと、多数の仕切片を
設けた切断片収納カセット及び吸着盤に保持された切断
片を受け取りカセット側に搬送するコンベアとを備え、
吸着盤により吸着した切断片をコンベアに供給し、コン
ベアによりカセットに供給するとともに、カセットには
切断片の供給と同期して仕切片を１段づつ上昇する昇降
機構を備え、各仕切片に順次切断片を供給することを特
徴とするスライングマシンにおけるウエハーの収納装
置。1. A suction plate for sucking and holding thin flaky cutting pieces cut by an annular cutting blade and conveyed by a conveying mechanism, a rotary arm having the suction plate at its tip, and a cutting provided with a large number of partitions. A piece storage cassette and a conveyor for receiving the cut pieces held on the suction plate and conveying them to the cassette side,
The cut pieces adsorbed by the suction plate are supplied to the conveyor, and are supplied to the cassette by the conveyor, and the cassette is equipped with an elevating mechanism that raises the pieces one step at a time in synchronization with the supply of the cut pieces. A wafer storage device in a slashing machine, which supplies cutting pieces.
回動による公転とこれに関連して自転を行い、切断片に
付着するダミー材をカセットに対し所定方向に指向して
コンベアに供給することを特徴とする請求項１記載のス
ライシングマシンにおけるウエハーの収納装置。2. The suction plate is provided with a rotation mechanism, performs revolving by rotation of a rotating arm and rotates in association therewith, and directs a dummy material adhering to a cut piece in a predetermined direction with respect to a cassette to a conveyor. The wafer storage device in the slicing machine according to claim 1, wherein the wafer storage device is supplied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4250891A JPH0639831A (en) | 1991-02-13 | 1991-02-13 | Housing equipment for wafer in slicing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4250891A JPH0639831A (en) | 1991-02-13 | 1991-02-13 | Housing equipment for wafer in slicing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0639831A true JPH0639831A (en) | 1994-02-15 |
Family
ID=12638008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4250891A Pending JPH0639831A (en) | 1991-02-13 | 1991-02-13 | Housing equipment for wafer in slicing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639831A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0802028A2 (en) * | 1996-04-16 | 1997-10-22 | Charles Hauser | Device for detaching wafers from ingot support and stocking individualized wafers |
| CN109967648A (en) * | 2019-04-23 | 2019-07-05 | 合肥市奥比特电气有限公司 | Intelligence switching transfer device |
| CN111508865A (en) * | 2018-12-18 | 2020-08-07 | 细美事有限公司 | Dissolved ozone removal unit, substrate processing apparatus including the same, and substrate processing method |
-
1991
- 1991-02-13 JP JP4250891A patent/JPH0639831A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0802028A2 (en) * | 1996-04-16 | 1997-10-22 | Charles Hauser | Device for detaching wafers from ingot support and stocking individualized wafers |
| EP0802028A3 (en) * | 1996-04-16 | 1998-04-08 | Charles Hauser | Device for detaching wafers from ingot support and stocking individualized wafers |
| CN111508865A (en) * | 2018-12-18 | 2020-08-07 | 细美事有限公司 | Dissolved ozone removal unit, substrate processing apparatus including the same, and substrate processing method |
| CN111508865B (en) * | 2018-12-18 | 2023-04-07 | 细美事有限公司 | Dissolved ozone removal unit, substrate processing apparatus including the same, and substrate processing method |
| CN109967648A (en) * | 2019-04-23 | 2019-07-05 | 合肥市奥比特电气有限公司 | Intelligence switching transfer device |
| CN109967648B (en) * | 2019-04-23 | 2024-03-22 | 合肥市奥比特电气有限公司 | Intelligent transfer device |
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