EP0270954B1 - Fusible du type chip - Google Patents
Fusible du type chip Download PDFInfo
- Publication number
- EP0270954B1 EP0270954B1 EP87117577A EP87117577A EP0270954B1 EP 0270954 B1 EP0270954 B1 EP 0270954B1 EP 87117577 A EP87117577 A EP 87117577A EP 87117577 A EP87117577 A EP 87117577A EP 0270954 B1 EP0270954 B1 EP 0270954B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chip
- fuse
- conducting member
- insulating member
- protecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
Definitions
- This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-type fuse which is inexpensive and can be easily automatically mounted on a PCB.
- PCB printed circuit board
- a fuse is used to interrupt overcurrents which damage electronic parts mounted on a PCB.
- chip-type fuses which are mounted on a PCB have been developed in recent years.
- One of the conventional chip-type fuses includes an insulating substrate and a conductor.
- the insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other.
- the conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
- Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
- the conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily be automatically mounted on a PCB.
- a circuit fuse assembly comprising a plurality of fuse elements.
- the plurality of fuse elements is simultaneously formed using printed circuit or through hole plating techniques and includes means for easily substituting a different one of the fuse elements when the in-circuit fuse element burns out due to an overload current condition.
- a fuse circuit for high frequency applications comprising a metal conductor disposed on a support element which is constituted of ceramic.
- DE-A-2845540 discloses a heat resistant coating material for electrical resistors.
- the coating material is composed of a mixture of silicone resin and epoxy resin to provide an inflammable coating for electrical components.
- Figs. 1 shows a chip-type fuse according to an embodiment of the invention.
- a chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm x 1.6mm.
- a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a.
- Conducting member 3 can be made of a silver-palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold.
- Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods.
- Conducting member 3 is a rectangular parallelepiped and both ends of the conducting member 3 are connected to electrodes 4a and 4b, respectively.
- Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
- chip-type fuse 1 Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to reduce the mounting cost.
- fuse 1 The operation of fuse 1 is described hereinafter.
- conducting member 3 If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between the ends to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
- conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-resistant.
- Fig. 2 shows a plan view of the chip-type fuse according the invention.
- Conducting member 3 has trimmed portions 3b which are trimmed with laser light to obtain appropriate resistance.
- chip-type fuse 1 The operation of chip-type fuse 1 is described hereinafter.
- fuse 1 If an overcurrent flows through fuse 1, one of trimmed portions 3b is melted and broken to interrupt the overcurrent. The reliability of fuse 1 increases because trimmed portions 3b are easily melted and broken by an overcurrent.
- the conducting member 3 is rectangular it can have another shape.
- the protecting film 5 can be made of a glass material.
Landscapes
- Fuses (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Claims (4)
- Fusible du type puce (1) comprenant :
un élément d'isolation (2);
une paire d'éléments d'électrode (4a, 4b) qui sont réalisés en un métal en film mince et qui sont disposés sur les extrémités latérales (2b, 2c) dudit élément d'isolation (2);
un élément de conduction (3) qui est formé sur la surface supérieure (2a) dudit élément d'isolation (2) et qui connecte électriquement ladite paire d'éléments d'électrode (4a, 4b) l'un à l'autre ;
l'élément de conduction (3) inclut une pluralité de parties rognées (3b); et
un élément de protection (5) disposé sur ledit élément d'isolation (2) pour protéger ledit élément de conduction (3),
caractérisé en ce que
la pluralité de parties rognées (3b) de l'élément de conduction (3) sont connectées en série. - Fusible selon la revendication 1, dans lequel l'élément isolant (2) est un parallélépipède rectangle en céramique.
- Fusible selon la revendication 1, dans lequel l'élément de protection (5) est réalisé à partir d'un matériau de résine silicone.
- Fusible selon la revendication 1, dans lequel l'élément de protection (5) est réalisé à partir d'un matériau de verre.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT87117577T ATE89435T1 (de) | 1986-12-01 | 1987-11-27 | Chip-sicherung. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP287081/86 | 1986-12-01 | ||
JP61287081A JPH0831303B2 (ja) | 1986-12-01 | 1986-12-01 | チツプ型ヒユ−ズ |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0270954A1 EP0270954A1 (fr) | 1988-06-15 |
EP0270954B1 true EP0270954B1 (fr) | 1993-05-12 |
Family
ID=17712806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87117577A Expired - Lifetime EP0270954B1 (fr) | 1986-12-01 | 1987-11-27 | Fusible du type chip |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0270954B1 (fr) |
JP (1) | JPH0831303B2 (fr) |
AT (1) | ATE89435T1 (fr) |
DE (1) | DE3785835T2 (fr) |
ES (1) | ES2046194T3 (fr) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7983024B2 (en) | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
US8075872B2 (en) | 2003-08-06 | 2011-12-13 | Gruenenthal Gmbh | Abuse-proofed dosage form |
US8114384B2 (en) | 2004-07-01 | 2012-02-14 | Gruenenthal Gmbh | Process for the production of an abuse-proofed solid dosage form |
US8309060B2 (en) | 2003-08-06 | 2012-11-13 | Grunenthal Gmbh | Abuse-proofed dosage form |
US8383152B2 (en) | 2008-01-25 | 2013-02-26 | Gruenenthal Gmbh | Pharmaceutical dosage form |
US8722086B2 (en) | 2007-03-07 | 2014-05-13 | Gruenenthal Gmbh | Dosage form with impeded abuse |
US9161917B2 (en) | 2008-05-09 | 2015-10-20 | Grünenthal GmbH | Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet |
US9629807B2 (en) | 2003-08-06 | 2017-04-25 | Grünenthal GmbH | Abuse-proofed dosage form |
US9636303B2 (en) | 2010-09-02 | 2017-05-02 | Gruenenthal Gmbh | Tamper resistant dosage form comprising an anionic polymer |
US9655853B2 (en) | 2012-02-28 | 2017-05-23 | Grünenthal GmbH | Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer |
US9675610B2 (en) | 2002-06-17 | 2017-06-13 | Grünenthal GmbH | Abuse-proofed dosage form |
US9913814B2 (en) | 2014-05-12 | 2018-03-13 | Grünenthal GmbH | Tamper resistant immediate release capsule formulation comprising tapentadol |
US11844865B2 (en) | 2004-07-01 | 2023-12-19 | Grünenthal GmbH | Abuse-proofed oral dosage form |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH675034A5 (fr) * | 1987-11-03 | 1990-08-15 | Schurter Ag | |
JPH0541486Y2 (fr) * | 1990-05-10 | 1993-10-20 | ||
JPH0433230A (ja) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | チップ型ヒューズ |
GB2255455A (en) * | 1991-04-22 | 1992-11-04 | Electronic Components Ltd | Fuse |
US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
JPH0620806A (ja) * | 1992-03-21 | 1994-01-28 | Rohm Co Ltd | 固体フューズ |
JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
DE4223621C1 (de) * | 1992-07-17 | 1993-10-21 | Siemens Ag | Hochfrequenz-Schmelzsicherung |
SE505448C2 (sv) * | 1993-05-28 | 1997-09-01 | Ericsson Telefon Ab L M | Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring |
US5586014A (en) * | 1994-04-28 | 1996-12-17 | Rohm Co., Ltd. | Fuse arrangement and capacitor containing a fuse |
US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
US5914648A (en) * | 1995-03-07 | 1999-06-22 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
ATE173355T1 (de) * | 1995-06-07 | 1998-11-15 | Littelfuse Inc | Verbessertes verfahren und gerät für oberflächenmontierte sicherungsvorrichtung |
US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
DE29616063U1 (de) * | 1996-09-14 | 1996-10-31 | Wickmann-Werke GmbH, 58453 Witten | Elektrische Sicherung |
DE10005836B4 (de) * | 2000-02-10 | 2006-10-12 | Vossloh-Schwabe Elektronik Gmbh | Leiterplattensicherung mit erhöhter Sicherheit |
EP1396003A1 (fr) * | 2001-06-11 | 2004-03-10 | Wickmann-Werke GmbH | Composant de fusible |
EP1274110A1 (fr) * | 2001-07-02 | 2003-01-08 | Abb Research Ltd. | Fusible |
US6878004B2 (en) | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
US7183891B2 (en) | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
DE10361596A1 (de) | 2003-12-24 | 2005-09-29 | Grünenthal GmbH | Verfahren zur Herstellung einer gegen Missbrauch gesicherten Darreichungsform |
DE102005005446A1 (de) | 2005-02-04 | 2006-08-10 | Grünenthal GmbH | Bruchfeste Darreichungsformen mit retardierter Freisetzung |
WO2005039256A1 (fr) * | 2003-10-17 | 2005-04-28 | Koninklijke Philips Electronics N.V. | Carte de circuits imprimes avec un fusible |
DE102005005449A1 (de) | 2005-02-04 | 2006-08-10 | Grünenthal GmbH | Verfahren zur Herstellung einer gegen Missbrauch gesicherten Darreichungsform |
JP4880950B2 (ja) * | 2005-09-05 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9190235B2 (en) | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
JP5270196B2 (ja) * | 2008-03-07 | 2013-08-21 | 三菱電機株式会社 | 半導体装置及びその半導体装置を備えたインバータシステム |
MX2012000317A (es) | 2009-07-22 | 2012-02-08 | Gruenenthal Gmbh | Forma de dosificacion de liberacion controlada extruida por fusion en caliente. |
US20110020451A1 (en) | 2009-07-22 | 2011-01-27 | Grunenthal Gmbh | Tamper-resistant dosage form for oxidation-sensitive opioids |
MX2013002377A (es) | 2010-09-02 | 2013-04-29 | Gruenenthal Gmbh | Forma de dosificacion resistente a manipulacion que comprende una sal inorganica. |
JP5880648B2 (ja) * | 2010-09-06 | 2016-03-09 | 株式会社村田製作所 | 電子部品 |
JP5810706B2 (ja) * | 2010-09-06 | 2015-11-11 | 株式会社村田製作所 | 電子部品 |
EP2736497B1 (fr) | 2011-07-29 | 2017-08-23 | Grünenthal GmbH | Comprimé multiparticulaire inviolable fournissant une libération immédiate de médicament |
DK2736495T3 (da) | 2011-07-29 | 2017-11-13 | Gruenenthal Gmbh | Misbrugsbestandig tablet som tilvejebringer øjeblikkelig frigivelse af lægemiddel |
CA2868142A1 (fr) | 2012-04-18 | 2013-10-24 | Grunenthal Gmbh | Forme pharmaceutique inviolable et resistante a la liberation massive |
US10064945B2 (en) | 2012-05-11 | 2018-09-04 | Gruenenthal Gmbh | Thermoformed, tamper-resistant pharmaceutical dosage form containing zinc |
JP5979654B2 (ja) | 2012-09-28 | 2016-08-24 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
AR096438A1 (es) | 2013-05-29 | 2015-12-30 | Gruenenthal Gmbh | Forma de dosificación resistente al uso indebido con perfil de liberación bimodal, proceso |
EP3003279A1 (fr) | 2013-05-29 | 2016-04-13 | Grünenthal GmbH | Forme pharmaceutique inviolable contenant une ou plusieurs particules |
KR20160031526A (ko) | 2013-07-12 | 2016-03-22 | 그뤼넨탈 게엠베하 | 에틸렌-비닐 아세테이트 중합체를 함유하는 템퍼 내성 투여형 |
AU2014356581C1 (en) | 2013-11-26 | 2020-05-28 | Grunenthal Gmbh | Preparation of a powdery pharmaceutical composition by means of cryo-milling |
JP2017516789A (ja) | 2014-05-26 | 2017-06-22 | グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | エタノール過量放出に対して防護されている多粒子 |
CN107889459A (zh) | 2015-04-24 | 2018-04-06 | 格吕伦塔尔有限公司 | 具有立即释放和对溶剂萃取的抗性的抗篡改剂型 |
WO2017042325A1 (fr) | 2015-09-10 | 2017-03-16 | Grünenthal GmbH | Protection contre un surdosage par voie orale à l'aide de formulations à libération immédiate dissuasives d'abus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR901549A (fr) * | 1943-01-28 | 1945-07-30 | Philips Nv | Cartouche de coupe-circuit |
SE341746B (fr) * | 1970-03-10 | 1972-09-18 | Ericsson Telefon Ab L M | |
US3887893A (en) * | 1973-09-24 | 1975-06-03 | Allen Bradley Co | Fusible resistor |
JPS51147238U (fr) * | 1975-05-21 | 1976-11-26 | ||
US4139832A (en) * | 1976-03-19 | 1979-02-13 | Hitachi, Ltd. | Glass-coated thick film resistor |
DE2845540C2 (de) * | 1978-10-19 | 1982-01-28 | Draloric Electronic GmbH, 8500 Nürnberg | Nichtentflammbares Überzugsmittel und seine Verwendung |
US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
JPS6011538Y2 (ja) * | 1982-12-01 | 1985-04-17 | 三王株式会社 | チツプ型ヒユ−ズ |
JPS60143544A (ja) * | 1983-12-29 | 1985-07-29 | 松下電器産業株式会社 | チツプ形ヒユ−ズ |
-
1986
- 1986-12-01 JP JP61287081A patent/JPH0831303B2/ja not_active Expired - Lifetime
-
1987
- 1987-11-27 ES ES198787117577T patent/ES2046194T3/es not_active Expired - Lifetime
- 1987-11-27 EP EP87117577A patent/EP0270954B1/fr not_active Expired - Lifetime
- 1987-11-27 AT AT87117577T patent/ATE89435T1/de not_active IP Right Cessation
- 1987-11-27 DE DE8787117577T patent/DE3785835T2/de not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
Glossary of Chemical Terms, Hangel & Harvley, Publ. van Nostrand Reinhold Co., 1976 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9675610B2 (en) | 2002-06-17 | 2017-06-13 | Grünenthal GmbH | Abuse-proofed dosage form |
US9629807B2 (en) | 2003-08-06 | 2017-04-25 | Grünenthal GmbH | Abuse-proofed dosage form |
US8075872B2 (en) | 2003-08-06 | 2011-12-13 | Gruenenthal Gmbh | Abuse-proofed dosage form |
US8309060B2 (en) | 2003-08-06 | 2012-11-13 | Grunenthal Gmbh | Abuse-proofed dosage form |
US8420056B2 (en) | 2003-08-06 | 2013-04-16 | Grunenthal Gmbh | Abuse-proofed dosage form |
US8114384B2 (en) | 2004-07-01 | 2012-02-14 | Gruenenthal Gmbh | Process for the production of an abuse-proofed solid dosage form |
US11844865B2 (en) | 2004-07-01 | 2023-12-19 | Grünenthal GmbH | Abuse-proofed oral dosage form |
US8722086B2 (en) | 2007-03-07 | 2014-05-13 | Gruenenthal Gmbh | Dosage form with impeded abuse |
US7983024B2 (en) | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
US8383152B2 (en) | 2008-01-25 | 2013-02-26 | Gruenenthal Gmbh | Pharmaceutical dosage form |
US9161917B2 (en) | 2008-05-09 | 2015-10-20 | Grünenthal GmbH | Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet |
US9636303B2 (en) | 2010-09-02 | 2017-05-02 | Gruenenthal Gmbh | Tamper resistant dosage form comprising an anionic polymer |
US9655853B2 (en) | 2012-02-28 | 2017-05-23 | Grünenthal GmbH | Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer |
US9913814B2 (en) | 2014-05-12 | 2018-03-13 | Grünenthal GmbH | Tamper resistant immediate release capsule formulation comprising tapentadol |
Also Published As
Publication number | Publication date |
---|---|
EP0270954A1 (fr) | 1988-06-15 |
DE3785835D1 (de) | 1993-06-17 |
DE3785835T2 (de) | 1993-08-19 |
JPS63141233A (ja) | 1988-06-13 |
JPH0831303B2 (ja) | 1996-03-27 |
ATE89435T1 (de) | 1993-05-15 |
ES2046194T3 (es) | 1994-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0270954B1 (fr) | Fusible du type chip | |
KR930003554B1 (ko) | 과전류 방지형 다이오드 | |
US7718308B2 (en) | Temperature fuse and battery using the same | |
US6304166B1 (en) | Low profile mount for metal oxide varistor package and method | |
US6269745B1 (en) | Electrical fuse | |
US6384708B1 (en) | Electrical fuse element | |
US6403145B1 (en) | High voltage thick film fuse assembly | |
JPH05198246A (ja) | 熱動作ヒューズ及び保護回路装置 | |
MY115175A (en) | Semiconductor chip package with enhanced thermal conductivity | |
JP2010015976A (ja) | 抵抗器とヒューズエレメントとを含む回路保護デバイス | |
US5793274A (en) | Surface mount fusing device | |
EP4148763A2 (fr) | Fusible à montage en surface avec liaison de soudure et substrat de démouillage | |
EP0943150B1 (fr) | Fusible | |
JPH0433230A (ja) | チップ型ヒューズ | |
GB2062981A (en) | Miniature electric fuse | |
JPH1012806A (ja) | 半導体装置 | |
JPS63170826A (ja) | 回路遮断素子 | |
RU2036527C1 (ru) | Плавкий предохранитель | |
JPH10308156A (ja) | ヒューズ | |
JP3074595U (ja) | 基板実装型高遮断容量小型ヒューズ | |
JPH04365304A (ja) | ヒューズ付チップ抵抗器 | |
JPH05101913A (ja) | 抵抗器及び抵抗器素子 | |
JPH0622093B2 (ja) | 基板型温度ヒューズ・抵抗体及びその製造方法 | |
JPH02309602A (ja) | 角形チップ抵抗器 | |
JP2003123618A (ja) | ヒューズ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19871127 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL SE |
|
17Q | First examination report despatched |
Effective date: 19910527 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
ITF | It: translation for a ep patent filed |
Owner name: SOCIETA' ITALIANA BREVETTI S.P.A. |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Effective date: 19930512 Ref country code: NL Effective date: 19930512 Ref country code: LI Effective date: 19930512 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 19930512 Ref country code: CH Effective date: 19930512 Ref country code: BE Effective date: 19930512 Ref country code: AT Effective date: 19930512 |
|
REF | Corresponds to: |
Ref document number: 89435 Country of ref document: AT Date of ref document: 19930515 Kind code of ref document: T |
|
REF | Corresponds to: |
Ref document number: 3785835 Country of ref document: DE Date of ref document: 19930617 |
|
ET | Fr: translation filed | ||
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19931130 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2046194 Country of ref document: ES Kind code of ref document: T3 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19961111 Year of fee payment: 10 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19961118 Year of fee payment: 10 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 19961129 Year of fee payment: 10 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19971127 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF THE APPLICANT RENOUNCES Effective date: 19971128 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY Effective date: 19971130 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19971127 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20010402 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20051124 Year of fee payment: 19 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20051127 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070601 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |