DK2091308T3 - Kredsløb med integreret afskærmning og høreapparat - Google Patents

Kredsløb med integreret afskærmning og høreapparat

Info

Publication number
DK2091308T3
DK2091308T3 DK08172494.0T DK08172494T DK2091308T3 DK 2091308 T3 DK2091308 T3 DK 2091308T3 DK 08172494 T DK08172494 T DK 08172494T DK 2091308 T3 DK2091308 T3 DK 2091308T3
Authority
DK
Denmark
Prior art keywords
integrated cutting
hearing equipment
credit
run
credit run
Prior art date
Application number
DK08172494.0T
Other languages
English (en)
Inventor
Leep Foong Chew
Raymond Kang
Meng Kiang Lim
Chow Lan Stella Yap
Original Assignee
Sivantos Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sivantos Pte Ltd filed Critical Sivantos Pte Ltd
Application granted granted Critical
Publication of DK2091308T3 publication Critical patent/DK2091308T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DK08172494.0T 2008-02-13 2008-12-22 Kredsløb med integreret afskærmning og høreapparat DK2091308T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008008897A DE102008008897B3 (de) 2008-02-13 2008-02-13 Schaltung mit integrierter Abschirmung und Hörhilfe

Publications (1)

Publication Number Publication Date
DK2091308T3 true DK2091308T3 (da) 2019-06-11

Family

ID=40551067

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08172494.0T DK2091308T3 (da) 2008-02-13 2008-12-22 Kredsløb med integreret afskærmning og høreapparat

Country Status (4)

Country Link
US (1) US8305772B2 (da)
EP (1) EP2091308B1 (da)
DE (1) DE102008008897B3 (da)
DK (1) DK2091308T3 (da)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008008897B3 (de) * 2008-02-13 2009-07-30 Siemens Medical Instruments Pte. Ltd. Schaltung mit integrierter Abschirmung und Hörhilfe
US8218801B2 (en) * 2008-05-30 2012-07-10 Symbol Technologies, Inc. Method and system for a headset H-field/E-field canceller
JP5353614B2 (ja) * 2008-10-06 2013-11-27 日立化成株式会社 基板挿入用コネクタ及びその製造方法
US8670588B2 (en) * 2009-09-08 2014-03-11 Apple Inc. Handheld device assembly
DE102009054906A1 (de) * 2009-12-17 2011-06-22 Continental Automotive GmbH, 30165 Elektrisches Gerät oder Platine
EP2606407A2 (en) * 2010-08-19 2013-06-26 Apple Inc. Portable electronic device
US8515113B2 (en) 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
US8427379B2 (en) 2010-08-19 2013-04-23 Apple Inc. Modular material antenna assembly
US9602914B2 (en) 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
US8634204B2 (en) 2010-08-19 2014-01-21 Apple Inc. Compact folded configuration for integrated circuit packaging
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US8477492B2 (en) 2010-08-19 2013-07-02 Apple Inc. Formed PCB
DE102010041831B4 (de) * 2010-09-30 2021-04-08 Automotive Lighting Reutlingen Gmbh Elektronische Steuereinrichtung für eine Beleuchtungseinrichtung eines Kraftfahrzeugs
US9287627B2 (en) 2011-08-31 2016-03-15 Apple Inc. Customizable antenna feed structure
US9406999B2 (en) 2011-09-23 2016-08-02 Apple Inc. Methods for manufacturing customized antenna structures
WO2015081958A1 (en) * 2013-12-03 2015-06-11 Miitors Aps Consumption meter comprising a foldable printed circuit board assembly
CN103777395A (zh) * 2014-01-27 2014-05-07 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
CN103987188A (zh) * 2014-05-28 2014-08-13 友达光电(厦门)有限公司 软性电路板
US11206499B2 (en) * 2016-08-18 2021-12-21 Qualcomm Incorporated Hearable device comprising integrated device and wireless functionality
DE102017000889A1 (de) * 2017-01-27 2018-08-02 Christian Overmann Modulares optisches Aufnahmesystem
JP6994341B2 (ja) * 2017-10-03 2022-01-14 日本電産コパル株式会社 電子機器
DE102017221332B4 (de) * 2017-11-28 2021-08-26 Sivantos Pte. Ltd. Verfahren zur Herstellung eines Hörgerätes
US10714429B1 (en) * 2018-01-15 2020-07-14 Snap Inc. Circuit systems
US10701796B2 (en) 2018-06-25 2020-06-30 Intel Corporation Electromagnetic interference (EMI) shield
EP4236373A3 (en) 2018-11-30 2023-10-11 GN Hearing A/S Hearing device with an antenna
CN109600914A (zh) * 2019-01-14 2019-04-09 维沃移动通信有限公司 一种电路板、器件模组及移动终端
JP2022169817A (ja) * 2019-09-30 2022-11-10 Ａｇｃ株式会社 高周波シールド構造
US20220324126A1 (en) * 2021-04-07 2022-10-13 The Gillette Company Llc Personal care appliance
US12005596B2 (en) * 2021-04-07 2024-06-11 The Gillette Company Llc Personal care appliance and a method of assembling
DK202170254A1 (en) * 2021-05-20 2022-11-29 Gn Hearing 2 As A hearing device comprising a shielding component

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DE3414480C2 (de) * 1984-04-17 1993-02-25 Ifm Electronic Gmbh, 4300 Essen Elektrisches, insbesondere elektronisches, berührungslos arbeitendes Schaltgerät
US4675625A (en) 1985-03-26 1987-06-23 Rogers Corporation Rolled delay line of the coplanar line type
GB2173048B (en) * 1985-03-26 1989-06-21 Rogers Corp Electronic signal time delay device
AT391047B (de) * 1987-06-26 1990-08-10 Siemens Ag Hoergeraet mit einer leiterplatte und einer hoerspule
US4922059A (en) * 1988-12-29 1990-05-01 Motorola, Inc. Origami composite EMI/TEMPEST proof electronics module
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
JP3203279B2 (ja) 1993-01-27 2001-08-27 日本メクトロン株式会社 シ−ルド層を有する可撓性回路基板
DE4303908A1 (de) * 1993-02-10 1994-08-11 Siemens Ag Steuergerät
US5434362A (en) * 1994-09-06 1995-07-18 Motorola, Inc. Flexible circuit board assembly and method
US6674869B2 (en) 2000-02-23 2004-01-06 Hei, Inc. Hearing-aid assembly using folded flex circuits
JP2003142875A (ja) 2001-11-07 2003-05-16 Matsushita Electric Ind Co Ltd シールド付きのフレキシブル基板及びこれを用いた表示装置
JP2004128418A (ja) 2002-10-07 2004-04-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006073683A (ja) * 2004-08-31 2006-03-16 Sony Corp 回路デバイス及び回路デバイスの製造方法
JP2006100302A (ja) * 2004-09-28 2006-04-13 Sharp Corp 高周波モジュールおよびその製造方法
DE102008008897B3 (de) * 2008-02-13 2009-07-30 Siemens Medical Instruments Pte. Ltd. Schaltung mit integrierter Abschirmung und Hörhilfe

Also Published As

Publication number Publication date
DE102008008897B3 (de) 2009-07-30
EP2091308A3 (de) 2010-04-14
EP2091308A2 (de) 2009-08-19
EP2091308B1 (de) 2019-03-13
US20090201652A1 (en) 2009-08-13
US8305772B2 (en) 2012-11-06

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