DK177059B1 - Device for cleaning disc-shaped material - Google Patents
Device for cleaning disc-shaped material Download PDFInfo
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- DK177059B1 DK177059B1 DKPA199801097A DKPA199801097A DK177059B1 DK 177059 B1 DK177059 B1 DK 177059B1 DK PA199801097 A DKPA199801097 A DK PA199801097A DK PA199801097 A DKPA199801097 A DK PA199801097A DK 177059 B1 DK177059 B1 DK 177059B1
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- Prior art keywords
- cleaning
- shaped material
- disc
- liquid
- discs
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Indretning til rengøring, som er kendetegnet ved, at den har en holdeindretning til ski veformet materiale, en opfangeindretning for væsker og en dyseanordning, som op bygger en næsten laminarstrømning.Cleaning device, characterized in that it has a ski web-shaped material holding device, a liquid capture device and a nozzle device which builds up an almost laminar flow.
Description
DK 177059 81DK 177059 81
Opfindelsen angår en indretning til rengøring samt en fremgangsmåde for rengøring.The invention relates to a device for cleaning and a method of cleaning.
i Til fremstillingen af et skiveformet materiale ud fra et stavformet materiale, som glas, kvarts, sten, grafit, et keramisk eller oxidisk materiale som f.eks. rubin eller S gallium-gadoliniumgranat, men tillige et halvledermateriale som f.eks. galliumarsenid eller indlumphøsphid såvel som især germanium eller silicium, kan disse materialer blive skåret i skiver. Disse materialer bliver ved hjælp af en trådsav, som er udformet som et trådstakit, skåret i skiver. F.eks. bliver siliciumskiver, som bliver anvendt til fremstilling af elektroniske komponenter, savet ud fra det stavformede, 10 monokrystallinske materiale ved hjælp af en savemaskine, som har et trådstakit.i For the manufacture of a disc-shaped material from a rod-shaped material, such as glass, quartz, stone, graphite, a ceramic or oxidic material such as e.g. ruby or S gallium gadolinium garnet, but also a semiconductor material such as gallium arsenide or casing as well as especially germanium or silicon, these materials can be cut into slices. These materials are cut into slices by means of a wire saw, which is designed as a wire fence kit. Eg. For example, silicon wafers used to make electronic components are sawn from the rod-shaped, monocrystalline material by a sawing machine having a wire fence.
Denne er i stand til at save meget tynde siliciumskiver, f.eks. fra 100 pm fra en siliciumstav. En trådsavemaskine har et trådstakit, til hvilket over 1000 tråde er udspændt omløbende i en fastlagt afstand fra hinanden for at opnå den ønskede skivetykkelse, og det stavformede materiale, som er hæftet på et saveunderlag og 15 indspændt i en bærer, bliver gennemsavet i en passage. Derved bliver der savet snit i det stavformede materiale, som er omtrent lige så tykt som tråden af trådsaven, hvor to snit danner en skive. Disse skiver danner dog, da de er hæftet på saveunderiaget, som f.eks. kan bestå af grafit, glas, ei plastmateriale etc., en kam. Dvs., af det stavformede materiale bliver gennemsavet fuldstændigt vinkelret på sin længdeakse, 20 hvor der dog bliver savet et stykke ned i saveunderiaget, men dog ikke mere end det stavformede materiale bliver fuldstændig gennemsavet og endnu hæfter på saveunderiaget på en sådan måde, at skiverne bliver holdt sammen i form som en kam. Savevirkningen af trådsaven bliver opnået ved hjælp af et slibemiddel, som indeholder en bærevæske med skærekorn, som er suspenderet i det, for at muliggøre 25 fjernelsen af materiale. Dette slibemiddel med det afsfebne materiale virker efter skæringen som en klæber og hæfter på skiverne, og dette får disse skiver til at hæfte til hinanden sådan, at en rengøring er nødvendig. Ifølge den kendte teknik bliver det spaltede, stavformede materiale, som hæfter til saveunderiaget, fjernet fra maskinen, idet trådstakittet bliver trukket op gennem de netop savede spalter, og kammen bliver 30 fjernet Denne bliver nu rengjort ved neddykning i et bad, som er fyldt med en rengøringsvæske, f.eks. i et fad, med eller uden stempelsiagsbevasgelser. Denne indretning har den ulempe, at det varer længe, inden rengøringen bliver gennemført, og skiverne kan blive ridset på grund af løftet af trådsaven. Hvis skiverne først bliver isoleret og anbragt i et magasin, består der den fare, at de isolerede skiver hæfter til 35 hinanden og brækker ved en adskillelse. Endvidere er det muligt, som det bliver beskrevet IWO 97/02905, at besprøjte kammen turbulent med vand ved hjælp af en DK 177051 B1 2 dyseanordntng med mange dyser. Denne indretning har den ulempe, at der ikke kan blive anvendt en rengøringsvæske som ved sædvanlige kolde rengøringer, da der af denne på grund af besprøjtningen let opstår aerosoler af flygtige rengøringsvæsker, og dermed opslår der en eksplosionsfare, så der kan biot blive anvendt vandige 5 rengøringsvæsker og et smøremiddel med en vandopløselig bærevæske. Desuden kan det savede, stavformede materiale udelukkende blive rengjort i en sådan indretning som en kam, altså uden at der er blevet foretaget en isolering. Hvis de var blevet isoleret, kunne de blive beskadiget, da skiverne som følge af turbulensen bliver slået mod hinanden.This is capable of cutting very thin silicon wafers, e.g. from 100 pm from a silicon rod. A wire saw machine has a wire fence to which over 1000 threads are stretched circumferentially at a predetermined distance from each other to obtain the desired disc thickness, and the rod-shaped material which is stapled to a sawing base and clamped in a carrier is cut into a passage. . Thereby, cuts are made in the rod-shaped material, which is about as thick as the thread of the wire saw, where two cuts form a disc. However, these slices form as they are stapled to the sawing base layer, such as can consist of graphite, glass, plastic material etc., a comb. That is, of the rod-shaped material is cut completely perpendicular to its longitudinal axis, 20 which is cut a bit down into the sawing base, however, but no more than the rod-shaped material is completely cut and still adheres to the sawing base in such a way that the slices being held together in the shape of a comb. The cutting action of the wire saw is achieved by an abrasive containing a carrier liquid with cutting grain suspended therein to enable the removal of material. This abrasive with the abrasive material after the cutting acts as an adhesive and adheres to the discs, and this causes these discs to adhere to each other such that a cleaning is necessary. According to the prior art, the split rod-shaped material adhering to the saw bottom layer is removed from the machine, the wire fence being pulled up through the newly cut slots and the comb being removed. This is now cleaned by immersion in a bath which is filled with a cleaning fluid, e.g. in a dish, with or without stamping saws. This device has the disadvantage that it takes a long time for the cleaning to be carried out and the slices can be scratched due to the lifting of the wire saw. If the disks are first insulated and placed in a magazine, there is the danger that the insulated disks will adhere to each other and break at separation. Furthermore, as described in IWO 97/02905, it is possible to spray the comb turbulently with water by means of a multi-nozzle DK 177051 B1 2 device. This device has the disadvantage that a cleaning liquid cannot be used as in conventional cold cleaning, because of this the aerosols of volatile cleaning liquids easily arise and thus cause an explosion hazard so that aqueous can be used. cleaning fluids and a lubricant with a water-soluble carrier liquid. In addition, the sawed rod-shaped material can only be cleaned in such a device as a comb, ie without an insulation. If they had been insulated, they could be damaged as the disks are struck against each other due to the turbulence.
10 Det er en opgave for opfindelsen at tilvejebringe en indretning til rengøring samt en fremgangsmåde tit rengøring, som i forhold til den kendte teknik har forbedrede egenskaber og ikke har dennes ulemper, og som især tillader også isolerede skiver at blive hurtigt og grundigt rengjorte såvel som tillige at anvende litflygtige rengøringsvæsker.SUMMARY OF THE INVENTION It is an object of the invention to provide a cleaning device as well as a method of cleaning which has improved properties and does not have its disadvantages in relation to the prior art, and which in particular also allows insulated discs to be quickly and thoroughly cleaned as well as also use volatile cleaning fluids.
15 Denne opgave bliver løst ved hjælp af opfindelsen.This problem is solved by the invention.
En genstand for opfindelsen er en indretning til rengøring, som har en holdeindretning for et skiveformet materiale eg en opfangeindretning for væsker samt en dyseanordning, son opbygger en næsten laminar strømning.An object of the invention is a cleaning device having a disc-shaped retaining device, such as a liquid capture device and a nozzle device, which builds up an almost laminar flow.
I en savemaskine bliver det stavformede materiale savet med en trådsav 20 under tilførsel af et slibemiddel, som består af en bærevæske og skærekorn, så selve materialet bliver savet igennem vinkelret på en længderetning af det stavformede materiale til ind i saveunderlaget af grafit. Den derved tilbagestående kam kan som en helhed blive fjernet for at blive rengjort, eller den bliver fortrinsvis allerede i savemaskinen isoleret, uden al trådstakittet bliver ført op af skærespalerne af 25 kammen.In a sawing machine, the rod-shaped material is sawed with a wire saw 20 under the application of an abrasive consisting of a carrier liquid and cutting grain, so that the material itself is sawed perpendicular to a longitudinal direction of the rod-shaped material into the sawing base of graphite. As a result, the retaining comb as a whole can be removed to be cleaned, or it is preferably already insulated in the sawing machine, without all the wire fence being carried up by the cutting rails of the comb.
Dette sker på den måde, at skiverne i form af små pakker bliver brækket af kammen og saveunderlaget og bliver indsat i en holdeindretning for skiveformet materiale, som i tilfælde af isoleringen af skiverne er en optageindretning for skiveførmet materiale. Derved drejer de* ^rtri-svis om et retvinklet eller rundt 30 magasin, som har vilkårligt mange adski r, som fortrinsvis kan· optage enThis is done in such a way that the discs in the form of small packages are broken by the comb and the sawing base and are inserted into a disc-shaped retaining device, which in the case of the isolation of the discs is a recording device for disc-shaped material. In doing so, they are usually about a right-angled or about 30 magazines which have any number of discs which can preferably accommodate a
Ile pakke af 20 til 30 skiver. imidlertfc - ne endnu have en tilstrækkelig afstand fra hinanden for at kunne blive rengjort og fremstillet logisk opdelt. Principielt bliver der anbragt færre skiver i optagindretningen end der kunne være plads til.Ile pack of 20 to 30 slices. however, they still have a sufficient distance from each other to be cleanly and logically divided. In principle, fewer discs are placed in the recording device than could be accommodated.
I det tilfælde, at skiverne bliver rengjort i form af en kam, altså ikke bliver 35 isoleret, bliver de indsat i en holdeindretning, som lean optage leammen.In the event that the disks are cleaned in the form of a comb, i.e. not insulated, they are inserted into a holding device which leans to absorb the limb.
DK 177059 81 3DK 177059 81 3
Denne holdeindretning, fortrinsvis et magasin med isolerede skiver, bliver indsat i en opfangeindretning for væsker, et rengeringsbækken, fortrinsvis et kommercielt tilgængeligt fad sådan, at de bliver holdt i en afstand fra en dyseindretning på en sådan måde, at denne dyseindretning kan opbygge en næsten 5 laminar strømning. Derved kan de savede skiver blive spulet rundt om som en kam, dvs. endnu fastholdt på saveunderiaget eller isoleret i et magasin, af den laminart strømmende rengøringsvæske uden at være helt eler kun delvist neddykket eller, hvad der bliver foretrukket, at være fuldstændigt neddykket i rengøringsvæsken. Dette er f.eks. nødvendigt ved letflygtige rengøringsvæsker for at forhindre en dannelse af 10 aerosoler. Endvidere bliver der ved den stadige befugtning af skiveoverfladen udelukket en pietdannelse på skiveoverfladen. Ganske vist kan skiverne tiilige være anbragt fuldstændigt uden for rengøringsvæsken og blive spulet rundt om med en laminart strømmende rengcringsvæske.This holding device, preferably a magazine with insulated discs, is inserted into a liquid capture device, a cleaning basin, preferably a commercially available dish such that they are kept at a distance from a nozzle device in such a way that this nozzle device can build up a 5 laminar flow. Thereby the sawed discs can be spun around like a comb, ie. still retained on the saw base or insulated in a magazine, of the laminar flowing cleaning fluid without being completely or only partially submerged or, what is preferred, being completely submerged in the cleaning fluid. This is e.g. required by volatile cleaning fluids to prevent the formation of 10 aerosols. Furthermore, the continuous wetting of the disc surface precludes a pie formation on the disc surface. Admittedly, the discs may also be located completely outside the cleaning fluid and be flushed around with a laminar flowing cleaning fluid.
Ved rengøringsvæsken drejer det sig fortrinsvis om et kommercielt 15 tilgængeligt koldt rengøringsmiddel, som f.eks. upolære opløsningsmidler af kulbrinter, 1 men der kan tillige blive anvendt vandige rengøringsvæsker, som i givet faid indeholder en tensid.In the cleaning liquid, it is preferably a commercially available cold cleaning agent, such as e.g. non-polar solvents of hydrocarbons, 1 but aqueous cleaning liquids may also be used which, if given, contain a surfactant.
Den laminare strømning af væsken bliver opbygget ved hjælp af en som i det · - har en dyse, hvis udgangsåbning er sådant 20 ' 2:r i afhængigh . relse, antal og anordning af de skiver, som skal I viskositetei løringsvæsken, bliver opbygget en laminar strømning. F insvis er ud:- '. ' igen opbygget som en slids, men den kan principielt tillig' være cirkulæ - strømningen ikke i det tilfælde strømme så bredt. Fortrins- bliver der a " - nestående dyse med en slids, der kan dog 25 tiilige være f-'e dyser, c tillige være en anderledes udformet dyseudp- sål ng under der - g, at rengøringsvæsken strømmer laminart gen·' - ind Btnmg og t ner et ''forhæng". Det bliver foretrukket, at . gc i af · ke i lede længde af dyser ved hvert punkt er ne lyse - - tnin nbragt i renøøringsbækkenet vid ethvert.The laminar flow of the liquid is built up by means of one which - in it - has a nozzle whose output aperture is such 20 '2: r in dependence. The number, arrangement and arrangement of the discs which are to be viscous in the lubricating fluid are built up a laminar flow. F insvis is out: - '. 'built up again as a slit, but it can in principle also' be circular - the flow does not flow so wide in that case. Preferably, there is a "- standing nozzle with a slot, which may, however, also be several nozzles, c also a differently designed nozzle outlet underneath - g that the cleaning fluid flows laminar gene" - into Btnmg and make a curtain. It is preferred that. gc in the lead length of nozzles at each point is not bright - - tnin brought into the cleaning pelvis at any.
30 _ , iks. æg· - n, fortrinsvis bliver den dog anbragt på i mic n f re *gst er vigtigt, at der bliver sikret en næsten .»ar strøn »ir ? - r jret . fortrinsvis tilført den rengeringsvæske, /m befinder t 3 11 sos ælp af en pumpeindretning.30 _, ix. Eggs - n, preferably placed on the mic n, however, are important to ensure a near. - The year. preferably supplied with the cleaning fluid, m 3 11 is provided by a pump device.
Strø nr Jr n syæsken er fortrinsvis parallel med 35 overfladen af skiverne.The bedding when the sewing box is preferably parallel to the surface of the slices.
DK 177 1 4DK 177 1 4
Rengøringsvæsken bliver med en forudbestemt mængde, tryk og temperatur ført ud på skiverne. Afstanden for dyseindretningen til skiverne, tryk, temperatur og mængde af rengøringsvæske bliver afstemt på en sådan måde, at der bliver opbygget en laminar strømning. Afstemningen af rengøringsparametrene bliver foretaget i 5 afhængighed af tykkelsen af skiverne. I princippet svarer tryk fra fortrinsvis 0,5 bar til 5 bar og et temperaturområde fra fortrinsvis 10°C til 80°C ti! forventningerne. Ved letflygtige rengøringsvæsker bør temperaturen på grund af eksplosionsfaren fortrinsvis ligge 10°C til 15°C under flammepunktet. Afstanden for dyseindretningen bør fortrinsvis være 1 mm til 50 mm, fortrinsvis 5 mm til 10 mm.The cleaning fluid is discharged to the disks with a predetermined amount, pressure and temperature. The distance of the nozzle device to the washers, pressure, temperature and amount of cleaning fluid is adjusted in such a way that a laminar flow is built up. The tuning of the cleaning parameters is done in 5 depending on the thickness of the slices. In principle, pressures correspond from preferably 0.5 bar to 5 bar and a temperature range preferably from 10 ° C to 80 ° C. expectations. In the case of volatile cleaning fluids, the temperature, due to the danger of explosion, should preferably be 10 ° C to 15 ° C below the flash point. The distance of the nozzle device should preferably be 1 mm to 50 mm, preferably 5 mm to 10 mm.
10 Alt efter den anvendte rengøringsvæske og dimensionering af anlægget henholdsvis pumpeindretningen kan det være nødvendigt med en opvarmning og/eller en afkøling. Ved hjælp af måleapparater, som er installeret i fremføringskredsløbet, for tryk, temperatur og gennemstrømningsmængde kan fremgangsmåden blive optimeret og kontrolleret.10 Depending on the cleaning fluid used and the sizing of the system or pump device, heating and / or cooling may be necessary. By means of measuring devices installed in the feed circuit for pressure, temperature and flow rate the process can be optimized and controlled.
15 Rengøringsbækkenet er fortrinsvis forbundet med en beholder, som let kan blive fjernet, fortrinsvis et fad, i hvilket det meget slidende, vanskeligt håndterbare, afrensede slibemiddel kan blive trukket ud, efter rengøringsvæsken er blevet mere stillestående. I denne hvHezone kan de partikler, som befinder sig svævende, blive bundfældet. Etter at have nået fy Idegrænsen bliver rengøringsvæsken pumpet bort, 20 den kommercielt tilgængelige beholder med det faste stof bliver koblet af og fjernet fra rengøringsanlægget. Den bortpumpede rengøringsvæske bliver igen ført tilbage til processen, genindvundet eller bortskaffet.The cleaning basin is preferably connected to a container which can be easily removed, preferably a dish in which the very abrasive, difficult to handle, cleaned abrasive can be pulled out after the cleaning liquid has become more stationary. In this home zone, the particles that are floating can be precipitated. After reaching the limit, the cleaning fluid is pumped away, the commercially available solid substance container is disconnected and removed from the cleaning system. The pumped-out cleaning fluid is again returned to the process, recovered or disposed of.
Ved de stavformede materialer, som bliver savet s indretningen, kan det dreje sig om sprøde materialer, som glas, kvarts, sten, grafit, keramiske eller oxidiske 25 materialer, lefts, rubin eller gallium-gadolinium-granaf, men tillige halvledermaterialer, som galiumarsenid eler indiumprtosphid såvel som især germanium eller silicium. Fortrinsvis bliver der med indretningen savet et stavformet halvledermateriale, især fortrinsvis af monokrystallinsk silicium.By the rod-shaped materials being sawn the device may be brittle materials, such as glass, quartz, stone, graphite, ceramic or oxidic materials, lefts, ruby or gallium-gadolinium-granite, but also semiconductor materials, such as gallium arsenide or indium prtosphide as well as germanium or silicon in particular. Preferably, the device produces a rod-shaped semiconductor material, especially preferably of monocrystalline silicon.
Opfindelsen angår en fremgangsmåde til rengøring af et skiveformet 30 materiale, hvor dette materiale bliver rengjort af en væske, som flyder næsten laminart.The invention relates to a method for cleaning a disc-shaped material, wherein this material is cleaned by a liquid which is almost laminar-like.
Den væske, som ved fremgangsmåde ti! rengøring af skiveformet materialer strømmer laminart, bliver fortrinsvis opnået med den indretning, som er beskrevet ovenfor. Dette sker på den måde, at væsken, rengøringsvæsken, biiver pumpet 35 gennem en dyseindretning, som fortrinsvis i det mindste har en dyse, hvis udgangsåbning er sådant udformet, at den væske, som strømmer ud af den, biiver DK 1T7059 B1 5 afsat i en laminar strømning Dette sker, idet rengøringsvæsken ved hjælp af en fortrinsvis spalteformet udgangsåbning strømmer parallelt med overfladen af det skiveformede materiale.The liquid which in process ten! cleaning of disc-shaped materials flowing laminate is preferably accomplished with the device described above. This is done in such a way that the liquid, the cleaning liquid, is pumped 35 through a nozzle device, which preferably has at least one nozzle whose outlet opening is designed such that the liquid flowing out of it is dispensed into the nozzle. a laminar flow This occurs because the cleaning fluid, by means of a preferably slit-shaped outlet opening, flows parallel to the surface of the disc-shaped material.
En fordel ved indretningen samt fremgangsmåden ifølge opfindelsen er, at de 5 isolerede skiver bliver overraskende ensartet fremstillet logisk opdelt. En yderligere fordel er det mindre omfang af brud ved arbejdsgangen for rengøring på grund af den --kraftløse om spuling af skiverne. Ligeledes ved en afsluttende arbejdsgang for isolei, 'iver omfanget af brud drastisk reduceret, da skiverne på grund af den ϊν..-1'tæri.. ή fjernelse af slibemidlet let kan blive forskubbet mod hinanden og dermed 10 åe- 3nke. råde blive adskilt. I det tilfælde, hvor dyseindretningen bliver overdækket rrr.d v::ske fremgangsmåden ifølge opfindelsen især egnet for brandbare væsker.An advantage of the device and the method according to the invention is that the 5 insulated discs are surprisingly uniformly manufactured logically divided. A further advantage is the smaller amount of breakages in the cleaning process due to the - powerless on flushing of the washers. Likewise, in a final workflow for insulation, the extent of fracture is drastically reduced as the discs due to the æriν .. 1 removal .. .. removal of the abrasive can be easily shifted against each other and thus 10 inches. advise get separated. In the case where the nozzle device is covered, the process according to the invention is particularly suitable for combustible liquids.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997142680 DE19742680B4 (en) | 1997-09-26 | 1997-09-26 | Cleaning process for disc-shaped material |
| DE19742680 | 1997-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK177059B1 true DK177059B1 (en) | 2011-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DKPA199801097A DK177059B1 (en) | 1997-09-26 | 1998-09-01 | Device for cleaning disc-shaped material |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3199685B2 (en) |
| DE (1) | DE19742680B4 (en) |
| DK (1) | DK177059B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008045990A1 (en) * | 2008-09-05 | 2010-03-11 | Wacker Schott Solar Gmbh | Device for processing wafer comb made up of wafer, has supplying unit for supplying rinsing fluid to wafer comb, where supplying unit has slot nozzle |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62190729A (en) * | 1986-02-17 | 1987-08-20 | Nec Corp | Washing apparatus |
| JPH0744170B2 (en) * | 1988-03-11 | 1995-05-15 | 信越半導体株式会社 | Precision cleaning method |
| JP2549735B2 (en) * | 1989-07-14 | 1996-10-30 | 株式会社東芝 | Flow-through ultrasonic cleaning device |
| JPH0442530A (en) * | 1990-06-08 | 1992-02-13 | Fujitsu Ltd | Ultrasonic cleaning device |
| US5327921A (en) * | 1992-03-05 | 1994-07-12 | Tokyo Electron Limited | Processing vessel for a wafer washing system |
| JPH06196466A (en) * | 1992-10-27 | 1994-07-15 | Sony Corp | Wafer cleaning device |
| JPH06349800A (en) * | 1993-06-11 | 1994-12-22 | Hitachi Ltd | Semiconductor wafer-cleaning device |
| US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
| US6074442A (en) * | 1994-10-28 | 2000-06-13 | Shin-Etsu Handotai Co., Ltd. | Method of separating slice base mounting member from wafer and jig adapted therefor |
| JPH0936080A (en) * | 1995-07-13 | 1997-02-07 | Toray Eng Co Ltd | Method for washing machined silicon ingot |
| DE19655219C2 (en) * | 1996-04-24 | 2003-11-06 | Steag Micro Tech Gmbh | Device for treating substrates in a fluid container |
-
1997
- 1997-09-26 DE DE1997142680 patent/DE19742680B4/en not_active Expired - Lifetime
-
1998
- 1998-09-01 DK DKPA199801097A patent/DK177059B1/en not_active IP Right Cessation
- 1998-09-25 JP JP27170198A patent/JP3199685B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3199685B2 (en) | 2001-08-20 |
| DE19742680A1 (en) | 1999-04-08 |
| DE19742680B4 (en) | 2006-03-02 |
| JPH11162915A (en) | 1999-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUP | Patent expired |
Expiry date: 20180901 |