DE69838696D1 - Halbleitervorrichtung und Verdrahtungsband für diese Vorrichtung - Google Patents

Halbleitervorrichtung und Verdrahtungsband für diese Vorrichtung

Info

Publication number
DE69838696D1
DE69838696D1 DE69838696T DE69838696T DE69838696D1 DE 69838696 D1 DE69838696 D1 DE 69838696D1 DE 69838696 T DE69838696 T DE 69838696T DE 69838696 T DE69838696 T DE 69838696T DE 69838696 D1 DE69838696 D1 DE 69838696D1
Authority
DE
Germany
Prior art keywords
wiring tape
semiconductor device
semiconductor
wiring
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838696T
Other languages
English (en)
Other versions
DE69838696T2 (de
Inventor
Masahiko Ogino
Shuji Eguchi
Akira Nagai
Takumi Ueno
Masanori Segawa
Hiroyoshi Kokaku
Toshiaki Ishii
Ichiro Anjo
Asao Nishimura
Chuichi Miyazaki
Mamoru Mita
Norio Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Publication of DE69838696D1 publication Critical patent/DE69838696D1/de
Application granted granted Critical
Publication of DE69838696T2 publication Critical patent/DE69838696T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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    • H01L2224/29001—Core members of the layer connector
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    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
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    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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    • H01L2924/30107—Inductance
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69838696T 1997-06-06 1998-06-02 Halbleitervorrichtung und Verdrahtungsband für diese Vorrichtung Expired - Lifetime DE69838696T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14910697A JP3639088B2 (ja) 1997-06-06 1997-06-06 半導体装置及び配線テープ
JP14910697 1997-06-06

Publications (2)

Publication Number Publication Date
DE69838696D1 true DE69838696D1 (de) 2007-12-27
DE69838696T2 DE69838696T2 (de) 2008-03-06

Family

ID=15467836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838696T Expired - Lifetime DE69838696T2 (de) 1997-06-06 1998-06-02 Halbleitervorrichtung und Verdrahtungsband für diese Vorrichtung

Country Status (8)

Country Link
US (3) US6433440B1 (de)
EP (1) EP0883180B1 (de)
JP (1) JP3639088B2 (de)
CN (1) CN1146985C (de)
DE (1) DE69838696T2 (de)
MY (1) MY119817A (de)
SG (1) SG75846A1 (de)
TW (1) TW421861B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3639088B2 (ja) * 1997-06-06 2005-04-13 株式会社ルネサステクノロジ 半導体装置及び配線テープ
JPH1140694A (ja) 1997-07-16 1999-02-12 Oki Electric Ind Co Ltd 半導体パッケージおよび半導体装置とその製造方法
US6890796B1 (en) 1997-07-16 2005-05-10 Oki Electric Industry Co., Ltd. Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected
DE19923467B4 (de) 1999-05-21 2004-11-11 Infineon Technologies Ag Halbleitermodul mit mehreren Halbleiterchips und leitender Verbindung mittels flexibler Bänder zwischen den Halbleiterchips
JP2001085565A (ja) * 1999-09-17 2001-03-30 Hitachi Ltd 半導体装置およびその製造方法
DE10003670A1 (de) * 2000-01-28 2001-08-09 Wichmann Workx Ag Information Halbleiterbauelement
DE10014304B4 (de) * 2000-03-23 2007-08-02 Infineon Technologies Ag Halbleiterbauelement und Verfahren zu dessen Herstellung
DE10014305C2 (de) * 2000-03-23 2002-02-07 Infineon Technologies Ag Elektronisches Bauteil mit einer Vielzahl von Kontakthöckern
US6617674B2 (en) * 2001-02-20 2003-09-09 Dow Corning Corporation Semiconductor package and method of preparing same
JP2002252304A (ja) * 2001-02-23 2002-09-06 Toshiba Corp 半導体装置およびこれに用いられる支持基板
JP2003003134A (ja) 2001-06-20 2003-01-08 Japan Gore Tex Inc Ｉｃチップ接着用シートおよびｉｃパッケージ
TW582100B (en) * 2002-05-30 2004-04-01 Fujitsu Ltd Semiconductor device having a heat spreader exposed from a seal resin
DE10250778B3 (de) * 2002-10-30 2004-03-04 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zum Bestücken eines Schaltungsträgers beim Herstellen des elektronischen Bauteils
KR100630684B1 (ko) * 2004-06-08 2006-10-02 삼성전자주식회사 솔더 접합 신뢰도(ｓｊｒ)를 높일 수 있는 인쇄회로기판및 이를 이용한 반도체 패키지 모듈
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
JP4588033B2 (ja) * 2004-11-12 2010-11-24 パナソニック株式会社 デジタルテレビジョン受信機用回路モジュール
KR100666919B1 (ko) * 2005-12-20 2007-01-10 삼성전자주식회사 반도체 패키지용 접착 시트, 이를 포함하는 반도체 소자,이를 포함하는 멀티 스택 패키지, 반도체 소자의 제조 방법및 멀티 스택 패키지의 제조 방법
US20070287022A1 (en) * 2006-06-07 2007-12-13 Honeywell International, Inc. Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
JP5028968B2 (ja) * 2006-11-17 2012-09-19 日立電線株式会社 半導体装置、積層型半導体装置およびインターポーザ基板
US20090001599A1 (en) * 2007-06-28 2009-01-01 Spansion Llc Die attachment, die stacking, and wire embedding using film
KR20090042574A (ko) * 2007-10-26 2009-04-30 삼성전자주식회사 반도체 모듈 및 이를 구비하는 전자 장치
US8004072B2 (en) * 2008-10-15 2011-08-23 Qimonda Ag Packaging systems and methods
JP2010272680A (ja) * 2009-05-21 2010-12-02 Elpida Memory Inc 半導体装置
TWI406376B (zh) * 2010-06-15 2013-08-21 Powertech Technology Inc 晶片封裝構造
CN102790034A (zh) * 2011-05-17 2012-11-21 飞思卡尔半导体公司 具有散热器的半导体器件
US8476111B2 (en) * 2011-06-16 2013-07-02 Stats Chippac Ltd. Integrated circuit packaging system with intra substrate die and method of manufacture thereof
JP7258806B2 (ja) * 2020-03-23 2023-04-17 株式会社東芝 半導体装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249544A (ja) 1988-08-11 1990-02-19 Nonogawa Shoji:Kk イチョウ成分含有飲食物
JP3061059B2 (ja) * 1989-08-07 2000-07-10 ジャパンゴアテックス株式会社 Ｉｃパッケージ
US5237205A (en) * 1989-10-02 1993-08-17 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JPH03177376A (ja) * 1989-12-04 1991-08-01 Japan Gore Tex Inc セラミック基板
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
EP0504634A3 (en) * 1991-03-08 1994-06-01 Japan Gore Tex Inc Resin-sealed semiconductor device containing porous fluorocarbon resin
JP2927982B2 (ja) 1991-03-18 1999-07-28 ジャパンゴアテックス株式会社 半導体装置
JP3218542B2 (ja) * 1991-07-02 2001-10-15 ジャパンゴアテックス株式会社 電子回路基板及び半導体チップキャリヤー用シート
JPH0584861A (ja) * 1991-09-30 1993-04-06 Japan Gore Tex Inc シリコーン樹脂を使用した複合材料
TW258829B (de) 1994-01-28 1995-10-01 Ibm
JPH07245471A (ja) 1994-03-06 1995-09-19 Yokogawa Hewlett Packard Ltd プリント回路基材および電気接続構造
TW294702B (de) * 1994-03-08 1997-01-01 Sumitomo Bakelite Co
WO1995026047A1 (en) * 1994-03-18 1995-09-28 Hitachi Chemical Company, Ltd. Semiconductor package manufacturing method and semiconductor package
JP2595909B2 (ja) 1994-09-14 1997-04-02 日本電気株式会社 半導体装置
JPH09115963A (ja) 1995-10-18 1997-05-02 Hitachi Ltd 配線テープおよび半導体装置
KR0179802B1 (ko) * 1995-12-29 1999-03-20 문정환 반도체 패키지
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
KR100196285B1 (ko) * 1996-04-18 1999-06-15 윤종용 폴리이미드의 불완전 경화 상태를 이용한 리드 온 칩형 반도체 칩 패키지의 리드와 반도체 칩 부착 방법
JP3703568B2 (ja) 1996-06-28 2005-10-05 ジャパンゴアテックス株式会社 Ｉｃチップ接着用シートおよびｉｃパッケージ
JPH1081857A (ja) 1996-09-05 1998-03-31 Hitachi Cable Ltd 両面接着テープ、リードフレーム及び集積回路装置
JPH1098072A (ja) 1996-09-20 1998-04-14 Hitachi Ltd 半導体装置及びその製造方法
JPH10110057A (ja) * 1996-10-08 1998-04-28 Bridgestone Corp ミクロ多孔体の製造方法
US5866949A (en) 1996-12-02 1999-02-02 Minnesota Mining And Manufacturing Company Chip scale ball grid array for integrated circuit packaging
US5973389A (en) 1997-04-22 1999-10-26 International Business Machines Corporation Semiconductor chip carrier assembly
JP3639088B2 (ja) * 1997-06-06 2005-04-13 株式会社ルネサステクノロジ 半導体装置及び配線テープ
KR100211421B1 (ko) * 1997-06-18 1999-08-02 윤종용 중앙부가 관통된 플렉서블 회로기판을 사용한 반도체 칩 패키지
US5800758A (en) 1997-09-16 1998-09-01 Kimberly-Clark Worldwide, Inc. Process for making microporous films with improved properties

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EP0883180A2 (de) 1998-12-09
US6433440B1 (en) 2002-08-13
MY119817A (en) 2005-07-29
TW421861B (en) 2001-02-11
EP0883180A3 (de) 1999-10-27
DE69838696T2 (de) 2008-03-06
CN1207583A (zh) 1999-02-10
JP3639088B2 (ja) 2005-04-13
US20020158343A1 (en) 2002-10-31
JPH10340968A (ja) 1998-12-22
US20040195702A1 (en) 2004-10-07
SG75846A1 (en) 2000-10-24
CN1146985C (zh) 2004-04-21
US7038325B2 (en) 2006-05-02
EP0883180B1 (de) 2007-11-14

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