DE69716367D1 - Herstellung von Siliziumsubstraten - Google Patents

Herstellung von Siliziumsubstraten

Info

Publication number
DE69716367D1
DE69716367D1 DE69716367T DE69716367T DE69716367D1 DE 69716367 D1 DE69716367 D1 DE 69716367D1 DE 69716367 T DE69716367 T DE 69716367T DE 69716367 T DE69716367 T DE 69716367T DE 69716367 D1 DE69716367 D1 DE 69716367D1
Authority
DE
Germany
Prior art keywords
manufacture
silicon substrates
substrates
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69716367T
Other languages
English (en)
Other versions
DE69716367T2 (de
Inventor
Tamotsu Maruyama
Hiroki Ose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69716367D1 publication Critical patent/DE69716367D1/de
Application granted granted Critical
Publication of DE69716367T2 publication Critical patent/DE69716367T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H01L21/205
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/2205Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities from the substrate during epitaxy, e.g. autodoping; Preventing or using autodoping
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69716367T 1996-08-27 1997-08-19 Herstellung von Siliziumsubstraten Expired - Fee Related DE69716367T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22551796A JP3336866B2 (ja) 1996-08-27 1996-08-27 気相成長用シリコン単結晶基板の製造方法

Publications (2)

Publication Number Publication Date
DE69716367D1 true DE69716367D1 (de) 2002-11-21
DE69716367T2 DE69716367T2 (de) 2003-03-13

Family

ID=16830558

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69716367T Expired - Fee Related DE69716367T2 (de) 1996-08-27 1997-08-19 Herstellung von Siliziumsubstraten

Country Status (5)

Country Link
US (1) US5882401A (de)
EP (1) EP0826801B1 (de)
JP (1) JP3336866B2 (de)
KR (1) KR100496213B1 (de)
DE (1) DE69716367T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005063A1 (fr) * 1996-07-29 1998-02-05 Sumitomo Sitix Corporation Plaquette epitaxiale en silicium et son procede de fabrication
JP2000077372A (ja) * 1998-08-31 2000-03-14 Sumitomo Metal Ind Ltd 気相成長用半導体ウェーハの製造方法
US7145739B1 (en) * 2002-03-07 2006-12-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Lightweight optical mirrors formed in single crystal substrate
WO2003077297A1 (fr) * 2002-03-14 2003-09-18 Disco Corporation Procede de meulage de la surface arriere d'une plaquette semi-conductrice
JP4016823B2 (ja) * 2002-12-06 2007-12-05 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
JP4682508B2 (ja) * 2003-11-14 2011-05-11 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
US7250358B2 (en) * 2004-08-06 2007-07-31 Globitech Incorporated Wafer for preventing the formation of silicon nodules and method for preventing the formation of silicon nodules
JP4815801B2 (ja) * 2004-12-28 2011-11-16 信越半導体株式会社 シリコンウエーハの研磨方法および製造方法および円板状ワークの研磨装置ならびにシリコンウエーハ
US8241423B2 (en) 2006-09-29 2012-08-14 Sumco Techxiv Corporation Silicon single crystal substrate and manufacture thereof
KR100842674B1 (ko) 2006-12-20 2008-06-30 동부일렉트로닉스 주식회사 반도체 소자의 제조방법
KR100844435B1 (ko) * 2006-12-29 2008-07-08 주식회사 실트론 에피택셜 웨이퍼의 제조방법
US8214935B2 (en) * 2007-01-31 2012-07-10 B & S Plastics, Inc. Pop-up fountains
KR100919932B1 (ko) * 2007-10-05 2009-10-07 주식회사 실트론 실리콘 에피택셜 단결정 기판의 제조방법 및 에칭장치
KR100931190B1 (ko) * 2007-12-26 2009-12-10 주식회사 실트론 웨이퍼 식각 장치 및 그를 이용한 웨이퍼 처리 방법
JP5795461B2 (ja) * 2009-08-19 2015-10-14 株式会社Sumco エピタキシャルシリコンウェーハの製造方法
JP5245180B2 (ja) * 2009-12-01 2013-07-24 三菱電機株式会社 半導体装置の製造方法
JP2011187887A (ja) * 2010-03-11 2011-09-22 Toyota Motor Corp エピタキシャルウエハの製造方法
JP5757088B2 (ja) * 2011-01-05 2015-07-29 株式会社Sumco エピタキシャルウェーハの製造方法、エピタキシャルウェーハ
US20130028829A1 (en) * 2011-07-28 2013-01-31 Hagopian John G System and method for growth of enhanced adhesion carbon nanotubes on substrates
JP6015127B2 (ja) * 2012-05-23 2016-10-26 株式会社デンソー 半導体装置の製造方法およびそれに用いられる半導体基板
JP6108609B2 (ja) * 2013-04-25 2017-04-05 クアーズテック株式会社 窒化物半導体基板
JP6157381B2 (ja) * 2014-03-04 2017-07-05 信越半導体株式会社 エピタキシャルウェーハの製造方法及びエピタキシャルウェーハ
JP6676365B2 (ja) * 2015-12-21 2020-04-08 キヤノン株式会社 撮像装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624199B2 (ja) * 1982-07-30 1994-03-30 株式会社日立製作所 ウエハの加工方法
JP2546986B2 (ja) * 1985-11-29 1996-10-23 九州電子金属 株式会社 半導体ウエ−ハ及びその製造方法
JP2839801B2 (ja) * 1992-09-18 1998-12-16 三菱マテリアル株式会社 ウェーハの製造方法
DE4307527A1 (de) * 1993-03-10 1994-09-15 Basf Magnetics Gmbh Verfahren sowie Vorrichtung zur Bearbeitung der Oberfläche von flexiblen bandförmigen Materialbahnen
JP2832138B2 (ja) * 1993-09-30 1998-12-02 信越半導体株式会社 ウェーハ外周部の研磨装置
JPH08294872A (ja) * 1995-04-27 1996-11-12 Fuji Photo Film Co Ltd 研磨体

Also Published As

Publication number Publication date
JPH1070080A (ja) 1998-03-10
EP0826801A3 (de) 1998-11-11
KR100496213B1 (ko) 2005-09-20
US5882401A (en) 1999-03-16
DE69716367T2 (de) 2003-03-13
JP3336866B2 (ja) 2002-10-21
EP0826801A2 (de) 1998-03-04
EP0826801B1 (de) 2002-10-16
KR19980019010A (ko) 1998-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee