DE69711772D1 - Packungsstruktur für Multichip-Module - Google Patents
Packungsstruktur für Multichip-ModuleInfo
- Publication number
- DE69711772D1 DE69711772D1 DE69711772T DE69711772T DE69711772D1 DE 69711772 D1 DE69711772 D1 DE 69711772D1 DE 69711772 T DE69711772 T DE 69711772T DE 69711772 T DE69711772 T DE 69711772T DE 69711772 D1 DE69711772 D1 DE 69711772D1
- Authority
- DE
- Germany
- Prior art keywords
- packing structure
- multichip modules
- multichip
- modules
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/151—Die mounting substrate
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI962816A FI962816A (fi) | 1996-07-11 | 1996-07-11 | Mikropiirimodulien kotelorakenne |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69711772D1 true DE69711772D1 (de) | 2002-05-16 |
DE69711772T2 DE69711772T2 (de) | 2002-11-28 |
Family
ID=8546373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69711772T Expired - Lifetime DE69711772T2 (de) | 1996-07-11 | 1997-07-08 | Packungsstruktur für Multichip-Module |
Country Status (4)
Country | Link |
---|---|
US (1) | US5872700A (de) |
EP (1) | EP0818822B1 (de) |
DE (1) | DE69711772T2 (de) |
FI (1) | FI962816A (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19811853C1 (de) | 1998-03-18 | 1999-09-09 | Nokia Mobile Phones Ltd | Kommunikationseinrichtung und Verfahren zu deren Betriebssteuerung |
US6424034B1 (en) | 1998-08-31 | 2002-07-23 | Micron Technology, Inc. | High performance packaging for microprocessors and DRAM chips which minimizes timing skews |
SG93192A1 (en) * | 1999-01-28 | 2002-12-17 | United Microelectronics Corp | Face-to-face multi chip package |
JP3828673B2 (ja) * | 1999-02-23 | 2006-10-04 | ローム株式会社 | 半導体装置 |
US6164979A (en) | 1999-03-12 | 2000-12-26 | Motorola, Inc. | System for providing a removable high density electrical interconnect for flexible circuits |
US6784541B2 (en) * | 2000-01-27 | 2004-08-31 | Hitachi, Ltd. | Semiconductor module and mounting method for same |
EP1198005A4 (de) * | 1999-03-26 | 2004-11-24 | Hitachi Ltd | Halbleitermodul und seine montage |
US6166444A (en) * | 1999-06-21 | 2000-12-26 | United Microelectronics Corp. | Cascade-type chip module |
US6282100B1 (en) * | 1999-07-01 | 2001-08-28 | Agere Systems Guardian Corp. | Low cost ball grid array package |
JP2001024027A (ja) * | 1999-07-09 | 2001-01-26 | Oki Electric Ind Co Ltd | 半導体素子、半導体素子の製造方法、半導体装置、半導体装置の製造方法 |
JP2001044358A (ja) * | 1999-07-28 | 2001-02-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6882045B2 (en) * | 1999-10-28 | 2005-04-19 | Thomas J. Massingill | Multi-chip module and method for forming and method for deplating defective capacitors |
US6285043B1 (en) * | 1999-11-01 | 2001-09-04 | The Boeing Company | Application-specific optoelectronic integrated circuit |
US6610560B2 (en) * | 2001-05-11 | 2003-08-26 | Siliconware Precision Industries Co., Ltd. | Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same |
US7215022B2 (en) * | 2001-06-21 | 2007-05-08 | Ati Technologies Inc. | Multi-die module |
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-
1996
- 1996-07-11 FI FI962816A patent/FI962816A/fi unknown
-
1997
- 1997-07-07 US US08/888,906 patent/US5872700A/en not_active Expired - Lifetime
- 1997-07-08 DE DE69711772T patent/DE69711772T2/de not_active Expired - Lifetime
- 1997-07-08 EP EP97660080A patent/EP0818822B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0818822A2 (de) | 1998-01-14 |
EP0818822A3 (de) | 1999-01-27 |
FI962816A (fi) | 1998-01-12 |
DE69711772T2 (de) | 2002-11-28 |
EP0818822B1 (de) | 2002-04-10 |
FI962816A0 (fi) | 1996-07-11 |
US5872700A (en) | 1999-02-16 |
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