DE69701716T2 - Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung - Google Patents

Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung

Info

Publication number
DE69701716T2
DE69701716T2 DE69701716T DE69701716T DE69701716T2 DE 69701716 T2 DE69701716 T2 DE 69701716T2 DE 69701716 T DE69701716 T DE 69701716T DE 69701716 T DE69701716 T DE 69701716T DE 69701716 T2 DE69701716 T2 DE 69701716T2
Authority
DE
Germany
Prior art keywords
making
electrical connection
connection device
multilayer electrical
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69701716T
Other languages
English (en)
Other versions
DE69701716D1 (de
Inventor
David John Klassen
Morgan Merritt Whitney
Thomas Randall Peterman
Paul Earl Pergande
David Robert Collins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Publication of DE69701716D1 publication Critical patent/DE69701716D1/de
Application granted granted Critical
Publication of DE69701716T2 publication Critical patent/DE69701716T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69701716T 1996-08-07 1997-08-06 Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung Expired - Fee Related DE69701716T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/689,164 US6331680B1 (en) 1996-08-07 1996-08-07 Multilayer electrical interconnection device and method of making same

Publications (2)

Publication Number Publication Date
DE69701716D1 DE69701716D1 (de) 2000-05-25
DE69701716T2 true DE69701716T2 (de) 2000-08-10

Family

ID=24767298

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69701716T Expired - Fee Related DE69701716T2 (de) 1996-08-07 1997-08-06 Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung

Country Status (4)

Country Link
US (1) US6331680B1 (de)
EP (1) EP0823832B1 (de)
JP (1) JPH10229282A (de)
DE (1) DE69701716T2 (de)

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DE10130257A1 (de) * 2001-06-12 2002-12-19 Hella Kg Hueck & Co Verfahren zur Herstellung einer elektrischen Schaltung auf einem Trägerkörper
US6506062B1 (en) 2001-08-01 2003-01-14 Visteon Global Technologies, Inc. Circuit board having an integrated circuit board connector and method of making the same
DE10153482A1 (de) * 2001-10-30 2003-05-22 Leoni Ag Verfahren zum Behandeln eines elektrischen Leiters
AU2003301935A1 (en) * 2002-08-05 2004-06-03 Research Foundation Of The State University Of New York System and method for manufacturing wireless devices
WO2004013900A2 (en) * 2002-08-05 2004-02-12 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US7477050B2 (en) * 2003-08-05 2009-01-13 Research Foundation Of The State University Of New York Magnetic sensor having a coil around a permeable magnetic core
US7407738B2 (en) * 2004-04-02 2008-08-05 Pavel Kornilovich Fabrication and use of superlattice
DE102004054063B3 (de) * 2004-11-05 2006-06-08 Danfoss Silicon Power Gmbh Verfahren zum Herstellen einer rissarmen Verbindung und rissarme Verbindung
JP2006179856A (ja) 2004-11-25 2006-07-06 Fuji Electric Holdings Co Ltd 絶縁基板および半導体装置
US7375012B2 (en) * 2005-02-28 2008-05-20 Pavel Kornilovich Method of forming multilayer film
US7511228B2 (en) * 2005-09-14 2009-03-31 Schmartboard, Inc. Printed circuit board
JP5173160B2 (ja) * 2006-07-14 2013-03-27 新光電気工業株式会社 多層配線基板及びその製造方法
FI20085053A0 (fi) * 2008-01-22 2008-01-22 Valtion Teknillinen Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
US20100260940A1 (en) * 2009-04-08 2010-10-14 Mccown James Charles System and method for depositing metallic coatings on substrates using removable masking materials
DE102011084303A1 (de) * 2011-10-11 2013-04-11 Continental Automotive Gmbh Verfahren zur Herstellung eines Trägers für eine leistungselektronische Baugruppe und Träger für eine solche Baugruppe
JP2013254803A (ja) * 2012-06-06 2013-12-19 Mitsubishi Electric Corp 回路基板の製造方法、回路基板および電力用半導体装置
DE102012223904A1 (de) * 2012-10-05 2014-04-10 Continental Automotive Gmbh Verfahren zum Herstellen eines elektronischen Hochstrom-Schaltkreises mittels Gasspritz-Technologie und Abdichten mit isolierendem Polymer
KR102427675B1 (ko) * 2015-04-20 2022-08-02 삼성디스플레이 주식회사 박막 트랜지스터 어레이 기판, 및 이를 포함하는 유기 발광 표시 장치
JP6741403B2 (ja) * 2015-07-14 2020-08-19 株式会社エムダップ 医療器具の製造装置及び医療器具の製造方法

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Also Published As

Publication number Publication date
EP0823832A1 (de) 1998-02-11
EP0823832B1 (de) 2000-04-19
JPH10229282A (ja) 1998-08-25
US6331680B1 (en) 2001-12-18
DE69701716D1 (de) 2000-05-25

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee