DE69701716D1 - Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung - Google Patents
Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen VerbindungInfo
- Publication number
- DE69701716D1 DE69701716D1 DE69701716T DE69701716T DE69701716D1 DE 69701716 D1 DE69701716 D1 DE 69701716D1 DE 69701716 T DE69701716 T DE 69701716T DE 69701716 T DE69701716 T DE 69701716T DE 69701716 D1 DE69701716 D1 DE 69701716D1
- Authority
- DE
- Germany
- Prior art keywords
- making
- electrical connection
- connection device
- multilayer electrical
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating By Spraying Or Casting (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/689,164 US6331680B1 (en) | 1996-08-07 | 1996-08-07 | Multilayer electrical interconnection device and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69701716D1 true DE69701716D1 (de) | 2000-05-25 |
DE69701716T2 DE69701716T2 (de) | 2000-08-10 |
Family
ID=24767298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69701716T Expired - Fee Related DE69701716T2 (de) | 1996-08-07 | 1997-08-06 | Verfahren zur Herstellung einer mehrschichtigen Einrichtung zur elektrischen Verbindung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6331680B1 (de) |
EP (1) | EP0823832B1 (de) |
JP (1) | JPH10229282A (de) |
DE (1) | DE69701716T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576861B2 (en) * | 2000-07-25 | 2003-06-10 | The Research Foundation Of State University Of New York | Method and apparatus for fine feature spray deposition |
DE10052247A1 (de) * | 2000-10-21 | 2002-04-25 | Hella Kg Hueck & Co | Schaltungsstrukturen auf thermisch gespritzten Schichten |
DE10130257A1 (de) * | 2001-06-12 | 2002-12-19 | Hella Kg Hueck & Co | Verfahren zur Herstellung einer elektrischen Schaltung auf einem Trägerkörper |
US6506062B1 (en) | 2001-08-01 | 2003-01-14 | Visteon Global Technologies, Inc. | Circuit board having an integrated circuit board connector and method of making the same |
DE10153482A1 (de) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Verfahren zum Behandeln eines elektrischen Leiters |
WO2004013900A2 (en) * | 2002-08-05 | 2004-02-12 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
EP1573484A4 (de) * | 2002-08-05 | 2010-11-03 | Univ New York State Res Found | System und verfahren zur herstellung drahtloser einrichtungen |
US7477050B2 (en) * | 2003-08-05 | 2009-01-13 | Research Foundation Of The State University Of New York | Magnetic sensor having a coil around a permeable magnetic core |
US7407738B2 (en) * | 2004-04-02 | 2008-08-05 | Pavel Kornilovich | Fabrication and use of superlattice |
DE102004054063B3 (de) * | 2004-11-05 | 2006-06-08 | Danfoss Silicon Power Gmbh | Verfahren zum Herstellen einer rissarmen Verbindung und rissarme Verbindung |
JP2006179856A (ja) | 2004-11-25 | 2006-07-06 | Fuji Electric Holdings Co Ltd | 絶縁基板および半導体装置 |
US7375012B2 (en) * | 2005-02-28 | 2008-05-20 | Pavel Kornilovich | Method of forming multilayer film |
US7511228B2 (en) * | 2005-09-14 | 2009-03-31 | Schmartboard, Inc. | Printed circuit board |
JP5173160B2 (ja) * | 2006-07-14 | 2013-03-27 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
FI20085053A0 (fi) * | 2008-01-22 | 2008-01-22 | Valtion Teknillinen | Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset |
US20090260862A1 (en) * | 2008-04-16 | 2009-10-22 | Andrew Yaung | Circuit modification device for printed circuit boards |
US20100260940A1 (en) * | 2009-04-08 | 2010-10-14 | Mccown James Charles | System and method for depositing metallic coatings on substrates using removable masking materials |
DE102011084303A1 (de) * | 2011-10-11 | 2013-04-11 | Continental Automotive Gmbh | Verfahren zur Herstellung eines Trägers für eine leistungselektronische Baugruppe und Träger für eine solche Baugruppe |
JP2013254803A (ja) * | 2012-06-06 | 2013-12-19 | Mitsubishi Electric Corp | 回路基板の製造方法、回路基板および電力用半導体装置 |
DE102012223904A1 (de) | 2012-10-05 | 2014-04-10 | Continental Automotive Gmbh | Verfahren zum Herstellen eines elektronischen Hochstrom-Schaltkreises mittels Gasspritz-Technologie und Abdichten mit isolierendem Polymer |
KR102427675B1 (ko) * | 2015-04-20 | 2022-08-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 및 이를 포함하는 유기 발광 표시 장치 |
JP6741403B2 (ja) * | 2015-07-14 | 2020-08-19 | 株式会社エムダップ | 医療器具の製造装置及び医療器具の製造方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3872419A (en) | 1972-06-15 | 1975-03-18 | Alexander J Groves | Electrical elements operable as thermisters, varisters, smoke and moisture detectors, and methods for making the same |
FR2350697A1 (fr) | 1976-05-06 | 1977-12-02 | Cii | Structure perfectionnee de circuits multicouches |
US4101731A (en) | 1976-08-20 | 1978-07-18 | Airco, Inc. | Composite multifilament superconductors |
US4166880A (en) | 1978-01-18 | 1979-09-04 | Solamat Incorporated | Solar energy device |
US4176029A (en) | 1978-03-02 | 1979-11-27 | Sperry Rand Corporation | Subminiature bore and conductor formation |
US4263341A (en) | 1978-12-19 | 1981-04-21 | Western Electric Company, Inc. | Processes of making two-sided printed circuit boards, with through-hole connections |
JPS55130198A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Hybrid integrated circuit board for tuner |
US4421785A (en) | 1980-08-18 | 1983-12-20 | Sperry Corporation | Superconductive tunnel junction device and method of manufacture |
DE3103615A1 (de) | 1981-02-03 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur erzeugung von extremen feinstrukturen |
DE3280233D1 (de) | 1981-09-11 | 1990-10-04 | Toshiba Kawasaki Kk | Verfahren zum herstellen eines substrats fuer multischichtschaltung. |
EP0082216B1 (de) | 1981-12-23 | 1985-10-09 | Ibm Deutschland Gmbh | Mehrschichtiges, keramisches Substrat für integrierte Halbleiterschaltungen mit mehreren Metallisierungsebenen |
US4532152A (en) | 1982-03-05 | 1985-07-30 | Elarde Vito D | Fabrication of a printed circuit board with metal-filled channels |
US4511599A (en) | 1983-03-01 | 1985-04-16 | Sigmatron Associates | Mask for vacuum depositing back metal electrodes on EL panel |
US4464701A (en) | 1983-08-29 | 1984-08-07 | International Business Machines Corporation | Process for making high dielectric constant nitride based materials and devices using the same |
JPS61207044A (ja) | 1985-03-12 | 1986-09-13 | Showa Denko Kk | 溶射基板の回路形成方法 |
US4670297A (en) | 1985-06-21 | 1987-06-02 | Raytheon Company | Evaporated thick metal and airbridge interconnects and method of manufacture |
JPS6276653A (ja) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | 半導体集積回路 |
US4685197A (en) | 1986-01-07 | 1987-08-11 | Texas Instruments Incorporated | Fabricating a stacked capacitor |
US5324536A (en) | 1986-04-28 | 1994-06-28 | Canon Kabushiki Kaisha | Method of forming a multilayered structure |
US5401716A (en) | 1987-04-15 | 1995-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing superconducting patterns |
NL8703039A (nl) | 1987-12-16 | 1989-07-17 | Philips Nv | Werkwijze voor het patroonmatig vervaardigen van een dunne laag uit een oxidisch supergeleidend materiaal. |
US5162298A (en) | 1988-02-16 | 1992-11-10 | International Business Machines Corporation | Grain boundary junction devices using high tc superconductors |
US4977105A (en) * | 1988-03-15 | 1990-12-11 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing interconnection structure in semiconductor device |
JPH0234984A (ja) | 1988-04-13 | 1990-02-05 | Mitsubishi Electric Corp | プリント回路基板の製造方法 |
JPH0222888A (ja) | 1988-07-12 | 1990-01-25 | Shinichiro Koga | 金属溶射工法によるプリント配線基板の製造方法 |
US5084323A (en) * | 1989-04-07 | 1992-01-28 | Nippondenso Co., Ltd. | Ceramic multi-layer wiring substrate and process for preparation thereof |
JPH04242088A (ja) * | 1991-01-16 | 1992-08-28 | Nec Corp | Icソケット |
US5200580A (en) * | 1991-08-26 | 1993-04-06 | E-Systems, Inc. | Configurable multi-chip module interconnect |
DE69219998T2 (de) | 1991-10-31 | 1997-12-18 | Sgs Thomson Microelectronics | Verfahren zur Entfernung von Polymeren aus Sacklöchern in Halbleitervorrichtungen |
US5380564A (en) | 1992-04-28 | 1995-01-10 | Progressive Blasting Systems, Inc. | High pressure water jet method of blasting low density metallic surfaces |
US5321211A (en) | 1992-04-30 | 1994-06-14 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit via structure |
JPH065715A (ja) * | 1992-06-18 | 1994-01-14 | Sony Corp | 配線層の形成方法 |
US5432149A (en) | 1992-06-22 | 1995-07-11 | Regents Of The University Of California | In-situ tunable Josephson weak links |
WO1994007611A1 (en) | 1992-10-01 | 1994-04-14 | Motorola, Inc. | Method for forming circuitry by a spraying process with stencil |
US5391841A (en) | 1992-12-08 | 1995-02-21 | Quick; Nathaniel R. | Laser processed coatings on electronic circuit substrates |
DE69403104T2 (de) | 1993-02-15 | 1997-10-30 | Sumitomo Electric Industries | Verfahren zum Erzeugen einer strukturierten oxydsupraleitenden Dünnschicht |
US5601672A (en) * | 1994-11-01 | 1997-02-11 | International Business Machines Corporation | Method for making ceramic substrates from thin and thick ceramic greensheets |
-
1996
- 1996-08-07 US US08/689,164 patent/US6331680B1/en not_active Expired - Fee Related
-
1997
- 1997-08-06 JP JP9212299A patent/JPH10229282A/ja active Pending
- 1997-08-06 DE DE69701716T patent/DE69701716T2/de not_active Expired - Fee Related
- 1997-08-06 EP EP97305991A patent/EP0823832B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0823832B1 (de) | 2000-04-19 |
DE69701716T2 (de) | 2000-08-10 |
JPH10229282A (ja) | 1998-08-25 |
US6331680B1 (en) | 2001-12-18 |
EP0823832A1 (de) | 1998-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |