DE69637900D1 - Harzvergossenes Halbleiterbauteil und dessen Herstellungsverfahren - Google Patents
Harzvergossenes Halbleiterbauteil und dessen HerstellungsverfahrenInfo
- Publication number
- DE69637900D1 DE69637900D1 DE69637900T DE69637900T DE69637900D1 DE 69637900 D1 DE69637900 D1 DE 69637900D1 DE 69637900 T DE69637900 T DE 69637900T DE 69637900 T DE69637900 T DE 69637900T DE 69637900 D1 DE69637900 D1 DE 69637900D1
- Authority
- DE
- Germany
- Prior art keywords
- resin
- manufacturing
- semiconductor device
- molded semiconductor
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3877695 | 1995-02-27 | ||
JP32384795A JP3542677B2 (ja) | 1995-02-27 | 1995-11-16 | 樹脂封止型半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69637900D1 true DE69637900D1 (de) | 2009-05-28 |
Family
ID=26378064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69637900T Expired - Lifetime DE69637900D1 (de) | 1995-02-27 | 1996-02-26 | Harzvergossenes Halbleiterbauteil und dessen Herstellungsverfahren |
Country Status (8)
Country | Link |
---|---|
US (1) | US5801435A (de) |
EP (1) | EP0729181B1 (de) |
JP (1) | JP3542677B2 (de) |
KR (1) | KR100414450B1 (de) |
CN (1) | CN1093984C (de) |
DE (1) | DE69637900D1 (de) |
SG (1) | SG38933A1 (de) |
TW (2) | TW387134B (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5808357A (en) * | 1992-06-02 | 1998-09-15 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
JP2891184B2 (ja) * | 1996-06-13 | 1999-05-17 | 日本電気株式会社 | 半導体装置及びその製造方法 |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
FR2764114B1 (fr) * | 1997-06-02 | 2003-04-25 | Sgs Thomson Microelectronics | Dispositif semi-conducteur muni d'un dissipateur thermique |
US6319757B1 (en) * | 1998-07-08 | 2001-11-20 | Caldus Semiconductor, Inc. | Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates |
JP3128548B2 (ja) | 1999-03-11 | 2001-01-29 | 沖電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
US6198163B1 (en) * | 1999-10-18 | 2001-03-06 | Amkor Technology, Inc. | Thin leadframe-type semiconductor package having heat sink with recess and exposed surface |
US20030211062A1 (en) * | 2001-05-07 | 2003-11-13 | Karl Laden | Anhydrous skin cleaners |
US6396130B1 (en) | 2001-09-14 | 2002-05-28 | Amkor Technology, Inc. | Semiconductor package having multiple dies with independently biased back surfaces |
JP2003258141A (ja) * | 2002-02-27 | 2003-09-12 | Nec Compound Semiconductor Devices Ltd | 電子部品及びその製造方法 |
JP3566269B2 (ja) * | 2002-06-07 | 2004-09-15 | 富士通株式会社 | リードフレーム及びその製造方法、及び半導体装置。 |
JP2004349347A (ja) | 2003-05-20 | 2004-12-09 | Rohm Co Ltd | 半導体装置 |
US7919853B1 (en) * | 2007-11-01 | 2011-04-05 | Amkor Technology, Inc. | Semiconductor package and fabrication method thereof |
JP2013183023A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 電力変換装置 |
JP2013183022A (ja) | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 半導体装置および半導体装置の製造方法 |
JP5308595B1 (ja) * | 2012-11-28 | 2013-10-09 | 新電元工業株式会社 | 樹脂封止型半導体装置の製造方法及び樹脂封止型半導体装置 |
JP6416996B1 (ja) * | 2017-07-24 | 2018-10-31 | アサヒ・エンジニアリング株式会社 | 樹脂封止装置用の封止型 |
JP7024349B2 (ja) * | 2017-11-24 | 2022-02-24 | セイコーエプソン株式会社 | センサーユニット、センサーユニットの製造方法、慣性計測装置、電子機器、および移動体 |
Family Cites Families (60)
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NL121811C (de) * | 1961-06-26 | |||
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US3965277A (en) * | 1972-05-09 | 1976-06-22 | Massachusetts Institute Of Technology | Photoformed plated interconnection of embedded integrated circuit chips |
JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
JPS54124678A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Lead frame |
JPS56122134A (en) * | 1980-02-29 | 1981-09-25 | Toshiba Corp | Resin-sealed type semiconductor device |
JPS5812341A (ja) * | 1981-07-16 | 1983-01-24 | Toshiba Corp | 半導体装置 |
JPS59207645A (ja) * | 1983-05-11 | 1984-11-24 | Toshiba Corp | 半導体装置およびリ−ドフレ−ム |
JPS60103651A (ja) * | 1983-11-11 | 1985-06-07 | Hitachi Ltd | 半導体装置 |
DE3578830D1 (de) * | 1984-06-14 | 1990-08-30 | Advanced Micro Devices Inc | Mehrschicht-waermesenkpackung fuer integrierte schaltung. |
JPS61166051A (ja) * | 1985-01-17 | 1986-07-26 | Matsushita Electronics Corp | 樹脂封止型半導体装置 |
JPS6297358A (ja) * | 1985-10-23 | 1987-05-06 | Mitsubishi Electric Corp | 樹脂封止形半導体集積回路装置 |
US4684975A (en) * | 1985-12-16 | 1987-08-04 | National Semiconductor Corporation | Molded semiconductor package having improved heat dissipation |
JPS63179557A (ja) * | 1987-01-20 | 1988-07-23 | Nec Corp | 半導体装置用リ−ドフレ−ム |
JPS63240053A (ja) * | 1987-03-27 | 1988-10-05 | Mitsubishi Electric Corp | 半導体装置 |
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
US4903118A (en) * | 1988-03-30 | 1990-02-20 | Director General, Agency Of Industrial Science And Technology | Semiconductor device including a resilient bonding resin |
JPH023390A (ja) * | 1988-06-15 | 1990-01-08 | Brother Ind Ltd | 画像転写形成方法及び画像転写物 |
US5050040A (en) * | 1988-10-21 | 1991-09-17 | Texas Instruments Incorporated | Composite material, a heat-dissipating member using the material in a circuit system, the circuit system |
JP2593702B2 (ja) * | 1988-11-09 | 1997-03-26 | 株式会社日立製作所 | 半導体装置の製造方法 |
US5157478A (en) * | 1989-04-19 | 1992-10-20 | Mitsubishi Denki Kabushiki Kaisha | Tape automated bonding packaged semiconductor device incorporating a heat sink |
JPH02307251A (ja) * | 1989-05-22 | 1990-12-20 | Nec Corp | 樹脂封止型半導体装置 |
US5208188A (en) * | 1989-10-02 | 1993-05-04 | Advanced Micro Devices, Inc. | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
JPH03149865A (ja) * | 1989-11-07 | 1991-06-26 | Matsushita Electron Corp | リードフレーム |
JPH0719876B2 (ja) * | 1989-12-04 | 1995-03-06 | 株式会社東芝 | 半導体装置 |
JP2517691B2 (ja) * | 1990-01-29 | 1996-07-24 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JPH03265161A (ja) * | 1990-03-15 | 1991-11-26 | Toshiba Corp | 樹脂封止型半導体装置 |
JP2886250B2 (ja) * | 1990-03-26 | 1999-04-26 | 株式会社日立製作所 | 半導体装置 |
JP2850462B2 (ja) * | 1990-03-29 | 1999-01-27 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JPH0410558A (ja) * | 1990-04-27 | 1992-01-14 | Hitachi Ltd | 放熱体付き半導体装置 |
JPH0411758A (ja) * | 1990-04-28 | 1992-01-16 | Mitsubishi Electric Corp | 半導体装置 |
JPH0427145A (ja) * | 1990-05-22 | 1992-01-30 | Seiko Epson Corp | 半導体装置 |
US5227662A (en) * | 1990-05-24 | 1993-07-13 | Nippon Steel Corporation | Composite lead frame and semiconductor device using the same |
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JP3572628B2 (ja) * | 1992-06-03 | 2004-10-06 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP3322429B2 (ja) * | 1992-06-04 | 2002-09-09 | 新光電気工業株式会社 | 半導体装置 |
US5367196A (en) * | 1992-09-17 | 1994-11-22 | Olin Corporation | Molded plastic semiconductor package including an aluminum alloy heat spreader |
JPH0697326A (ja) * | 1992-09-14 | 1994-04-08 | Apic Yamada Kk | 半導体装置およびその放熱部材 |
JPH06132444A (ja) * | 1992-10-20 | 1994-05-13 | Hitachi Ltd | 半導体装置 |
JPH06295962A (ja) * | 1992-10-20 | 1994-10-21 | Ibiden Co Ltd | 電子部品搭載用基板およびその製造方法並びに電子部品搭載装置 |
JP3304447B2 (ja) * | 1992-11-17 | 2002-07-22 | イビデン株式会社 | 電子部品搭載用基板 |
JP3509274B2 (ja) * | 1994-07-13 | 2004-03-22 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
-
1995
- 1995-11-16 JP JP32384795A patent/JP3542677B2/ja not_active Expired - Lifetime
- 1995-12-28 TW TW86100244A patent/TW387134B/zh not_active IP Right Cessation
- 1995-12-28 TW TW88201643U patent/TW562245U/zh not_active IP Right Cessation
-
1996
- 1996-02-16 KR KR1019960003828A patent/KR100414450B1/ko not_active IP Right Cessation
- 1996-02-26 DE DE69637900T patent/DE69637900D1/de not_active Expired - Lifetime
- 1996-02-26 US US08/607,139 patent/US5801435A/en not_active Expired - Lifetime
- 1996-02-26 EP EP19960102859 patent/EP0729181B1/de not_active Expired - Lifetime
- 1996-02-26 CN CN96102532A patent/CN1093984C/zh not_active Expired - Fee Related
- 1996-02-27 SG SG1996006122A patent/SG38933A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0729181B1 (de) | 2009-04-15 |
CN1136711A (zh) | 1996-11-27 |
CN1093984C (zh) | 2002-11-06 |
KR100414450B1 (ko) | 2004-04-03 |
EP0729181A3 (de) | 1997-08-27 |
EP0729181A2 (de) | 1996-08-28 |
JPH08298302A (ja) | 1996-11-12 |
JP3542677B2 (ja) | 2004-07-14 |
TW562245U (en) | 2003-11-11 |
TW387134B (en) | 2000-04-11 |
SG38933A1 (en) | 1997-04-17 |
US5801435A (en) | 1998-09-01 |
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