DE69601256T2 - Aluminiumnitrrid-sinterkörper und verfahren zu dessen herstellung - Google Patents
Aluminiumnitrrid-sinterkörper und verfahren zu dessen herstellungInfo
- Publication number
- DE69601256T2 DE69601256T2 DE69601256T DE69601256T DE69601256T2 DE 69601256 T2 DE69601256 T2 DE 69601256T2 DE 69601256 T DE69601256 T DE 69601256T DE 69601256 T DE69601256 T DE 69601256T DE 69601256 T2 DE69601256 T2 DE 69601256T2
- Authority
- DE
- Germany
- Prior art keywords
- nitrride
- aluminum
- production
- sinter body
- sinter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07175029A JP3100871B2 (ja) | 1995-07-11 | 1995-07-11 | 窒化アルミニウム焼結体 |
PCT/JP1996/001808 WO1997003031A1 (en) | 1995-07-11 | 1996-06-28 | Aluminum nitride sinter and process for the production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69601256D1 DE69601256D1 (de) | 1999-02-11 |
DE69601256T2 true DE69601256T2 (de) | 1999-05-20 |
Family
ID=15988980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69601256T Expired - Lifetime DE69601256T2 (de) | 1995-07-11 | 1996-06-28 | Aluminiumnitrrid-sinterkörper und verfahren zu dessen herstellung |
Country Status (8)
Country | Link |
---|---|
US (1) | US5767028A (de) |
EP (1) | EP0780351B1 (de) |
JP (1) | JP3100871B2 (de) |
KR (1) | KR0168303B1 (de) |
CN (1) | CN1079785C (de) |
DE (1) | DE69601256T2 (de) |
TW (1) | TW397807B (de) |
WO (1) | WO1997003031A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4812144B2 (ja) * | 1998-07-22 | 2011-11-09 | 住友電気工業株式会社 | 窒化アルミニウム焼結体及びその製造方法 |
JP4651148B2 (ja) * | 2000-02-29 | 2011-03-16 | 京セラ株式会社 | 耐プラズマ部材及びプラズマ装置 |
JP4702978B2 (ja) * | 2000-05-09 | 2011-06-15 | 株式会社東芝 | 窒化アルミニウム焼結体 |
KR20020004129A (ko) * | 2000-07-03 | 2002-01-16 | 이종국 | 시알론 입계상을 갖는 강인화 탄화규소 제조법 |
JP2002319614A (ja) * | 2001-02-13 | 2002-10-31 | Nihon Ceratec Co Ltd | 静電チャック |
JP4245125B2 (ja) | 2001-11-26 | 2009-03-25 | 日本碍子株式会社 | 窒化アルミニウム質セラミックス、半導体製造用部材、耐蝕性部材および導電性部材 |
JP4493264B2 (ja) * | 2001-11-26 | 2010-06-30 | 日本碍子株式会社 | 窒化アルミニウム質セラミックス、半導体製造用部材および耐蝕性部材 |
JP4615873B2 (ja) * | 2003-12-16 | 2011-01-19 | 株式会社トクヤマ | 窒化アルミニウム焼結体及びその製造方法 |
JP4533994B2 (ja) * | 2004-05-26 | 2010-09-01 | 独立行政法人産業技術総合研究所 | プラズマ耐食材料、その製造方法及びその部材 |
US8563869B2 (en) * | 2005-08-29 | 2013-10-22 | Hitachi Metals, Ltd. | Circuit board and semiconductor module using this, production method for circuit board |
JP2007254190A (ja) * | 2006-03-22 | 2007-10-04 | Ngk Insulators Ltd | 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、及び部材 |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
CN102826853B (zh) * | 2012-09-04 | 2014-12-17 | 福建华清电子材料科技有限公司 | 一种高强度氮化铝陶瓷基板及其制造方法 |
EP2894126B1 (de) * | 2012-09-07 | 2018-08-01 | Tokuyama Corporation | Verfahren zur herstellung von wasserfestem aluminiumnitridpulver |
CN103332935B (zh) * | 2013-06-20 | 2014-12-10 | 绥中伊菲人工晶体科技有限公司 | 一种氮化铝复合陶瓷 |
CN103539457A (zh) * | 2013-09-29 | 2014-01-29 | 合肥工业大学 | 一种微电子封装用AlN陶瓷基板的制备方法 |
KR101662803B1 (ko) * | 2015-01-30 | 2016-10-12 | (주)코시스산업 | 착탈 가능한 진공압 키트를 구비한 진공용기 |
CN107759224A (zh) * | 2017-10-26 | 2018-03-06 | 广东工业大学 | 一种AlN复合陶瓷及其制备方法 |
KR102205085B1 (ko) * | 2018-12-31 | 2021-01-19 | 한국세라믹기술원 | 고강도 질화알루미늄 소결용 조성물 및 고강도 질화알루미늄 소결체 |
KR102500847B1 (ko) * | 2019-04-08 | 2023-02-15 | 주식회사 엘지화학 | 리튬 치환된 질화알루미늄 분말 및 이를 제조하기 위한 방법 |
KR102313589B1 (ko) | 2019-11-21 | 2021-10-19 | 한국세라믹기술원 | 질화알루미늄 세라믹스 조성물의 제조방법 |
CN112250451B (zh) * | 2020-09-23 | 2021-10-12 | 北京科技大学 | 一种高炉陶瓷杯用Al2OC-AlN固溶体结合刚玉耐火材料及制备方法 |
CN112374896B (zh) * | 2020-11-12 | 2022-05-27 | 广东工业大学 | 一种高性能氮化铝陶瓷基板的浆料和制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855377A (ja) * | 1981-09-28 | 1983-04-01 | 株式会社東芝 | 窒化アルミニウム焼結体の製造方法 |
US4672046A (en) * | 1984-10-15 | 1987-06-09 | Tdk Corporation | Sintered aluminum nitride body |
JPS61286267A (ja) * | 1985-06-13 | 1986-12-16 | イビデン株式会社 | 窒化アルミニウム質焼結体の製造方法 |
US5314850A (en) * | 1985-10-31 | 1994-05-24 | Kyocera Corporation | Aluminum nitride sintered body and production thereof |
JPS62123072A (ja) * | 1985-11-21 | 1987-06-04 | 京セラ株式会社 | 窒化アルミニウム質焼結体 |
JPS6329474A (ja) * | 1986-07-23 | 1988-02-08 | ロ−ム株式会社 | 半導体装置用サ−ジ吸収素子の製造方法 |
CA1318691C (en) * | 1987-08-28 | 1993-06-01 | Akira Yamakawa | Sintered body of aluminum nitride and method for producing the same |
JPH01242468A (ja) * | 1988-03-23 | 1989-09-27 | Japan Steel Works Ltd:The | 窒化アルミニウム焼結体の製造方法 |
US5219803A (en) * | 1988-05-16 | 1993-06-15 | Sumitomo Electric Industries, Ltd. | Sintered body of aluminum nitride |
US5264388A (en) * | 1988-05-16 | 1993-11-23 | Sumitomo Electric Industries, Inc. | Sintered body of aluminum nitride |
US5273700A (en) * | 1990-10-29 | 1993-12-28 | Sumitomo Electric Industries Ltd. | Aluminum nitride sintered body and process for producing the same |
EP0593553B1 (de) * | 1991-06-19 | 1996-09-18 | Lanxide Technology Company, Lp | Aluminiumnitrid feuerfestmaterialien und verfahren zur herstellung derselben |
US5258337A (en) * | 1992-06-18 | 1993-11-02 | W. R. Grace & Co.-Conn. | Reaction processing of AlN/B4 C composites |
JP3742661B2 (ja) * | 1993-05-21 | 2006-02-08 | 株式会社東芝 | 窒化アルミニウム焼結体およびその製造方法 |
EP0626359B1 (de) * | 1993-05-21 | 2001-07-18 | Kabushiki Kaisha Toshiba | Sinterkörper aus Aluminiumnitriol und Verfahren zu seiner Herstellung |
US5541145A (en) * | 1993-12-22 | 1996-07-30 | The Carborundum Company/Ibm Corporation | Low temperature sintering route for aluminum nitride ceramics |
US5424261A (en) * | 1993-12-22 | 1995-06-13 | The Carborundum Company | Low temperature sintering route for aluminum nitride ceramics |
-
1995
- 1995-07-11 JP JP07175029A patent/JP3100871B2/ja not_active Expired - Lifetime
-
1996
- 1996-06-28 WO PCT/JP1996/001808 patent/WO1997003031A1/ja active IP Right Grant
- 1996-06-28 EP EP96921126A patent/EP0780351B1/de not_active Expired - Lifetime
- 1996-06-28 CN CN96190015A patent/CN1079785C/zh not_active Expired - Lifetime
- 1996-06-28 KR KR1019960704733A patent/KR0168303B1/ko not_active IP Right Cessation
- 1996-06-28 DE DE69601256T patent/DE69601256T2/de not_active Expired - Lifetime
- 1996-06-28 US US08/687,445 patent/US5767028A/en not_active Expired - Lifetime
- 1996-07-05 TW TW085108141A patent/TW397807B/zh active
Also Published As
Publication number | Publication date |
---|---|
US5767028A (en) | 1998-06-16 |
EP0780351A1 (de) | 1997-06-25 |
DE69601256D1 (de) | 1999-02-11 |
CN1079785C (zh) | 2002-02-27 |
JP3100871B2 (ja) | 2000-10-23 |
KR0168303B1 (ko) | 1999-01-15 |
WO1997003031A1 (en) | 1997-01-30 |
TW397807B (en) | 2000-07-11 |
EP0780351B1 (de) | 1998-12-30 |
CN1152298A (zh) | 1997-06-18 |
JPH0925166A (ja) | 1997-01-28 |
EP0780351A4 (de) | 1997-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN |
|
8320 | Willingness to grant licences declared (paragraph 23) |