DE69522151D1 - Eingeschlossenes integriertes plastikvergossenes Mehr-Chip-Modul-Substrat und dessen Herstellungsverfahren - Google Patents
Eingeschlossenes integriertes plastikvergossenes Mehr-Chip-Modul-Substrat und dessen HerstellungsverfahrenInfo
- Publication number
- DE69522151D1 DE69522151D1 DE69522151T DE69522151T DE69522151D1 DE 69522151 D1 DE69522151 D1 DE 69522151D1 DE 69522151 T DE69522151 T DE 69522151T DE 69522151 T DE69522151 T DE 69522151T DE 69522151 D1 DE69522151 D1 DE 69522151D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- chip module
- module substrate
- integrated plastic
- enclosed integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/265,051 US5492586A (en) | 1993-10-29 | 1994-06-24 | Method for fabricating encased molded multi-chip module substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69522151D1 true DE69522151D1 (de) | 2001-09-20 |
DE69522151T2 DE69522151T2 (de) | 2001-11-22 |
Family
ID=23008746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69522151T Expired - Fee Related DE69522151T2 (de) | 1994-06-24 | 1995-06-26 | Eingeschlossenes integriertes plastikvergossenes Mehr-Chip-Modul-Substrat und dessen Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5492586A (de) |
EP (1) | EP0689242B1 (de) |
JP (1) | JP3641002B2 (de) |
DE (1) | DE69522151T2 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0172779B1 (ko) * | 1995-03-29 | 1999-03-20 | 김주용 | 감광막 제거 방법 |
US5762853A (en) * | 1996-04-01 | 1998-06-09 | Morton International, Inc. | Method of encapsulating a sensor into a panel body |
DE59706639D1 (de) * | 1996-12-17 | 2002-04-18 | Lab Fuer Physikalische Elektro | Verfahren zum aufbringen eines mikrosystems oder wandlers auf ein substrat und nach diesem verfahren herstellbare vorrichtung |
US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
US6034441A (en) * | 1997-11-26 | 2000-03-07 | Lucent Technologies, Inc. | Overcast semiconductor package |
US6160714A (en) * | 1997-12-31 | 2000-12-12 | Elpac (Usa), Inc. | Molded electronic package and method of preparation |
JP2004506309A (ja) * | 1997-12-31 | 2004-02-26 | エルパック(ユーエスエー)、インコーポレイテッド | モールドされた電子パッケージ、製作方法およびシールディング方法 |
US5888884A (en) * | 1998-01-02 | 1999-03-30 | General Electric Company | Electronic device pad relocation, precision placement, and packaging in arrays |
US6412971B1 (en) | 1998-01-02 | 2002-07-02 | General Electric Company | Light source including an array of light emitting semiconductor devices and control method |
TW420853B (en) * | 1998-07-10 | 2001-02-01 | Siemens Ag | Method of manufacturing the wiring with electric conducting interconnect between the over-side and the underside of the substrate and the wiring with such interconnect |
JP3454748B2 (ja) * | 1999-02-26 | 2003-10-06 | 三洋電機株式会社 | パック電池 |
JP2001168400A (ja) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | ケース付チップ型発光装置およびその製造方法 |
JP3669429B2 (ja) * | 2001-03-27 | 2005-07-06 | 信越化学工業株式会社 | 電極用組成物及び電極材 |
US6601753B2 (en) * | 2001-05-17 | 2003-08-05 | Visteon Global Technologies, Inc. | Void-free die attachment method with low melting metal |
US6748650B2 (en) * | 2001-06-27 | 2004-06-15 | Visteon Global Technologies, Inc. | Method for making a circuit assembly having an integral frame |
US6602739B1 (en) | 2001-10-31 | 2003-08-05 | Lockheed Martin Corporation | Method for making multichip module substrates by encapsulating electrical conductors and filling gaps |
US6737002B1 (en) * | 2002-02-04 | 2004-05-18 | Lockheed Martin Corporation | Fabrication of plastic module with exposed backside contact |
US6756662B2 (en) * | 2002-09-25 | 2004-06-29 | International Business Machines Corporation | Semiconductor chip module and method of manufacture of same |
JP4489411B2 (ja) * | 2003-01-23 | 2010-06-23 | 新光電気工業株式会社 | 電子部品実装構造の製造方法 |
DE10304777B4 (de) * | 2003-02-05 | 2006-11-23 | Infineon Technologies Ag | Verfahren zur Herstellung eines Chipnutzens mittels eines Hitze- und Druckprozesses unter Verwendung eines thermoplastischen Materials und Vorrichtung zur Durchführung des Verfahrens |
US7122404B2 (en) * | 2003-03-11 | 2006-10-17 | Micron Technology, Inc. | Techniques for packaging a multiple device component |
DE10317018A1 (de) * | 2003-04-11 | 2004-11-18 | Infineon Technologies Ag | Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten |
TWI283467B (en) * | 2003-12-31 | 2007-07-01 | Advanced Semiconductor Eng | Multi-chip package structure |
DE102004057494A1 (de) * | 2004-11-29 | 2006-06-08 | Siemens Ag | Metallisierte Folie zur flächigen Kontaktierung |
DE102005002814B3 (de) * | 2005-01-20 | 2006-10-12 | Siemens Ag | Halbleitersensorbauteil mit geschützten Zuleitungen und Verfahren zur Herstellung desselben |
US7741151B2 (en) * | 2008-11-06 | 2010-06-22 | Freescale Semiconductor, Inc. | Integrated circuit package formation |
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US3364567A (en) * | 1965-09-14 | 1968-01-23 | Bell Telephone Labor Inc | Encapsulated electrical device and method of fabricating same |
US4933042A (en) | 1986-09-26 | 1990-06-12 | General Electric Company | Method for packaging integrated circuit chips employing a polymer film overlay layer |
US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
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US5032543A (en) * | 1988-06-17 | 1991-07-16 | Massachusetts Institute Of Technology | Coplanar packaging techniques for multichip circuits |
US4913930A (en) * | 1988-06-28 | 1990-04-03 | Wacker Silicones Corporation | Method for coating semiconductor components on a dielectric film |
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US5041396A (en) * | 1989-07-18 | 1991-08-20 | Vlsi Technology, Inc. | Reusable package for holding a semiconductor chip and method for reusing the package |
JPH03211757A (ja) * | 1989-12-21 | 1991-09-17 | General Electric Co <Ge> | 気密封じの物体 |
US5063177A (en) * | 1990-10-04 | 1991-11-05 | Comsat | Method of packaging microwave semiconductor components and integrated circuits |
US5091769A (en) | 1991-03-27 | 1992-02-25 | Eichelberger Charles W | Configuration for testing and burn-in of integrated circuit chips |
US5149387A (en) * | 1991-05-06 | 1992-09-22 | Administrator Of The National Aeronautics And Space Administration | Flush mounting of thin film sensors |
US5224265A (en) * | 1991-10-29 | 1993-07-06 | International Business Machines Corporation | Fabrication of discrete thin film wiring structures |
-
1994
- 1994-06-24 US US08/265,051 patent/US5492586A/en not_active Expired - Lifetime
-
1995
- 1995-02-14 JP JP04795695A patent/JP3641002B2/ja not_active Expired - Fee Related
- 1995-06-26 EP EP95304460A patent/EP0689242B1/de not_active Expired - Lifetime
- 1995-06-26 DE DE69522151T patent/DE69522151T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69522151T2 (de) | 2001-11-22 |
JPH0817968A (ja) | 1996-01-19 |
JP3641002B2 (ja) | 2005-04-20 |
EP0689242A1 (de) | 1995-12-27 |
US5492586A (en) | 1996-02-20 |
EP0689242B1 (de) | 2001-08-16 |
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