DE69508046D1 - Integrierte halbleiteranordnung - Google Patents

Integrierte halbleiteranordnung

Info

Publication number
DE69508046D1
DE69508046D1 DE69508046T DE69508046T DE69508046D1 DE 69508046 D1 DE69508046 D1 DE 69508046D1 DE 69508046 T DE69508046 T DE 69508046T DE 69508046 T DE69508046 T DE 69508046T DE 69508046 D1 DE69508046 D1 DE 69508046D1
Authority
DE
Germany
Prior art keywords
integrated semiconductor
semiconductor arrangement
arrangement
integrated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69508046T
Other languages
English (en)
Other versions
DE69508046T2 (de
Inventor
Takeo Yasuho
Masao Iwata
Ryoichi Katsuragawa
Hayami Matsunaga
Yoshikazu Suehiro
Yasuhiko Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69508046D1 publication Critical patent/DE69508046D1/de
Publication of DE69508046T2 publication Critical patent/DE69508046T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69508046T 1994-07-04 1995-07-03 Integrierte halbleiteranordnung Expired - Fee Related DE69508046T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15217794 1994-07-04
PCT/JP1995/001326 WO1996001498A1 (en) 1994-07-04 1995-07-03 Integrated circuit device

Publications (2)

Publication Number Publication Date
DE69508046D1 true DE69508046D1 (de) 1999-04-08
DE69508046T2 DE69508046T2 (de) 1999-07-15

Family

ID=15534738

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69508046T Expired - Fee Related DE69508046T2 (de) 1994-07-04 1995-07-03 Integrierte halbleiteranordnung

Country Status (6)

Country Link
US (1) US6303989B1 (de)
EP (1) EP0717443B1 (de)
KR (1) KR100208053B1 (de)
CN (1) CN1037134C (de)
DE (1) DE69508046T2 (de)
WO (1) WO1996001498A1 (de)

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US5864478A (en) * 1996-06-28 1999-01-26 Intel Corporation Power pod/power delivery system
DE59713027D1 (de) 1996-09-30 2010-03-25 Infineon Technologies Ag Mikroelektronisches bauteil in sandwich-bauweise
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6556455B2 (en) 1999-07-15 2003-04-29 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US7085146B2 (en) 1999-12-20 2006-08-01 Synqor, Inc. Flanged terminal pins for DC/DC converters
US6545890B2 (en) 1999-12-20 2003-04-08 Synqor, Inc. Flanged terminal pins for dc/dc converters
US6896526B2 (en) 1999-12-20 2005-05-24 Synqor, Inc. Flanged terminal pins for DC/DC converters
AU2001266551A1 (en) * 2000-02-18 2001-09-12 Incep Technologies, Inc. Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
US6884086B1 (en) 2000-09-28 2005-04-26 Intel Corporation System and method for connecting a power converter to a land grid array socket
US6360431B1 (en) * 2000-09-29 2002-03-26 Intel Corporation Processor power delivery system
DE10107839A1 (de) * 2001-02-16 2002-09-05 Philips Corp Intellectual Pty Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung
AU2003217883A1 (en) * 2002-02-25 2003-09-09 Molex Incorporated Power delivery to base of processor
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
JP4209130B2 (ja) * 2002-04-09 2009-01-14 株式会社ザナヴィ・インフォマティクス 多層モジュール基板
AT500260A1 (de) * 2003-05-08 2005-11-15 Siemens Ag Oesterreich Anordnung von leiterplatten
JP3896112B2 (ja) 2003-12-25 2007-03-22 エルピーダメモリ株式会社 半導体集積回路装置
CN1316608C (zh) * 2004-02-13 2007-05-16 上海三思科技发展有限公司 一种改善led温升的散热针结构
KR101053587B1 (ko) * 2004-06-04 2011-08-03 엘지전자 주식회사 세탁기의 원격제어용 기판 어셈블리
US20060291180A1 (en) * 2005-06-23 2006-12-28 Inventec Corporation PCI mezzanine card
DE102006022107A1 (de) * 2006-05-11 2007-11-15 Siemens Ag Österreich Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger
JP5106460B2 (ja) * 2009-03-26 2012-12-26 新光電気工業株式会社 半導体装置及びその製造方法、並びに電子装置
JP5533787B2 (ja) * 2011-06-09 2014-06-25 株式会社豊田自動織機 放熱装置
US20140211421A1 (en) * 2013-01-29 2014-07-31 Tyco Electronics Corporation Circuit Board Assembly
US9142477B2 (en) * 2013-03-08 2015-09-22 Kabushiki Kaisha Toshiba Semiconductor module
US10031864B2 (en) * 2013-03-15 2018-07-24 Seagate Technology Llc Integrated circuit
US10331161B2 (en) * 2014-12-24 2019-06-25 Fujitsu Limited Power supply board
CN208538435U (zh) * 2018-08-01 2019-02-22 京东方科技集团股份有限公司 一种显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4120041A (en) * 1975-12-05 1978-10-10 Sharp Kabushiki Kaisha Semiconductor device for use in an electronic apparatus having a plurality of circuit boards
JPH0487361A (ja) * 1990-07-31 1992-03-19 Sanyo Electric Co Ltd 混成集積回路装置
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
JPH05102390A (ja) * 1991-10-08 1993-04-23 Nec Corp ハイブリツドｉｃ
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JP2936855B2 (ja) * 1991-12-26 1999-08-23 富士電機株式会社 電力用半導体装置
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5266912A (en) * 1992-08-19 1993-11-30 Micron Technology, Inc. Inherently impedance matched multiple integrated circuit module
JPH06151702A (ja) * 1992-11-09 1994-05-31 Nec Corp マルチチップモジュール
US5426263A (en) * 1993-12-23 1995-06-20 Motorola, Inc. Electronic assembly having a double-sided leadless component
US5469330A (en) * 1994-02-14 1995-11-21 Karabatsos; Chris Heat sink header assembly

Also Published As

Publication number Publication date
KR960705363A (ko) 1996-10-09
US6303989B1 (en) 2001-10-16
DE69508046T2 (de) 1999-07-15
KR100208053B1 (ko) 1999-07-15
CN1037134C (zh) 1998-01-21
CN1130441A (zh) 1996-09-04
WO1996001498A1 (en) 1996-01-18
EP0717443B1 (de) 1999-03-03
EP0717443A1 (de) 1996-06-19
EP0717443A4 (de) 1997-12-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee