DE69507284D1 - Halbleiter mit einem träger auf dem ein substrat mit einem halbleiter-element mittels einer klebeschicht und ein leiterbahn-muster befestigt sind - Google Patents

Halbleiter mit einem träger auf dem ein substrat mit einem halbleiter-element mittels einer klebeschicht und ein leiterbahn-muster befestigt sind

Info

Publication number
DE69507284D1
DE69507284D1 DE69507284T DE69507284T DE69507284D1 DE 69507284 D1 DE69507284 D1 DE 69507284D1 DE 69507284 T DE69507284 T DE 69507284T DE 69507284 T DE69507284 T DE 69507284T DE 69507284 D1 DE69507284 D1 DE 69507284D1
Authority
DE
Germany
Prior art keywords
pattern
semiconductors
fastened
carrier
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69507284T
Other languages
English (en)
Other versions
DE69507284T2 (de
Inventor
Ronald Dekker
Henricus Maas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE69507284D1 publication Critical patent/DE69507284D1/de
Publication of DE69507284T2 publication Critical patent/DE69507284T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4825—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices, i.e. SOS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Element Separation (AREA)
DE69507284T 1994-11-22 1995-10-16 Halbleiter mit einem träger auf dem ein substrat mit einem halbleiter-element mittels einer klebeschicht und ein leiterbahn-muster befestigt sind Expired - Lifetime DE69507284T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94203386 1994-11-22
PCT/IB1995/000879 WO1996016443A1 (en) 1994-11-22 1995-10-16 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened

Publications (2)

Publication Number Publication Date
DE69507284D1 true DE69507284D1 (de) 1999-02-25
DE69507284T2 DE69507284T2 (de) 1999-07-01

Family

ID=8217398

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507284T Expired - Lifetime DE69507284T2 (de) 1994-11-22 1995-10-16 Halbleiter mit einem träger auf dem ein substrat mit einem halbleiter-element mittels einer klebeschicht und ein leiterbahn-muster befestigt sind

Country Status (6)

Country Link
US (1) US5739591A (de)
EP (1) EP0740853B1 (de)
JP (1) JP4319251B2 (de)
KR (1) KR100389754B1 (de)
DE (1) DE69507284T2 (de)
WO (1) WO1996016443A1 (de)

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DE69707077T2 (de) * 1996-03-12 2002-06-06 Koninkl Philips Electronics Nv Halbleiterkörper mit einem substrat auf einen trägerkörper geklebt
JPH11261010A (ja) * 1998-03-13 1999-09-24 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2002543591A (ja) 1999-04-23 2002-12-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 本体がソフトフェライト材料を有する動作周波数が５０ＭＨｚより高い半導体装置
EP1118118A1 (de) * 1999-06-29 2001-07-25 Koninklijke Philips Electronics N.V. Halbleiter gegenstand
US6580107B2 (en) * 2000-10-10 2003-06-17 Sanyo Electric Co., Ltd. Compound semiconductor device with depletion layer stop region
WO2003019653A2 (de) 2001-08-24 2003-03-06 Schott Glas Verfahren zum kontaktieren und gehäusen von integrierten schaltungen
JP2005503671A (ja) * 2001-09-18 2005-02-03 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Ｘ線を用いて半導体材料のウェハを検査する方法
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US9029341B2 (en) 2010-08-17 2015-05-12 Sirna Therapeutics, Inc. RNA interference mediated inhibition of hepatitis B virus (HBV) gene expression using short interfering nucleic acid (siNA)
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DE69507284T2 (de) 1999-07-01
EP0740853A1 (de) 1996-11-06
WO1996016443A1 (en) 1996-05-30
JP4319251B2 (ja) 2009-08-26
EP0740853B1 (de) 1999-01-13
US5739591A (en) 1998-04-14

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