DE69329883D1 - Wässrige, Ammoniak enthaltende, Zusammensetzung für die Reinigung von Halbleitersubstraten - Google Patents

Wässrige, Ammoniak enthaltende, Zusammensetzung für die Reinigung von Halbleitersubstraten

Info

Publication number
DE69329883D1
DE69329883D1 DE69329883T DE69329883T DE69329883D1 DE 69329883 D1 DE69329883 D1 DE 69329883D1 DE 69329883 T DE69329883 T DE 69329883T DE 69329883 T DE69329883 T DE 69329883T DE 69329883 D1 DE69329883 D1 DE 69329883D1
Authority
DE
Germany
Prior art keywords
ammonia
aqueous
containing composition
semiconductor substrates
cleaning semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69329883T
Other languages
English (en)
Other versions
DE69329883T2 (de
Inventor
Fumihiro Morikawa
Akihisa Yoshikawa
Norio Ishikawa
Takao Shihoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Nissan Chemical Corp
Original Assignee
Kanto Chemical Co Inc
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc, Nissan Chemical Corp filed Critical Kanto Chemical Co Inc
Application granted granted Critical
Publication of DE69329883D1 publication Critical patent/DE69329883D1/de
Publication of DE69329883T2 publication Critical patent/DE69329883T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D10/00—Compositions of detergents, not provided for by one single preceding group

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE69329883T 1992-03-06 1993-03-05 Wässrige, Ammoniak enthaltende, Zusammensetzung für die Reinigung von Halbleitersubstraten Expired - Fee Related DE69329883T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09751692A JP3217116B2 (ja) 1992-03-06 1992-03-06 低表面張力洗浄用組成物

Publications (2)

Publication Number Publication Date
DE69329883D1 true DE69329883D1 (de) 2001-03-01
DE69329883T2 DE69329883T2 (de) 2001-08-02

Family

ID=14194426

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329883T Expired - Fee Related DE69329883T2 (de) 1992-03-06 1993-03-05 Wässrige, Ammoniak enthaltende, Zusammensetzung für die Reinigung von Halbleitersubstraten

Country Status (5)

Country Link
US (1) US5580847A (de)
EP (1) EP0561236B1 (de)
JP (1) JP3217116B2 (de)
KR (1) KR100250002B1 (de)
DE (1) DE69329883T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217116B2 (ja) * 1992-03-06 2001-10-09 日産化学工業株式会社 低表面張力洗浄用組成物
JPH08195369A (ja) * 1995-01-13 1996-07-30 Daikin Ind Ltd 基板の洗浄方法
RU2052868C1 (ru) * 1995-02-03 1996-01-20 Акционерное общество "Научно-производственное предприятие "Сапфир" Состав раствора для очистки поверхности (типа "полифункционал")
JP3923097B2 (ja) * 1995-03-06 2007-05-30 忠弘 大見 洗浄装置
AU7040698A (en) 1997-07-10 1999-02-08 Merck Patent Gmbh Solutions for cleaning silicon semiconductors or silicon oxides
KR100415261B1 (ko) * 1998-03-26 2004-03-26 이기원 전자표시장치및기판용세정및식각조성물
US6248704B1 (en) 1999-05-03 2001-06-19 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductors devices
TWI276682B (en) 2001-11-16 2007-03-21 Mitsubishi Chem Corp Substrate surface cleaning liquid mediums and cleaning method
US6949411B1 (en) * 2001-12-27 2005-09-27 Lam Research Corporation Method for post-etch and strip residue removal on coral films
US7294610B2 (en) 2004-03-03 2007-11-13 3M Innovative Properties Company Fluorinated sulfonamide surfactants for aqueous cleaning solutions
US20100160458A1 (en) * 2008-12-23 2010-06-24 3M Innovative Properties Company Method of making a composition and aqueous composition preparable thereby
WO2010074878A1 (en) * 2008-12-23 2010-07-01 3M Innovative Properties Company Aqueous composition containing fluorinated sulfonamide and sulfonamidate compounds
US8258341B2 (en) 2009-07-10 2012-09-04 E.I. Du Pont De Nemours And Company Polyfluorosulfonamido amine and intermediate
US8779196B2 (en) * 2010-03-25 2014-07-15 E I Du Pont De Nemours And Company Polyfluoroalkylsulfonamido alkyl halide intermediate
US9168408B2 (en) * 2010-03-25 2015-10-27 The Chemours Company Fc, Llc Surfactant composition from polyfluoroalkylsulfonamido alkyl amines
US8729138B2 (en) * 2010-03-25 2014-05-20 E I Du Pont De Nemours And Company Mixture of polyfluoroalkylsulfonamido alkyl amines
CN103717706B (zh) 2011-08-10 2015-09-23 3M创新有限公司 用于光致抗蚀剂冲洗剂溶液的全氟烷基磺酰胺表面活性剂
EP2951217B1 (de) * 2013-01-29 2017-08-16 3M Innovative Properties Company Tenside und verfahren zur herstellung und verwendung davon
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2877267A (en) * 1956-06-18 1959-03-10 Minnesota Mining & Mfg Polyfluorinated sulfonic acids and derivatives
US2937098A (en) * 1958-09-18 1960-05-17 Simoniz Co Liquid polishing composition driable to a bright coating
US3741914A (en) * 1969-06-26 1973-06-26 Procter & Gamble Cleaning polishing composition
US3900508A (en) * 1969-10-17 1975-08-19 Bayer Ag Perfluoroalkylsulfonic acid aminophenyl esters
DE1952387C3 (de) * 1969-10-17 1975-01-23 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von PerfhioralkylsulfonsSurearylestern
US3901727A (en) * 1971-03-08 1975-08-26 Minnesota Mining & Mfg Process and composition for cleaning and imparting water and oil repellency and stain resistance to a substrate
NL171267C (nl) * 1975-12-19 Ciba Geigy Werkwijze voor het bereiden van gefluoreerde sulfonzuren en zouten daarvan, alsmede werkwijze voor het bereiden van samenstellingen, die deze verbindingen bevatten.
US4299749A (en) * 1980-06-30 1981-11-10 Sterling Drug Inc. Floor coating composition
KR900001065B1 (ko) * 1987-09-30 1990-02-26 삼성전자 주식회사 실리콘 반도체 장치의 표면 메탈증착전 처리방법
JP2894717B2 (ja) * 1989-03-15 1999-05-24 日産化学工業株式会社 低表面張力硫酸組成物
JP2801635B2 (ja) * 1989-04-26 1998-09-21 川崎製鉄株式会社 高振動減衰能を有する高じん性溶接構造用鋼材
JP3217116B2 (ja) * 1992-03-06 2001-10-09 日産化学工業株式会社 低表面張力洗浄用組成物

Also Published As

Publication number Publication date
DE69329883T2 (de) 2001-08-02
EP0561236B1 (de) 2001-01-24
KR100250002B1 (ko) 2000-03-15
KR930019812A (ko) 1993-10-19
EP0561236A1 (de) 1993-09-22
US5580847A (en) 1996-12-03
JPH05251416A (ja) 1993-09-28
JP3217116B2 (ja) 2001-10-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee