DE69318239T2 - Halbleiterbauelement mit planarer Grenzfläche - Google Patents
Halbleiterbauelement mit planarer GrenzflächeInfo
- Publication number
- DE69318239T2 DE69318239T2 DE69318239T DE69318239T DE69318239T2 DE 69318239 T2 DE69318239 T2 DE 69318239T2 DE 69318239 T DE69318239 T DE 69318239T DE 69318239 T DE69318239 T DE 69318239T DE 69318239 T2 DE69318239 T2 DE 69318239T2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- region
- breakdown voltage
- semiconductor region
- closest
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 68
- 239000004020 conductor Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 14
- 230000015556 catabolic process Effects 0.000 description 67
- 230000005684 electric field Effects 0.000 description 20
- 238000012360 testing method Methods 0.000 description 18
- 150000002500 ions Chemical class 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000009825 accumulation Methods 0.000 description 9
- 239000005360 phosphosilicate glass Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000028161 membrane depolarization Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0688—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions characterised by the particular shape of a junction between semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/408—Electrodes ; Multistep manufacturing processes therefor with an insulating layer with a particular dielectric or electrostatic property, e.g. with static charges or for controlling trapped charges or moving ions, or with a plate acting on the insulator potential or the insulator charges, e.g. for controlling charges effect or potential distribution in the insulating layer, or with a semi-insulating layer contacting directly the semiconductor surface
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
- H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Thyristors (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4247547A JP2812093B2 (ja) | 1992-09-17 | 1992-09-17 | プレーナ接合を有する半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69318239D1 DE69318239D1 (de) | 1998-06-04 |
DE69318239T2 true DE69318239T2 (de) | 1998-10-22 |
Family
ID=17165123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69318239T Expired - Lifetime DE69318239T2 (de) | 1992-09-17 | 1993-09-15 | Halbleiterbauelement mit planarer Grenzfläche |
Country Status (5)
Country | Link |
---|---|
US (1) | US5804868A (ja) |
EP (1) | EP0588320B1 (ja) |
JP (1) | JP2812093B2 (ja) |
KR (1) | KR940007968A (ja) |
DE (1) | DE69318239T2 (ja) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3111827B2 (ja) * | 1994-09-20 | 2000-11-27 | 株式会社日立製作所 | 半導体装置及びそれを使った電力変換装置 |
DE19606983C2 (de) * | 1996-02-24 | 2000-01-20 | Semikron Elektronik Gmbh | Leistungshalbleiterbauelement mit planarem Aufbau |
JPH1032313A (ja) * | 1996-07-17 | 1998-02-03 | Toshiba Corp | 半導体装置とその製造方法 |
KR100415189B1 (ko) * | 1997-01-10 | 2004-03-19 | 페어차일드코리아반도체 주식회사 | 전계제한환을 가지는 바이폴라트랜지스터 |
FR2784801B1 (fr) * | 1998-10-19 | 2000-12-22 | St Microelectronics Sa | Composant de puissance portant des interconnexions |
FR2785090B1 (fr) | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Composant de puissance portant des interconnexions |
GB2373634B (en) * | 2000-10-31 | 2004-12-08 | Fuji Electric Co Ltd | Semiconductor device |
US6927988B2 (en) * | 2002-05-28 | 2005-08-09 | Ballard Power Systems Corporation | Method and apparatus for measuring fault diagnostics on insulated gate bipolar transistor converter circuits |
US8093652B2 (en) * | 2002-08-28 | 2012-01-10 | Ixys Corporation | Breakdown voltage for power devices |
DE102004017723B4 (de) | 2003-04-10 | 2011-12-08 | Fuji Electric Co., Ltd | In Rückwärtsrichtung sperrendes Halbleiterbauteil und Verfahren zu seiner Herstellung |
JP4469584B2 (ja) | 2003-09-12 | 2010-05-26 | 株式会社東芝 | 半導体装置 |
JP4202970B2 (ja) * | 2004-06-10 | 2008-12-24 | 株式会社東芝 | 半導体装置及びその製造方法、半導体装置の欠陥検出方法 |
EP1722423B1 (en) * | 2005-05-12 | 2016-07-06 | Ixys Corporation | Stable diodes for low and high frequency applications |
JP5225549B2 (ja) * | 2006-03-15 | 2013-07-03 | 日本碍子株式会社 | 半導体素子 |
US8110888B2 (en) | 2007-09-18 | 2012-02-07 | Microsemi Corporation | Edge termination for high voltage semiconductor device |
JP5381420B2 (ja) * | 2008-07-22 | 2014-01-08 | 富士電機株式会社 | 半導体装置 |
JP5477681B2 (ja) | 2008-07-29 | 2014-04-23 | 三菱電機株式会社 | 半導体装置 |
JP5195186B2 (ja) * | 2008-09-05 | 2013-05-08 | 三菱電機株式会社 | 半導体装置の製造方法 |
US8350352B2 (en) * | 2009-11-02 | 2013-01-08 | Analog Devices, Inc. | Bipolar transistor |
JP5543758B2 (ja) | 2009-11-19 | 2014-07-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5719167B2 (ja) | 2010-12-28 | 2015-05-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5660959B2 (ja) * | 2011-03-31 | 2015-01-28 | 本田技研工業株式会社 | 受光装置 |
JP5635937B2 (ja) | 2011-03-31 | 2014-12-03 | 本田技研工業株式会社 | 固体撮像装置 |
JP5635938B2 (ja) | 2011-03-31 | 2014-12-03 | 本田技研工業株式会社 | 固体撮像装置 |
JP5829036B2 (ja) | 2011-03-31 | 2015-12-09 | 本田技研工業株式会社 | 単位画素の信号加算方法 |
CN102354703B (zh) * | 2011-10-19 | 2013-01-23 | 扬州杰利半导体有限公司 | 一种平面结构型超高压二极管芯片 |
CN102956685B (zh) * | 2011-10-19 | 2015-05-20 | 扬州杰利半导体有限公司 | 一种耐高温平面结构型超高压二极管芯片 |
CN102610635B (zh) * | 2012-03-26 | 2014-04-02 | 大连理工大学 | 一种高密度缓变场限环结构及其制造工艺 |
JP6089733B2 (ja) * | 2013-01-30 | 2017-03-08 | 富士電機株式会社 | 半導体装置 |
DE112013006681B4 (de) * | 2013-02-15 | 2022-01-20 | Denso Corporation | Halbleitervorrichtung |
CN104332403A (zh) * | 2013-07-22 | 2015-02-04 | 无锡华润上华半导体有限公司 | 半导体功率器件及其制造方法 |
DE102016120300A1 (de) * | 2016-10-25 | 2018-04-26 | Infineon Technologies Austria Ag | Hochspannungsabschlussstruktur einer Leistungshalbleitervorrichtung |
JP6637012B2 (ja) * | 2016-11-10 | 2020-01-29 | ローム株式会社 | 半導体装置 |
WO2018095870A1 (en) * | 2016-11-24 | 2018-05-31 | Abb Schweiz Ag | Power semiconductor device with floating field ring termination |
CN107579057A (zh) * | 2017-09-14 | 2018-01-12 | 全球能源互联网研究院 | 能进行终端横向耐压测试的igbt版图 |
WO2020231304A1 (en) * | 2019-05-14 | 2020-11-19 | Prismatic Sensors Ab | X-ray sensor having a field limiting ring configuration |
JPWO2023120715A1 (ja) * | 2021-12-23 | 2023-06-29 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6904619A (ja) * | 1969-03-25 | 1970-09-29 | ||
JPS5227032A (en) * | 1975-08-28 | 1977-03-01 | Kurita Industrial Co Ltd | Anticorrosive for metals |
JPS553826A (en) * | 1978-06-26 | 1980-01-11 | Asahi Chem Ind Co Ltd | Filter element |
JPS5521339A (en) * | 1978-07-31 | 1980-02-15 | Mitsubishi Heavy Ind Ltd | Quaywall freight handling facility |
DE2834724A1 (de) * | 1978-08-08 | 1980-02-14 | Siemens Ag | Mos-feldeffekttransistoren fuer hoehere spannungen |
JPS56103463A (en) * | 1980-01-21 | 1981-08-18 | Nippon Denso Co Ltd | Semiconductor device of high withstand voltage planar type |
JPS57160159A (en) * | 1981-03-28 | 1982-10-02 | Toshiba Corp | High breakdown voltage planar type semiconductor device |
GB2131603B (en) * | 1982-12-03 | 1985-12-18 | Philips Electronic Associated | Semiconductor devices |
JPS61135158A (ja) * | 1984-12-06 | 1986-06-23 | Nec Corp | 高耐圧半導体装置 |
JPS61158177A (ja) * | 1984-12-28 | 1986-07-17 | Toshiba Corp | 半導体装置 |
JPS63164362A (ja) * | 1986-12-26 | 1988-07-07 | Toshiba Corp | 半導体装置 |
JPH0358185A (ja) * | 1989-07-27 | 1991-03-13 | Tamura Electric Works Ltd | カードリーダのカード搬送機構 |
US5032878A (en) * | 1990-01-02 | 1991-07-16 | Motorola, Inc. | High voltage planar edge termination using a punch-through retarding implant |
JPH03222475A (ja) * | 1990-01-29 | 1991-10-01 | Matsushita Electron Corp | 半導体装置 |
JPH04127540A (ja) * | 1990-09-19 | 1992-04-28 | Nec Corp | 絶縁ゲート電界効果トランジスタ |
-
1992
- 1992-09-17 JP JP4247547A patent/JP2812093B2/ja not_active Expired - Lifetime
-
1993
- 1993-04-22 KR KR1019930006765A patent/KR940007968A/ko not_active Application Discontinuation
- 1993-09-15 DE DE69318239T patent/DE69318239T2/de not_active Expired - Lifetime
- 1993-09-15 EP EP93114845A patent/EP0588320B1/en not_active Expired - Lifetime
-
1996
- 1996-02-13 US US08/600,459 patent/US5804868A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0697469A (ja) | 1994-04-08 |
EP0588320A3 (en) | 1994-09-21 |
KR940007968A (ko) | 1994-04-28 |
US5804868A (en) | 1998-09-08 |
EP0588320A2 (en) | 1994-03-23 |
JP2812093B2 (ja) | 1998-10-15 |
DE69318239D1 (de) | 1998-06-04 |
EP0588320B1 (en) | 1998-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |