DE69316858D1 - Nichtflüchtige Halbleiteranordnung und Verfahren zur ihrer Herstellung - Google Patents

Nichtflüchtige Halbleiteranordnung und Verfahren zur ihrer Herstellung

Info

Publication number
DE69316858D1
DE69316858D1 DE69316858T DE69316858T DE69316858D1 DE 69316858 D1 DE69316858 D1 DE 69316858D1 DE 69316858 T DE69316858 T DE 69316858T DE 69316858 T DE69316858 T DE 69316858T DE 69316858 D1 DE69316858 D1 DE 69316858D1
Authority
DE
Germany
Prior art keywords
manufacture
semiconductor device
volatile semiconductor
volatile
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69316858T
Other languages
English (en)
Other versions
DE69316858T2 (de
Inventor
Takeshi Okazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69316858D1 publication Critical patent/DE69316858D1/de
Publication of DE69316858T2 publication Critical patent/DE69316858T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42324Gate electrodes for transistors with a floating gate
    • H01L29/42336Gate electrodes for transistors with a floating gate with one gate at least partly formed in a trench
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7884Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885Hot carrier injection from the channel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
DE69316858T 1992-11-26 1993-11-25 Nichtflüchtige Halbleiteranordnung und Verfahren zur ihrer Herstellung Expired - Fee Related DE69316858T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4337880A JP2819975B2 (ja) 1992-11-26 1992-11-26 不揮発性半導体記憶装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69316858D1 true DE69316858D1 (de) 1998-03-12
DE69316858T2 DE69316858T2 (de) 1998-05-20

Family

ID=18312865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69316858T Expired - Fee Related DE69316858T2 (de) 1992-11-26 1993-11-25 Nichtflüchtige Halbleiteranordnung und Verfahren zur ihrer Herstellung

Country Status (5)

Country Link
US (1) US5371704A (de)
EP (1) EP0601747B1 (de)
JP (1) JP2819975B2 (de)
KR (1) KR0122090B1 (de)
DE (1) DE69316858T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254651A (ja) * 1994-03-16 1995-10-03 Toshiba Corp 半導体集積回路装置
US5675161A (en) * 1995-03-28 1997-10-07 Thomas; Mammen Channel accelerated tunneling electron cell, with a select region incorporated, for high density low power applications
US6096604A (en) * 1999-08-04 2000-08-01 Chartered Semiconductor Manufacturing Ltd Production of reversed flash memory device
US6894343B2 (en) 2001-05-18 2005-05-17 Sandisk Corporation Floating gate memory cells utilizing substrate trenches to scale down their size
US6936887B2 (en) 2001-05-18 2005-08-30 Sandisk Corporation Non-volatile memory cells utilizing substrate trenches
US6794236B1 (en) * 2002-06-03 2004-09-21 Lattice Semiconductor Corporation Eeprom device with improved capacitive coupling and fabrication process
KR100591147B1 (ko) 2003-10-23 2006-06-19 동부일렉트로닉스 주식회사 플래쉬 메모리 및 그 제조 방법
KR100594307B1 (ko) * 2004-12-24 2006-06-30 삼성전자주식회사 매몰된 컨트롤 게이트를 갖는 불휘발성 메모리 소자 및 그제조방법
DE102006035949B4 (de) * 2006-07-31 2009-11-26 Bruker Biospin Ag Vorrichtung und Verfahren zur Kompensation von Magnetfeldstörungen in Magnetfeldern mit hoher Feldhomogenität
US7696044B2 (en) * 2006-09-19 2010-04-13 Sandisk Corporation Method of making an array of non-volatile memory cells with floating gates formed of spacers in substrate trenches
US7646054B2 (en) * 2006-09-19 2010-01-12 Sandisk Corporation Array of non-volatile memory cells with floating gates formed of spacers in substrate trenches
US7642160B2 (en) * 2006-12-21 2010-01-05 Sandisk Corporation Method of forming a flash NAND memory cell array with charge storage elements positioned in trenches
US7800161B2 (en) * 2006-12-21 2010-09-21 Sandisk Corporation Flash NAND memory cell array with charge storage elements positioned in trenches

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660819A (en) * 1970-06-15 1972-05-02 Intel Corp Floating gate transistor and method for charging and discharging same
JPS6276563A (ja) * 1985-09-28 1987-04-08 Nippon Denso Co Ltd 不揮発性半導体記憶装置
JPH07120717B2 (ja) * 1986-05-19 1995-12-20 日本電気株式会社 半導体記憶装置の製造方法
US4864374A (en) * 1987-11-30 1989-09-05 Texas Instruments Incorporated Two-transistor dram cell with high alpha particle immunity
JPH031574A (ja) * 1989-05-29 1991-01-08 Hitachi Ltd 不揮発性半導体記憶装置およびその製造方法
US5053842A (en) * 1990-05-30 1991-10-01 Seiko Instruments Inc. Semiconductor nonvolatile memory
JPH04111470A (ja) * 1990-08-31 1992-04-13 Oki Electric Ind Co Ltd 不揮発性半導体装置の製造方法

Also Published As

Publication number Publication date
EP0601747A2 (de) 1994-06-15
EP0601747A3 (de) 1995-01-18
KR940012640A (ko) 1994-06-24
DE69316858T2 (de) 1998-05-20
JPH06163925A (ja) 1994-06-10
EP0601747B1 (de) 1998-02-04
US5371704A (en) 1994-12-06
JP2819975B2 (ja) 1998-11-05
KR0122090B1 (en) 1997-11-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee