DE69203919T2 - Verfahren und Gerät zur Behandlung einer Oberfläche. - Google Patents

Verfahren und Gerät zur Behandlung einer Oberfläche.

Info

Publication number
DE69203919T2
DE69203919T2 DE69203919T DE69203919T DE69203919T2 DE 69203919 T2 DE69203919 T2 DE 69203919T2 DE 69203919 T DE69203919 T DE 69203919T DE 69203919 T DE69203919 T DE 69203919T DE 69203919 T2 DE69203919 T2 DE 69203919T2
Authority
DE
Germany
Prior art keywords
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69203919T
Other languages
English (en)
Other versions
DE69203919D1 (de
Inventor
Yukihiro Fusano
Masato Yoshikawa
Satiko Okazaki
Kazuo Naito
Masuhiro Kogoma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bridgestone Corp
Original Assignee
Bridgestone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bridgestone Corp filed Critical Bridgestone Corp
Application granted granted Critical
Publication of DE69203919D1 publication Critical patent/DE69203919D1/de
Publication of DE69203919T2 publication Critical patent/DE69203919T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018—Glow discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/47—Generating plasma using corona discharges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/336—Changing physical properties of treated surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Drying Of Semiconductors (AREA)
DE69203919T 1991-04-12 1992-04-13 Verfahren und Gerät zur Behandlung einer Oberfläche. Expired - Fee Related DE69203919T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10847091 1991-04-12
JP09707292A JP3206095B2 (ja) 1991-04-12 1992-03-24 表面処理方法及びその装置

Publications (2)

Publication Number Publication Date
DE69203919D1 DE69203919D1 (de) 1995-09-14
DE69203919T2 true DE69203919T2 (de) 1996-03-21

Family

ID=26438276

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203919T Expired - Fee Related DE69203919T2 (de) 1991-04-12 1992-04-13 Verfahren und Gerät zur Behandlung einer Oberfläche.

Country Status (4)

Country Link
US (1) US5225659A (de)
EP (1) EP0508833B1 (de)
JP (1) JP3206095B2 (de)
DE (1) DE69203919T2 (de)

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JP2811820B2 (ja) * 1989-10-30 1998-10-15 株式会社ブリヂストン シート状物の連続表面処理方法及び装置
US5425832A (en) * 1990-10-05 1995-06-20 Bridgestone Corporation Surface treatment of fluoropolymer members and preparation of composite products therefrom
US5316739A (en) * 1991-08-20 1994-05-31 Bridgestone Corporation Method and apparatus for surface treatment
FR2692598B1 (fr) * 1992-06-17 1995-02-10 Air Liquide Procédé de dépôt d'un film contenant du silicium à la surface d'un substrat métallique et procédé de traitement anti-corrosion.
US5686050A (en) * 1992-10-09 1997-11-11 The University Of Tennessee Research Corporation Method and apparatus for the electrostatic charging of a web or film
FR2697456B1 (fr) * 1992-10-30 1994-12-23 Air Liquide Procédé et dispositif de fluxage par voie sèche.
WO1994022628A1 (en) * 1993-04-05 1994-10-13 Seiko Epson Corporation Combining method and apparatus using solder
US6007637A (en) * 1993-06-11 1999-12-28 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process and apparatus for the dry treatment of metal surfaces
FR2713670B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de traitement de surfaces métalliques par voie sèche.
JP3312377B2 (ja) * 1993-12-09 2002-08-05 セイコーエプソン株式会社 ろう材による接合方法及び装置
WO1995018249A1 (fr) 1993-12-24 1995-07-06 Seiko Epson Corporation Procede et appareil de traitement d'une surface au plasma sous pression atmospherique, procede de production d'un dispositif a semi-conducteurs et procede de production d'une tete d'imprimante a jet d'encre
US6006763A (en) * 1995-01-11 1999-12-28 Seiko Epson Corporation Surface treatment method
JPH08279495A (ja) * 1995-02-07 1996-10-22 Seiko Epson Corp プラズマ処理装置及びその方法
JP3521587B2 (ja) * 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
US5955174A (en) * 1995-03-28 1999-09-21 The University Of Tennessee Research Corporation Composite of pleated and nonwoven webs
US6086710A (en) * 1995-04-07 2000-07-11 Seiko Epson Corporation Surface treatment apparatus
AU715719B2 (en) * 1995-06-19 2000-02-10 University Of Tennessee Research Corporation, The Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith
JP3598602B2 (ja) * 1995-08-07 2004-12-08 セイコーエプソン株式会社 プラズマエッチング方法、液晶表示パネルの製造方法、及びプラズマエッチング装置
JPH09233862A (ja) * 1995-12-18 1997-09-05 Seiko Epson Corp 圧電体を用いた発電方法、発電装置および電子機器
JPH09312545A (ja) 1996-03-18 1997-12-02 Seiko Epson Corp 圧電素子、その製造方法、及び圧電振動片のマウント装置
US5918354A (en) * 1996-04-02 1999-07-06 Seiko Epson Corporation Method of making a piezoelectric element
SE516336C2 (sv) * 1999-04-28 2001-12-17 Hana Barankova Apparat för plasmabehandling av ytor
US6936546B2 (en) * 2002-04-26 2005-08-30 Accretech Usa, Inc. Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
US7288204B2 (en) * 2002-07-19 2007-10-30 Fuji Photo Film B.V. Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG)
US7431989B2 (en) * 2003-05-06 2008-10-07 Tribofilm Research, Inc. Article with lubricated surface and method
US20060162741A1 (en) * 2005-01-26 2006-07-27 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects with plasma
US20060272674A1 (en) * 2005-06-02 2006-12-07 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
US8366871B2 (en) * 2003-06-16 2013-02-05 Ionfield Holdings, Llc Method and apparatus for cleaning and surface conditioning objects using plasma
US20060272675A1 (en) * 2005-06-02 2006-12-07 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
US20060162740A1 (en) * 2005-01-21 2006-07-27 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using non-equilibrium atmospheric pressure plasma
US8092644B2 (en) * 2003-06-16 2012-01-10 Ionfield Systems, Llc Method and apparatus for cleaning and surface conditioning objects using plasma
JP2006527656A (ja) * 2003-06-16 2006-12-07 セリオンクス・インコーポレイテッド プローブ、カニューレ、ピンツール、ピペット、スプレーヘッドの表面を洗浄及び殺菌するための大気圧非熱的プラズマ装置
US8092643B2 (en) * 2003-06-16 2012-01-10 Ionfield Systems, Llc Method and apparatus for cleaning and surface conditioning objects using plasma
US7737382B2 (en) * 2004-04-01 2010-06-15 Lincoln Global, Inc. Device for processing welding wire
WO2006091285A2 (en) * 2005-01-20 2006-08-31 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
EP1689216A1 (de) * 2005-02-04 2006-08-09 Vlaamse Instelling Voor Technologisch Onderzoek (Vito) Plasmastrahl unter atmosphärischem Druck
US20060237030A1 (en) * 2005-04-22 2006-10-26 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects with plasma
US8084103B2 (en) * 2006-08-15 2011-12-27 Sakhrani Vinay G Method for treating a hydrophilic surface
US9005755B2 (en) 2007-01-03 2015-04-14 Applied Nanostructured Solutions, Llc CNS-infused carbon nanomaterials and process therefor
US8951632B2 (en) 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused carbon fiber materials and process therefor
US8951631B2 (en) * 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused metal fiber materials and process therefor
US20090081383A1 (en) * 2007-09-20 2009-03-26 Lockheed Martin Corporation Carbon Nanotube Infused Composites via Plasma Processing
CN102333906B (zh) 2009-02-27 2015-03-11 应用纳米结构方案公司 使用气体预热法的低温cnt生长
US20100227134A1 (en) 2009-03-03 2010-09-09 Lockheed Martin Corporation Method for the prevention of nanoparticle agglomeration at high temperatures
US20100260998A1 (en) * 2009-04-10 2010-10-14 Lockheed Martin Corporation Fiber sizing comprising nanoparticles
JP4957746B2 (ja) * 2009-04-13 2012-06-20 株式会社デンソー プラズマ発生装置
JP5823393B2 (ja) 2009-08-03 2015-11-25 アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニーＡｐｐｌｉｅｄ Ｎａｎｏｓｔｒｕｃｔｕｒｅｄｓｏｌｕｔｉｏｎｓ， Ｌｌｃ 複合繊維へのナノ粒子の組み込み
WO2012037042A1 (en) 2010-09-14 2012-03-22 Applied Nanostructured Solutions, Llc Glass substrates having carbon nanotubes grown thereon and methods for production thereof
WO2012040004A1 (en) 2010-09-22 2012-03-29 Applied Nanostructured Solutions, Llc Carbon fiber substrates having carbon nanotubes grown thereon and processes for production thereof
WO2012058456A2 (en) 2010-10-27 2012-05-03 University Of Florida Research Foundation, Inc. Method and apparatus for disinfecting and/or self-sterilizing a stethoscope using plasma energy
US9133412B2 (en) 2012-07-09 2015-09-15 Tribofilm Research, Inc. Activated gaseous species for improved lubrication
TW201507735A (zh) 2013-08-16 2015-03-01 Ind Tech Res Inst 電漿產生裝置、應用其之表面處理方法與生物組織表面處理方法
LU93221B1 (en) * 2016-09-15 2018-04-11 Luxembourg Inst Science & Tech List Device for performing atmospheric pressure plasma enhanced chemical vapour deposition at low temperature
US11863040B2 (en) * 2018-05-21 2024-01-02 The Research Foundation For Suny Electrohydrodynamic rotary systems and related methods

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US5099100A (en) * 1974-08-16 1992-03-24 Branson International Plasma Corporation Plasma etching device and process
NL7806452A (nl) * 1978-06-14 1979-12-18 Tno Werkwijze voor de behandeling van aromatische polya- midevezels, die geschikt zijn voor gebruik in construc- tiematerialen en rubbers, alsmede aldus behandelde vezels en met deze vezels gewapende gevormde voort- brengsels.
JPS6056431B2 (ja) * 1980-10-09 1985-12-10 三菱電機株式会社 プラズマエツチング装置
JPS62158885A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ガスエツチング方法
KR880000215A (ko) * 1986-06-10 1988-03-24 나까므라 히사오 시이트(sheet)상 물체의 플라즈마 처리장치
DE3632684A1 (de) * 1986-09-26 1988-03-31 Philips Patentverwaltung Verfahren und vorrichtung zum innenbeschichten von rohren
DE68922244T2 (de) * 1988-06-06 1995-09-14 Japan Res Dev Corp Verfahren zur Durchführung einer Plasmareaktion bei Atmosphärendruck.
JPH0672308B2 (ja) * 1988-07-04 1994-09-14 新技術事業団 大気圧プラズマ反応方法
JPH0248626B2 (ja) * 1988-06-06 1990-10-25 Shingijutsu Kaihatsu Jigyodan Hakumakukeiseihohotosonosochi
US5185132A (en) * 1989-12-07 1993-02-09 Research Development Corporation Of Japan Atomspheric plasma reaction method and apparatus therefor

Also Published As

Publication number Publication date
US5225659A (en) 1993-07-06
JPH05131132A (ja) 1993-05-28
EP0508833B1 (de) 1995-08-09
EP0508833A1 (de) 1992-10-14
DE69203919D1 (de) 1995-09-14
JP3206095B2 (ja) 2001-09-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee