DE69128187D1 - Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters - Google Patents
Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines PolyimidfilmmustersInfo
- Publication number
- DE69128187D1 DE69128187D1 DE69128187T DE69128187T DE69128187D1 DE 69128187 D1 DE69128187 D1 DE 69128187D1 DE 69128187 T DE69128187 T DE 69128187T DE 69128187 T DE69128187 T DE 69128187T DE 69128187 D1 DE69128187 D1 DE 69128187D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- polyimide film
- film pattern
- resin composition
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25903290 | 1990-09-28 | ||
JP396291 | 1991-01-17 | ||
JP3985491 | 1991-03-06 | ||
JP3-90001A JP3029316B2 (ja) | 1990-09-28 | 1991-03-28 | ポリイミド膜パターンを形成するための感光性樹脂組成物およびこれを用いた半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69128187D1 true DE69128187D1 (de) | 1997-12-18 |
DE69128187T2 DE69128187T2 (de) | 1998-03-26 |
Family
ID=27453987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69128187T Expired - Lifetime DE69128187T2 (de) | 1990-09-28 | 1991-09-26 | Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters |
Country Status (3)
Country | Link |
---|---|
US (2) | US5348835A (de) |
EP (1) | EP0478321B1 (de) |
DE (1) | DE69128187T2 (de) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851736A (en) * | 1991-03-05 | 1998-12-22 | Nitto Denko Corporation | Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern |
WO1994018607A1 (en) * | 1993-02-03 | 1994-08-18 | Toray Industries, Inc. | Process for forming positive polyimide pattern |
JPH0735920A (ja) * | 1993-07-26 | 1995-02-07 | Sumitomo Chem Co Ltd | 基板上に枠部の機能性塗膜等を形成する方法 |
US5573886A (en) * | 1994-01-21 | 1996-11-12 | Shin-Etsu Chemical Co., Ltd. | Photosensitive resin composition comprising a polyimide precursor and method for making a polyimide film pattern from the same |
US6087006A (en) * | 1994-08-31 | 2000-07-11 | Hitachi, Ltd. | Surface-protecting film and resin-sealed semiconductor device having said film |
KR100384746B1 (ko) * | 1994-09-13 | 2003-08-25 | 제온 코포레이션 | 감광성 폴리이미드 수지 조성물 |
US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
JP2974279B2 (ja) * | 1995-07-06 | 1999-11-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリアミド酸を含有するホトレジスト層を有するインクジェットヘッド |
JP2830903B2 (ja) * | 1995-07-21 | 1998-12-02 | 日本電気株式会社 | 半導体デバイスの製造方法 |
US5886136A (en) * | 1995-09-12 | 1999-03-23 | Nippon Zeon Co., Ltd. | Pattern forming process |
US5648451A (en) * | 1995-10-10 | 1997-07-15 | Sumitomo Bakelite Company Limited | Process for producing photosensitive resin |
SG52916A1 (en) * | 1996-02-13 | 1998-09-28 | Nitto Denko Corp | Circuit substrate circuit-formed suspension substrate and production method thereof |
JPH09319082A (ja) * | 1996-05-27 | 1997-12-12 | Hitachi Ltd | ポジ型感光性樹脂組成物及びそれを用いた電子装置 |
JP3321548B2 (ja) * | 1996-06-17 | 2002-09-03 | 株式会社日立製作所 | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法 |
US5955244A (en) * | 1996-08-20 | 1999-09-21 | Quantum Corporation | Method for forming photoresist features having reentrant profiles using a basic agent |
US6001517A (en) * | 1996-10-31 | 1999-12-14 | Kabushiki Kaisha Toshiba | Positive photosensitive polymer composition, method of forming a pattern and electronic parts |
JPH10214925A (ja) * | 1996-11-28 | 1998-08-11 | Nitto Denko Corp | 半導体素子封止用封止ラベル |
US6010825A (en) * | 1997-09-11 | 2000-01-04 | Olin Microelectronics Chemicals, Inc. | Negatively acting photoresist composition based on polyimide precursors |
US6358672B2 (en) | 1998-02-05 | 2002-03-19 | Samsung Electronics Co., Ltd. | Method of forming semiconductor device pattern including cross-linking and flow baking a positive photoresist |
JP3509612B2 (ja) | 1998-05-29 | 2004-03-22 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、レリーフパターンの製造法及び電子部品 |
WO2000014604A1 (fr) * | 1998-09-09 | 2000-03-16 | Toray Industries, Inc. | Composition-precurseur de resine photosensible positive et procede de fabrication correspondant |
JP3426531B2 (ja) | 1998-10-30 | 2003-07-14 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、レリーフパターンの製造法及び電子部品 |
JP3805918B2 (ja) * | 1999-02-09 | 2006-08-09 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、レリーフパターンの製造法及び電子部品 |
JP3677191B2 (ja) | 1999-03-15 | 2005-07-27 | 株式会社東芝 | 感光性ポリイミド用現像液、ポリイミド膜パターン形成方法、及び電子部品 |
US6677099B1 (en) * | 1999-11-30 | 2004-01-13 | Nissan Chemical Industries, Ltd. | Positive type photosensitive polyimide resin composition |
JP4665333B2 (ja) * | 2000-11-27 | 2011-04-06 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
JP3773845B2 (ja) * | 2000-12-29 | 2006-05-10 | 三星電子株式会社 | ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物 |
JP2002212288A (ja) * | 2001-01-23 | 2002-07-31 | Hitachi Cable Ltd | ポリイミドの製造方法 |
FR2825480B1 (fr) * | 2001-05-31 | 2003-12-19 | Nemoptic | Polyimides pour ancrage de cristaux liquides, dispositifs d'affichage les incluant et procede de preparation de ces dispositifs |
US7285363B2 (en) * | 2002-11-08 | 2007-10-23 | The University Of Connecticut | Photoactivators, methods of use, and the articles derived therefrom |
TW200512543A (en) * | 2003-08-06 | 2005-04-01 | Sumitomo Bakelite Co | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device |
US20070292808A1 (en) * | 2004-09-01 | 2007-12-20 | Jun Koshiyama | Developing Solution Composition for Lithography and Method for Resist Pattern Formation |
US20060122560A1 (en) * | 2004-12-07 | 2006-06-08 | Robert Burgmeier | Medical devices and processes for preparing same |
US8026036B2 (en) * | 2005-03-30 | 2011-09-27 | Nippon Steel Chemical Co., Ltd. | Photosensitive resin composition and circuit substrate employing the same |
KR100662542B1 (ko) * | 2005-06-17 | 2006-12-28 | 제일모직주식회사 | 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법 |
WO2007125921A1 (ja) | 2006-04-28 | 2007-11-08 | Asahi Kasei Kabushiki Kaisha | 感光性樹脂組成物及び感光性フィルム |
US20080058496A1 (en) * | 2006-08-29 | 2008-03-06 | Daily Polymer Co., Ltd. | Polyamic acid-based composition, and liquid crystal orienting agent and orienting film containing the same |
US20090075080A1 (en) * | 2007-09-19 | 2009-03-19 | General Electric Company | Coated fiber and method for making the coated fiber |
KR101434010B1 (ko) * | 2008-10-27 | 2014-08-25 | 제이에스알 가부시끼가이샤 | 감광성 절연 수지 조성물 및 그의 경화물 |
JP5585065B2 (ja) * | 2009-01-30 | 2014-09-10 | Jsr株式会社 | 感光性絶縁樹脂組成物及びその硬化物並びに絶縁膜の製造方法 |
KR101781517B1 (ko) * | 2010-09-30 | 2017-09-26 | 삼성디스플레이 주식회사 | 블록 공중합체 및 이를 이용한 패턴 형성 방법 |
KR20120066924A (ko) * | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 |
CA2849381C (en) * | 2011-10-04 | 2019-04-30 | The University Of Western Ontario | Fabrication of free standing membranes and use thereof for synthesis of nanoparticle patterns |
JP2013131424A (ja) * | 2011-12-22 | 2013-07-04 | Hitachi Cable Ltd | 絶縁電線及びそれを用いたコイル |
JP5761151B2 (ja) | 2012-10-16 | 2015-08-12 | 日立金属株式会社 | 絶縁電線及びコイル |
CN106256846B (zh) * | 2015-06-17 | 2019-04-16 | 长兴材料工业股份有限公司 | 聚酰亚胺前驱物组合物、其用途及由其制备的聚酰亚胺 |
US10090194B2 (en) * | 2016-03-18 | 2018-10-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
JP6663380B2 (ja) * | 2017-03-22 | 2020-03-11 | 信越化学工業株式会社 | ポリイミド前駆体の重合体、ポジ型感光性樹脂組成物、ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
CN112899746B (zh) * | 2021-02-05 | 2022-04-08 | 南京理工大学 | 降低叠氮化亚铜薄膜静电感度的方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3282898A (en) * | 1963-11-21 | 1966-11-01 | Du Pont | Treatment of aromatic polyamide-acids with carbodiimides |
US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
DE2933826A1 (de) * | 1979-08-21 | 1981-03-19 | Siemens AG, 1000 Berlin und 8000 München | Polyimid-, polyisoindolochinazolindion-, polyoxazindion- und polychinazolindion-vorstufen sowie deren herstellung |
DE3411659A1 (de) * | 1984-03-29 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen |
JPS62143929A (ja) * | 1985-07-16 | 1987-06-27 | Kanegafuchi Chem Ind Co Ltd | ポリイミド前駆体薄膜 |
EP0224680B1 (de) * | 1985-12-05 | 1992-01-15 | International Business Machines Corporation | Photoresistzusammensetzungen mit vermindertem Lösungsgrad in basischen Entwicklern, auf Basis von durch Diazochinon sensibilisierter Polyamidsäure |
US4942108A (en) * | 1985-12-05 | 1990-07-17 | International Business Machines Corporation | Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers |
US4847359A (en) * | 1986-06-30 | 1989-07-11 | Ciba-Geigy Corporation | Diamino-9,10-dihydroanthracenes and polyamide acid (esters) and polyimides derived therefrom |
EP0291779B1 (de) * | 1987-05-18 | 1994-07-27 | Siemens Aktiengesellschaft | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen |
US4927736A (en) * | 1987-07-21 | 1990-05-22 | Hoechst Celanese Corporation | Hydroxy polyimides and high temperature positive photoresists therefrom |
US5037720A (en) * | 1987-07-21 | 1991-08-06 | Hoechst Celanese Corporation | Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use |
US5037949A (en) * | 1987-11-24 | 1991-08-06 | Hoechst Celanese Corp. | Polymers prepared from 4,4'-bis[2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl]diphenyl ether |
DE3837612A1 (de) * | 1988-11-05 | 1990-05-23 | Ciba Geigy Ag | Positiv-fotoresists von polyimid-typ |
US5114826A (en) * | 1989-12-28 | 1992-05-19 | Ibm Corporation | Photosensitive polyimide compositions |
JPH0415226A (ja) * | 1990-05-10 | 1992-01-20 | Chisso Corp | ヒドロキシフェニル基を有する感光性耐熱重合体 |
-
1991
- 1991-09-26 DE DE69128187T patent/DE69128187T2/de not_active Expired - Lifetime
- 1991-09-26 EP EP91308772A patent/EP0478321B1/de not_active Expired - Lifetime
- 1991-09-27 US US07/766,334 patent/US5348835A/en not_active Expired - Lifetime
-
1994
- 1994-03-30 US US08/220,058 patent/US5518864A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69128187T2 (de) | 1998-03-26 |
EP0478321A1 (de) | 1992-04-01 |
US5518864A (en) | 1996-05-21 |
US5348835A (en) | 1994-09-20 |
EP0478321B1 (de) | 1997-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |