DE69121843T2 - Wärmesenke und ihr Herstellungsverfahren - Google Patents

Wärmesenke und ihr Herstellungsverfahren

Info

Publication number
DE69121843T2
DE69121843T2 DE69121843T DE69121843T DE69121843T2 DE 69121843 T2 DE69121843 T2 DE 69121843T2 DE 69121843 T DE69121843 T DE 69121843T DE 69121843 T DE69121843 T DE 69121843T DE 69121843 T2 DE69121843 T2 DE 69121843T2
Authority
DE
Germany
Prior art keywords
manufacturing process
heat sink
sink
heat
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69121843T
Other languages
English (en)
Other versions
DE69121843D1 (de
Inventor
Ko Minakami
Toshinori Terashima
Toshio Maeda
Tomiya Sasaki
Katsumi Hisano
Hideo Iwasaki
Koichiro Kawano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69121843D1 publication Critical patent/DE69121843D1/de
Publication of DE69121843T2 publication Critical patent/DE69121843T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/08—Fins with openings, e.g. louvers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69121843T 1990-11-09 1991-11-06 Wärmesenke und ihr Herstellungsverfahren Expired - Fee Related DE69121843T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30273090 1990-11-09
JP03200859A JP3122173B2 (ja) 1990-11-09 1991-08-09 放熱器、放熱装置および放熱器の製造方法

Publications (2)

Publication Number Publication Date
DE69121843D1 DE69121843D1 (de) 1996-10-10
DE69121843T2 true DE69121843T2 (de) 1997-02-27

Family

ID=26512435

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69121843T Expired - Fee Related DE69121843T2 (de) 1990-11-09 1991-11-06 Wärmesenke und ihr Herstellungsverfahren

Country Status (5)

Country Link
US (1) US5381859A (de)
EP (1) EP0485205B1 (de)
JP (1) JP3122173B2 (de)
KR (1) KR950004846B1 (de)
DE (1) DE69121843T2 (de)

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CN107085288B (zh) 2008-05-08 2020-03-24 贰陆激光企业有限责任公司 高亮度二极管输出方法和装置
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JP2016009003A (ja) 2014-06-23 2016-01-18 株式会社リコー 冷却装置、画像投射装置、電子機器
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JP7353132B2 (ja) * 2019-10-31 2023-09-29 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
CN110933911A (zh) * 2019-12-06 2020-03-27 浙江嘉熙科技有限公司 口琴管散热器
US11587798B2 (en) * 2020-01-03 2023-02-21 Rolls-Royce North American Technologies Inc. High heat flux power electronics cooling design
CN111372422B (zh) * 2020-01-09 2021-07-06 西安交通大学 一种阵列微通道冷板制作方法
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Also Published As

Publication number Publication date
US5381859A (en) 1995-01-17
KR950004846B1 (ko) 1995-05-13
EP0485205A3 (en) 1993-03-17
EP0485205A2 (de) 1992-05-13
JP3122173B2 (ja) 2001-01-09
EP0485205B1 (de) 1996-09-04
JPH053272A (ja) 1993-01-08
DE69121843D1 (de) 1996-10-10

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