DE68917968D1 - System zur Halbleiterherstellung unter Reinheitsbedingungen. - Google Patents

System zur Halbleiterherstellung unter Reinheitsbedingungen.

Info

Publication number
DE68917968D1
DE68917968D1 DE68917968T DE68917968T DE68917968D1 DE 68917968 D1 DE68917968 D1 DE 68917968D1 DE 68917968 T DE68917968 T DE 68917968T DE 68917968 T DE68917968 T DE 68917968T DE 68917968 D1 DE68917968 D1 DE 68917968D1
Authority
DE
Germany
Prior art keywords
semiconductor manufacturing
manufacturing under
cleanliness conditions
under cleanliness
conditions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68917968T
Other languages
English (en)
Other versions
DE68917968T2 (de
Inventor
Takumi Tamura
Shosuke Shinoda
Kyohiko Okashita
Tetsuo Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
N M B SEMICONDUCTOR TATEYAMA K
Original Assignee
N M B SEMICONDUCTOR TATEYAMA K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by N M B SEMICONDUCTOR TATEYAMA K filed Critical N M B SEMICONDUCTOR TATEYAMA K
Publication of DE68917968D1 publication Critical patent/DE68917968D1/de
Application granted granted Critical
Publication of DE68917968T2 publication Critical patent/DE68917968T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Ventilation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Manipulator (AREA)
DE68917968T 1988-03-31 1989-01-16 System zur Halbleiterherstellung unter Reinheitsbedingungen. Expired - Fee Related DE68917968T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7848588A JPH0756879B2 (ja) 1988-03-31 1988-03-31 半導体の無塵化製造装置

Publications (2)

Publication Number Publication Date
DE68917968D1 true DE68917968D1 (de) 1994-10-13
DE68917968T2 DE68917968T2 (de) 1995-04-27

Family

ID=13663287

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68917968T Expired - Fee Related DE68917968T2 (de) 1988-03-31 1989-01-16 System zur Halbleiterherstellung unter Reinheitsbedingungen.

Country Status (4)

Country Link
US (1) US4923352A (de)
EP (1) EP0335752B1 (de)
JP (1) JPH0756879B2 (de)
DE (1) DE68917968T2 (de)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
US4981436A (en) * 1988-08-08 1991-01-01 Tel Sagami Limited Vertical type heat-treatment apparatus
US5431599A (en) * 1990-08-29 1995-07-11 Intelligent Enclosures Corporation Environmental control system
US5401212A (en) * 1990-08-29 1995-03-28 Intelligent Enclosures Corporation Environmental control system
US5181819A (en) * 1990-10-09 1993-01-26 Tokyo Electron Sagami Limited Apparatus for processing semiconductors
US5261935A (en) * 1990-09-26 1993-11-16 Tokyo Electron Sagami Limited Clean air apparatus
DE4034355A1 (de) * 1990-10-29 1992-04-30 Decker Kg Geb Transport-vorrichtung zum umsetzen eines werkstueck-traegers
US5083558A (en) * 1990-11-06 1992-01-28 Thomas William R Mobile surgical compartment with micro filtered laminar air flow
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
JP2976566B2 (ja) * 1991-04-19 1999-11-10 神鋼電機株式会社 クリーンルーム用の無人搬送装置
US5326316A (en) * 1991-04-17 1994-07-05 Matsushita Electric Industrial Co., Ltd. Coupling type clean space apparatus
DE4210960C2 (de) * 1992-04-02 1994-03-31 Ibm Reinrauminsel und Verfahren zur reinraumgerechten Handhabung von in Behältern gelagerten Gegenständen
ATE129361T1 (de) * 1992-08-04 1995-11-15 Ibm Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern.
JPH0689837A (ja) * 1992-09-08 1994-03-29 Fujitsu Ltd 基板処理装置
JP3275390B2 (ja) * 1992-10-06 2002-04-15 神鋼電機株式会社 可搬式密閉コンテナ流通式の自動搬送システム
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
US5430991A (en) * 1993-04-23 1995-07-11 Tandberg Data Storage Data carrier magazine and opening mechanism
US5413529A (en) * 1993-09-09 1995-05-09 Intermec Corporation Multi-component housing
US5344365A (en) * 1993-09-14 1994-09-06 Sematech, Inc. Integrated building and conveying structure for manufacturing under ultraclean conditions
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
DE69403890T2 (de) * 1994-01-14 1998-01-08 International Business Machines Corp., Armonk, N.Y. Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter
US5509191A (en) * 1994-01-26 1996-04-23 Best; Norman D. Apparatus for assembling and processing small parts using a robot
JP3163884B2 (ja) * 1994-02-18 2001-05-08 株式会社ダイフク 荷保管設備
DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
US5546651A (en) * 1994-08-01 1996-08-20 Lockheed Martin Corporation Apparatus for encapsulating space launch payloads
US5884392A (en) * 1994-12-23 1999-03-23 International Business Machines Corporation Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers
JP3519212B2 (ja) * 1995-06-13 2004-04-12 高砂熱学工業株式会社 清浄な資材用保管庫
US6428266B1 (en) * 1995-07-10 2002-08-06 Brooks Automation, Inc. Direct driven robot
US5842917A (en) * 1996-01-11 1998-12-01 United Microelectronics Corproration Automated manufacturing plant for semiconductor devices
KR100445139B1 (ko) * 1996-01-23 2004-11-17 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치
TW317644B (de) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
TW353137B (en) * 1996-03-28 1999-02-21 Matsushita Electric Ind Co Ltd Manufacturing apparatus with cleaning mechanism and cleaning method
JPH1070055A (ja) * 1996-08-28 1998-03-10 Sony Corp 半導体装置生産用クリーンルーム
US5718029A (en) * 1996-11-06 1998-02-17 Vanguard International Semiconductor Corporation Pre-installation of pumping line for efficient fab expansion
US5924833A (en) * 1997-06-19 1999-07-20 Advanced Micro Devices, Inc. Automated wafer transfer system
US6157866A (en) * 1997-06-19 2000-12-05 Advanced Micro Devices, Inc. Automated material handling system for a manufacturing facility divided into separate fabrication areas
JPH11111809A (ja) * 1997-10-07 1999-04-23 Innotech Corp 搬送装置
DE29718996U1 (de) * 1997-10-24 1997-12-18 Siemens AG, 80333 München Fertigungseinrichtung mit einem Roboter
JP4156039B2 (ja) * 1998-03-09 2008-09-24 株式会社荏原製作所 ポリッシング装置
US6205881B1 (en) * 1998-10-13 2001-03-27 Brooks Automation Gmbh Device for controlling the drive of mechanisms operating separately from one another
US6145444A (en) * 1998-12-16 2000-11-14 Wilkinson; Kerry E. Micro clean sealed tubular transporter apparatus
TW463207B (en) * 1999-03-17 2001-11-11 Fujitsu Ltd Double-sealed work conveying and transferring apparatus and container inspecting method
DE19913886A1 (de) 1999-03-26 2000-09-28 Siemens Ag Anlage zur Fertigung von Halbleiterprodukten
JP2000294615A (ja) 1999-04-09 2000-10-20 Miyagi Oki Electric Co Ltd 搬送システムおよび搬送方法
US6305500B1 (en) 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments
US7083515B2 (en) * 1999-09-07 2006-08-01 Speedfam-Ipec Corporation Clean room facility and construction method
US6662225B1 (en) * 1999-11-16 2003-12-09 Ricoh Company, Ltd. Remote system usage monitoring with flexible packaging of data
US6390755B1 (en) * 2000-04-06 2002-05-21 Motorola, Inc. Exhaust device for use in a clean room, cleanroom, and method
EP1284011B1 (de) * 2000-05-16 2005-11-09 Infineon Technologies SC300 GmbH & Co. KG Vorrichtung und verfahren zum behandeln, lagern und beschicken von trägern für scheibenförmige gegenstände
JP2002138620A (ja) * 2000-10-31 2002-05-17 Shin Etsu Handotai Co Ltd 引上げ室
EP1231626A1 (de) * 2001-02-10 2002-08-14 Infineon Technologies SC300 GmbH & Co. KG Messanordnung
JP2002359237A (ja) * 2001-05-30 2002-12-13 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
EP1505937A1 (de) * 2002-04-22 2005-02-16 Jane Homan Modulares biologisches sicherheits-gerät und system
KR100486690B1 (ko) * 2002-11-29 2005-05-03 삼성전자주식회사 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법
TW200505776A (en) * 2003-01-31 2005-02-16 Aviza Tech Inc Transport system having shared load-lock front-end assembly
KR100524875B1 (ko) * 2003-06-28 2005-10-31 엘지.필립스 엘시디 주식회사 청정시스템
US20050095976A1 (en) * 2003-10-29 2005-05-05 Taiwan Semiconductor Manufacturing Co. Design for LPT arm cover
DE10351848A1 (de) 2003-11-06 2005-06-09 Leica Microsystems Semiconductor Gmbh System zur Detektion von Makrodefekten
KR20060056709A (ko) * 2004-11-22 2006-05-25 삼성전자주식회사 도어 입구에 에어 커튼을 가지는 반도체 제조 장비
TWI278416B (en) * 2004-12-09 2007-04-11 Au Optronics Corp Cassette stocker
DE102004062592B3 (de) 2004-12-24 2006-06-08 Leica Microsystems Jena Gmbh System zur Untersuchung eines scheibenförmigen Substrats
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
US7513822B2 (en) * 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9339900B2 (en) * 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
DE102005039453B4 (de) * 2005-08-18 2007-06-28 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate
US7467024B2 (en) * 2005-08-26 2008-12-16 Flitsch Frederick A Method and apparatus for an elevator system for a multilevel cleanspace fabricator
CN105304529B (zh) 2005-09-18 2019-03-15 弗雷德里克·A·弗里奇 用于在洁净空间中垂直定位基片处理设备的方法和装置
US7896602B2 (en) 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
JP2008032335A (ja) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法
US20090028669A1 (en) * 2007-07-25 2009-01-29 Dynamic Micro Systems Removable compartments for workpiece stocker
US20080112787A1 (en) 2006-11-15 2008-05-15 Dynamic Micro Systems Removable compartments for workpiece stocker
CA2750852A1 (en) 2008-12-23 2010-07-01 Xoma, Technology Ltd. Flexible manufacturing system
JP5083278B2 (ja) * 2009-06-15 2012-11-28 村田機械株式会社 装置前自動倉庫
CN102575858B (zh) 2009-08-16 2015-02-04 G-Con制造有限公司 组件式自足可移动的净化房
US9795957B2 (en) 2009-08-16 2017-10-24 G-Con Manufacturing, Inc. Modular, self-contained, mobile clean room
US8603217B2 (en) * 2011-02-01 2013-12-10 Universal Laser Systems, Inc. Recirculating filtration systems for material processing systems and associated methods of use and manufacture
CN103481297B (zh) * 2012-06-08 2016-04-06 株式会社安川电机 机器人室元、机器人室元的组装方法以及机器人***
US9668375B2 (en) * 2013-03-15 2017-05-30 Yahoo! Inc. Atmospheric cooling of servers in a data center
EP3058147B1 (de) * 2013-10-14 2022-12-14 G-CON Manufacturing Inc. Verbundungseinheit zum verbinden modularer mobiler räume und entsprechende methode zur verbindung
TWI678751B (zh) * 2013-12-13 2019-12-01 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
CN103753605B (zh) * 2014-02-21 2015-09-16 江西珍视明药业有限公司 一种五轴三自由度机械手臂内包材传递***
US10533758B2 (en) 2014-07-11 2020-01-14 G-Con Manufacturing Inc. Modular parts that supply utilities to cleanroom, isolation or containment cubicles, pods, or modules
JP6511858B2 (ja) * 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 搬送室
JP2016178133A (ja) * 2015-03-19 2016-10-06 シンフォニアテクノロジー株式会社 ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法
DE202015104817U1 (de) * 2015-09-11 2015-10-09 Krones Ag Vorrichtung zur Bereitstellung von Reinluft in einer Getränkeabfüllanlage
DE102017213861A1 (de) * 2017-08-09 2019-02-14 Krones Ag Behälterbehandlungsanlage
JP7037049B2 (ja) * 2018-03-15 2022-03-16 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
DE102018207826A1 (de) * 2018-05-18 2019-11-21 Kuka Deutschland Gmbh Handhabung, insbesondere, Transport von Gütern, insbesondere Wafern, durch einen Roboter
US20200207559A1 (en) * 2018-12-28 2020-07-02 Int Tech Co., Ltd. Dust-free system and method of manufacturing panel
WO2021030568A1 (en) 2019-08-15 2021-02-18 G-Con Manufacturing, Inc. Removable panel roof for modular, self-contained, mobile clean room
DE102020117455A1 (de) 2020-07-02 2022-01-05 Bayerische Motoren Werke Aktiengesellschaft Handhabungseinrichtung für eine Herstellungsumgebung
US11492795B2 (en) 2020-08-31 2022-11-08 G-Con Manufacturing, Inc. Ballroom-style cleanroom assembled from modular buildings

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7215945A (de) * 1972-11-24 1974-05-28
JPS5619635A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Manufacturing apparatus
JPS578047A (en) * 1980-06-18 1982-01-16 Hitachi Ltd Working or assembling equipment
JPS59106131A (ja) * 1982-12-10 1984-06-19 Fujitsu Ltd 試料搬送方法
JPS60165446A (ja) * 1984-02-07 1985-08-28 Daifuku Co Ltd クリ−ンル−ム用搬送設備
JPS60206017A (ja) * 1984-03-30 1985-10-17 Toshiba Corp 清浄搬送システム
JPS6162740A (ja) * 1984-09-03 1986-03-31 Sanki Eng Co Ltd クリ−ントンネル送風清浄装置
JPS61235625A (ja) * 1985-04-10 1986-10-20 Takenaka Komuten Co Ltd クリ−ンル−ム
JPS625031A (ja) * 1985-06-28 1987-01-12 Kajima Corp 部分的に清浄度の異なるクリ−ンル−ム
US4667579A (en) * 1985-10-03 1987-05-26 Daw, Incorporated Cleanroom structure
US4787297A (en) * 1987-08-27 1988-11-29 Texas Instruments Incorporated Stacked robotic work cell process station

Also Published As

Publication number Publication date
JPH02153546A (ja) 1990-06-13
EP0335752A3 (de) 1991-06-12
JPH0756879B2 (ja) 1995-06-14
US4923352A (en) 1990-05-08
DE68917968T2 (de) 1995-04-27
EP0335752A2 (de) 1989-10-04
EP0335752B1 (de) 1994-09-07

Similar Documents

Publication Publication Date Title
DE68917968D1 (de) System zur Halbleiterherstellung unter Reinheitsbedingungen.
DE69015670D1 (de) Herstellungsmethode für Halbleitermembranen.
DE3773091D1 (de) Ventilsystem fuer intravenoese leitung.
DE3786263D1 (de) Vorrichtung zur plasmaphorese.
DE3886329D1 (de) Halbleiteranordnung mit Luftbrücken-Verbindungen.
NO900746D0 (no) System for omraade-begrensning.
DE69009409D1 (de) Halbleiter-Heterostrukturen.
KR880002274A (ko) 바이폴라형 반도체장치의 제조방법
DE69017595D1 (de) Automatisches Transportsystem.
DE3874469D1 (de) Messverfahren fuer halbleiteranordnung.
DE69013032D1 (de) Lichtaussendendes Halbleitersystem.
DE3750558D1 (de) Transfersystem für Halbleiterscheiben.
DE68916457D1 (de) Einrichtung zur Molekularstrahlepitaxie.
NO882295D0 (no) Fremgangsmaate for fremstilling av paryledimeren.
DE69009626D1 (de) Masterslice-Halbleitervorrichtung.
DE69008953D1 (de) Schwärzbares Substrat.
DE69021952D1 (de) Vorrichtung zur Handhabung von Halbleiterplättchen.
DE69107630D1 (de) Halbleiterstruktur für optoelektronische Vorrichtung.
DE3583056D1 (de) Einrichtung zur bearbeitung unter vakuum.
DE3767153D1 (de) Geraet zur ortsbestimmung.
DE3872781D1 (de) Einrichtung fuer eine vollautomatische kabelbaumherstellung.
DE3886286D1 (de) Verbindungsverfahren für Halbleiteranordnung.
DE3884881D1 (de) Halbleiterlaservorrichtung.
DE3854423D1 (de) Halbleiterlaservorrichtung.
DE3868435D1 (de) Halbleiterlaservorrichtung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee