DE68917968D1 - System zur Halbleiterherstellung unter Reinheitsbedingungen. - Google Patents
System zur Halbleiterherstellung unter Reinheitsbedingungen.Info
- Publication number
- DE68917968D1 DE68917968D1 DE68917968T DE68917968T DE68917968D1 DE 68917968 D1 DE68917968 D1 DE 68917968D1 DE 68917968 T DE68917968 T DE 68917968T DE 68917968 T DE68917968 T DE 68917968T DE 68917968 D1 DE68917968 D1 DE 68917968D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor manufacturing
- manufacturing under
- cleanliness conditions
- under cleanliness
- conditions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J21/00—Chambers provided with manipulation devices
- B25J21/005—Clean rooms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Ventilation (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7848588A JPH0756879B2 (ja) | 1988-03-31 | 1988-03-31 | 半導体の無塵化製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68917968D1 true DE68917968D1 (de) | 1994-10-13 |
DE68917968T2 DE68917968T2 (de) | 1995-04-27 |
Family
ID=13663287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68917968T Expired - Fee Related DE68917968T2 (de) | 1988-03-31 | 1989-01-16 | System zur Halbleiterherstellung unter Reinheitsbedingungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4923352A (de) |
EP (1) | EP0335752B1 (de) |
JP (1) | JPH0756879B2 (de) |
DE (1) | DE68917968T2 (de) |
Families Citing this family (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5054988A (en) * | 1988-07-13 | 1991-10-08 | Tel Sagami Limited | Apparatus for transferring semiconductor wafers |
US4981436A (en) * | 1988-08-08 | 1991-01-01 | Tel Sagami Limited | Vertical type heat-treatment apparatus |
US5431599A (en) * | 1990-08-29 | 1995-07-11 | Intelligent Enclosures Corporation | Environmental control system |
US5401212A (en) * | 1990-08-29 | 1995-03-28 | Intelligent Enclosures Corporation | Environmental control system |
US5181819A (en) * | 1990-10-09 | 1993-01-26 | Tokyo Electron Sagami Limited | Apparatus for processing semiconductors |
US5261935A (en) * | 1990-09-26 | 1993-11-16 | Tokyo Electron Sagami Limited | Clean air apparatus |
DE4034355A1 (de) * | 1990-10-29 | 1992-04-30 | Decker Kg Geb | Transport-vorrichtung zum umsetzen eines werkstueck-traegers |
US5083558A (en) * | 1990-11-06 | 1992-01-28 | Thomas William R | Mobile surgical compartment with micro filtered laminar air flow |
US5297910A (en) * | 1991-02-15 | 1994-03-29 | Tokyo Electron Limited | Transportation-transfer device for an object of treatment |
JP2976566B2 (ja) * | 1991-04-19 | 1999-11-10 | 神鋼電機株式会社 | クリーンルーム用の無人搬送装置 |
US5326316A (en) * | 1991-04-17 | 1994-07-05 | Matsushita Electric Industrial Co., Ltd. | Coupling type clean space apparatus |
DE4210960C2 (de) * | 1992-04-02 | 1994-03-31 | Ibm | Reinrauminsel und Verfahren zur reinraumgerechten Handhabung von in Behältern gelagerten Gegenständen |
ATE129361T1 (de) * | 1992-08-04 | 1995-11-15 | Ibm | Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern. |
JPH0689837A (ja) * | 1992-09-08 | 1994-03-29 | Fujitsu Ltd | 基板処理装置 |
JP3275390B2 (ja) * | 1992-10-06 | 2002-04-15 | 神鋼電機株式会社 | 可搬式密閉コンテナ流通式の自動搬送システム |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
US5430991A (en) * | 1993-04-23 | 1995-07-11 | Tandberg Data Storage | Data carrier magazine and opening mechanism |
US5413529A (en) * | 1993-09-09 | 1995-05-09 | Intermec Corporation | Multi-component housing |
US5344365A (en) * | 1993-09-14 | 1994-09-06 | Sematech, Inc. | Integrated building and conveying structure for manufacturing under ultraclean conditions |
US5653623A (en) * | 1993-12-14 | 1997-08-05 | Ebara Corporation | Polishing apparatus with improved exhaust |
DE69403890T2 (de) * | 1994-01-14 | 1998-01-08 | International Business Machines Corp., Armonk, N.Y. | Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter |
US5509191A (en) * | 1994-01-26 | 1996-04-23 | Best; Norman D. | Apparatus for assembling and processing small parts using a robot |
JP3163884B2 (ja) * | 1994-02-18 | 2001-05-08 | 株式会社ダイフク | 荷保管設備 |
DE4425208C2 (de) * | 1994-07-16 | 1996-05-09 | Jenoptik Technologie Gmbh | Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen |
US5546651A (en) * | 1994-08-01 | 1996-08-20 | Lockheed Martin Corporation | Apparatus for encapsulating space launch payloads |
US5884392A (en) * | 1994-12-23 | 1999-03-23 | International Business Machines Corporation | Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers |
JP3519212B2 (ja) * | 1995-06-13 | 2004-04-12 | 高砂熱学工業株式会社 | 清浄な資材用保管庫 |
US6428266B1 (en) * | 1995-07-10 | 2002-08-06 | Brooks Automation, Inc. | Direct driven robot |
US5842917A (en) * | 1996-01-11 | 1998-12-01 | United Microelectronics Corproration | Automated manufacturing plant for semiconductor devices |
KR100445139B1 (ko) * | 1996-01-23 | 2004-11-17 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
TW317644B (de) * | 1996-01-26 | 1997-10-11 | Tokyo Electron Co Ltd | |
TW353137B (en) * | 1996-03-28 | 1999-02-21 | Matsushita Electric Ind Co Ltd | Manufacturing apparatus with cleaning mechanism and cleaning method |
JPH1070055A (ja) * | 1996-08-28 | 1998-03-10 | Sony Corp | 半導体装置生産用クリーンルーム |
US5718029A (en) * | 1996-11-06 | 1998-02-17 | Vanguard International Semiconductor Corporation | Pre-installation of pumping line for efficient fab expansion |
US5924833A (en) * | 1997-06-19 | 1999-07-20 | Advanced Micro Devices, Inc. | Automated wafer transfer system |
US6157866A (en) * | 1997-06-19 | 2000-12-05 | Advanced Micro Devices, Inc. | Automated material handling system for a manufacturing facility divided into separate fabrication areas |
JPH11111809A (ja) * | 1997-10-07 | 1999-04-23 | Innotech Corp | 搬送装置 |
DE29718996U1 (de) * | 1997-10-24 | 1997-12-18 | Siemens AG, 80333 München | Fertigungseinrichtung mit einem Roboter |
JP4156039B2 (ja) * | 1998-03-09 | 2008-09-24 | 株式会社荏原製作所 | ポリッシング装置 |
US6205881B1 (en) * | 1998-10-13 | 2001-03-27 | Brooks Automation Gmbh | Device for controlling the drive of mechanisms operating separately from one another |
US6145444A (en) * | 1998-12-16 | 2000-11-14 | Wilkinson; Kerry E. | Micro clean sealed tubular transporter apparatus |
TW463207B (en) * | 1999-03-17 | 2001-11-11 | Fujitsu Ltd | Double-sealed work conveying and transferring apparatus and container inspecting method |
DE19913886A1 (de) | 1999-03-26 | 2000-09-28 | Siemens Ag | Anlage zur Fertigung von Halbleiterprodukten |
JP2000294615A (ja) | 1999-04-09 | 2000-10-20 | Miyagi Oki Electric Co Ltd | 搬送システムおよび搬送方法 |
US6305500B1 (en) | 1999-08-25 | 2001-10-23 | Maxtor Corporation | Material delivery system for clean room-like environments |
US7083515B2 (en) * | 1999-09-07 | 2006-08-01 | Speedfam-Ipec Corporation | Clean room facility and construction method |
US6662225B1 (en) * | 1999-11-16 | 2003-12-09 | Ricoh Company, Ltd. | Remote system usage monitoring with flexible packaging of data |
US6390755B1 (en) * | 2000-04-06 | 2002-05-21 | Motorola, Inc. | Exhaust device for use in a clean room, cleanroom, and method |
EP1284011B1 (de) * | 2000-05-16 | 2005-11-09 | Infineon Technologies SC300 GmbH & Co. KG | Vorrichtung und verfahren zum behandeln, lagern und beschicken von trägern für scheibenförmige gegenstände |
JP2002138620A (ja) * | 2000-10-31 | 2002-05-17 | Shin Etsu Handotai Co Ltd | 引上げ室 |
EP1231626A1 (de) * | 2001-02-10 | 2002-08-14 | Infineon Technologies SC300 GmbH & Co. KG | Messanordnung |
JP2002359237A (ja) * | 2001-05-30 | 2002-12-13 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
EP1505937A1 (de) * | 2002-04-22 | 2005-02-16 | Jane Homan | Modulares biologisches sicherheits-gerät und system |
KR100486690B1 (ko) * | 2002-11-29 | 2005-05-03 | 삼성전자주식회사 | 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법 |
TW200505776A (en) * | 2003-01-31 | 2005-02-16 | Aviza Tech Inc | Transport system having shared load-lock front-end assembly |
KR100524875B1 (ko) * | 2003-06-28 | 2005-10-31 | 엘지.필립스 엘시디 주식회사 | 청정시스템 |
US20050095976A1 (en) * | 2003-10-29 | 2005-05-05 | Taiwan Semiconductor Manufacturing Co. | Design for LPT arm cover |
DE10351848A1 (de) | 2003-11-06 | 2005-06-09 | Leica Microsystems Semiconductor Gmbh | System zur Detektion von Makrodefekten |
KR20060056709A (ko) * | 2004-11-22 | 2006-05-25 | 삼성전자주식회사 | 도어 입구에 에어 커튼을 가지는 반도체 제조 장비 |
TWI278416B (en) * | 2004-12-09 | 2007-04-11 | Au Optronics Corp | Cassette stocker |
DE102004062592B3 (de) | 2004-12-24 | 2006-06-08 | Leica Microsystems Jena Gmbh | System zur Untersuchung eines scheibenförmigen Substrats |
US9159592B2 (en) | 2005-06-18 | 2015-10-13 | Futrfab, Inc. | Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator |
US9059227B2 (en) | 2005-06-18 | 2015-06-16 | Futrfab, Inc. | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US10651063B2 (en) | 2005-06-18 | 2020-05-12 | Frederick A. Flitsch | Methods of prototyping and manufacturing with cleanspace fabricators |
US7513822B2 (en) * | 2005-06-18 | 2009-04-07 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US9339900B2 (en) * | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US11024527B2 (en) | 2005-06-18 | 2021-06-01 | Frederick A. Flitsch | Methods and apparatus for novel fabricators with Cleanspace |
US10627809B2 (en) | 2005-06-18 | 2020-04-21 | Frederick A. Flitsch | Multilevel fabricators |
DE102005039453B4 (de) * | 2005-08-18 | 2007-06-28 | Asys Automatic Systems Gmbh & Co. Kg | Bearbeitungsanlage modularen Aufbaus für flächige Substrate |
US7467024B2 (en) * | 2005-08-26 | 2008-12-16 | Flitsch Frederick A | Method and apparatus for an elevator system for a multilevel cleanspace fabricator |
CN105304529B (zh) | 2005-09-18 | 2019-03-15 | 弗雷德里克·A·弗里奇 | 用于在洁净空间中垂直定位基片处理设备的方法和装置 |
US7896602B2 (en) | 2006-06-09 | 2011-03-01 | Lutz Rebstock | Workpiece stocker with circular configuration |
JP2008032335A (ja) * | 2006-07-31 | 2008-02-14 | Hitachi High-Technologies Corp | ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法 |
US20090028669A1 (en) * | 2007-07-25 | 2009-01-29 | Dynamic Micro Systems | Removable compartments for workpiece stocker |
US20080112787A1 (en) | 2006-11-15 | 2008-05-15 | Dynamic Micro Systems | Removable compartments for workpiece stocker |
CA2750852A1 (en) | 2008-12-23 | 2010-07-01 | Xoma, Technology Ltd. | Flexible manufacturing system |
JP5083278B2 (ja) * | 2009-06-15 | 2012-11-28 | 村田機械株式会社 | 装置前自動倉庫 |
CN102575858B (zh) | 2009-08-16 | 2015-02-04 | G-Con制造有限公司 | 组件式自足可移动的净化房 |
US9795957B2 (en) | 2009-08-16 | 2017-10-24 | G-Con Manufacturing, Inc. | Modular, self-contained, mobile clean room |
US8603217B2 (en) * | 2011-02-01 | 2013-12-10 | Universal Laser Systems, Inc. | Recirculating filtration systems for material processing systems and associated methods of use and manufacture |
CN103481297B (zh) * | 2012-06-08 | 2016-04-06 | 株式会社安川电机 | 机器人室元、机器人室元的组装方法以及机器人*** |
US9668375B2 (en) * | 2013-03-15 | 2017-05-30 | Yahoo! Inc. | Atmospheric cooling of servers in a data center |
EP3058147B1 (de) * | 2013-10-14 | 2022-12-14 | G-CON Manufacturing Inc. | Verbundungseinheit zum verbinden modularer mobiler räume und entsprechende methode zur verbindung |
TWI678751B (zh) * | 2013-12-13 | 2019-12-01 | 日商昕芙旎雅股份有限公司 | 設備前端模組(efem) |
JP6349750B2 (ja) * | 2014-01-31 | 2018-07-04 | シンフォニアテクノロジー株式会社 | Efem |
CN103753605B (zh) * | 2014-02-21 | 2015-09-16 | 江西珍视明药业有限公司 | 一种五轴三自由度机械手臂内包材传递*** |
US10533758B2 (en) | 2014-07-11 | 2020-01-14 | G-Con Manufacturing Inc. | Modular parts that supply utilities to cleanroom, isolation or containment cubicles, pods, or modules |
JP6511858B2 (ja) * | 2015-02-27 | 2019-05-15 | シンフォニアテクノロジー株式会社 | 搬送室 |
JP2016178133A (ja) * | 2015-03-19 | 2016-10-06 | シンフォニアテクノロジー株式会社 | ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法 |
DE202015104817U1 (de) * | 2015-09-11 | 2015-10-09 | Krones Ag | Vorrichtung zur Bereitstellung von Reinluft in einer Getränkeabfüllanlage |
DE102017213861A1 (de) * | 2017-08-09 | 2019-02-14 | Krones Ag | Behälterbehandlungsanlage |
JP7037049B2 (ja) * | 2018-03-15 | 2022-03-16 | シンフォニアテクノロジー株式会社 | Efem |
DE102018207826A1 (de) * | 2018-05-18 | 2019-11-21 | Kuka Deutschland Gmbh | Handhabung, insbesondere, Transport von Gütern, insbesondere Wafern, durch einen Roboter |
US20200207559A1 (en) * | 2018-12-28 | 2020-07-02 | Int Tech Co., Ltd. | Dust-free system and method of manufacturing panel |
WO2021030568A1 (en) | 2019-08-15 | 2021-02-18 | G-Con Manufacturing, Inc. | Removable panel roof for modular, self-contained, mobile clean room |
DE102020117455A1 (de) | 2020-07-02 | 2022-01-05 | Bayerische Motoren Werke Aktiengesellschaft | Handhabungseinrichtung für eine Herstellungsumgebung |
US11492795B2 (en) | 2020-08-31 | 2022-11-08 | G-Con Manufacturing, Inc. | Ballroom-style cleanroom assembled from modular buildings |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7215945A (de) * | 1972-11-24 | 1974-05-28 | ||
JPS5619635A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Manufacturing apparatus |
JPS578047A (en) * | 1980-06-18 | 1982-01-16 | Hitachi Ltd | Working or assembling equipment |
JPS59106131A (ja) * | 1982-12-10 | 1984-06-19 | Fujitsu Ltd | 試料搬送方法 |
JPS60165446A (ja) * | 1984-02-07 | 1985-08-28 | Daifuku Co Ltd | クリ−ンル−ム用搬送設備 |
JPS60206017A (ja) * | 1984-03-30 | 1985-10-17 | Toshiba Corp | 清浄搬送システム |
JPS6162740A (ja) * | 1984-09-03 | 1986-03-31 | Sanki Eng Co Ltd | クリ−ントンネル送風清浄装置 |
JPS61235625A (ja) * | 1985-04-10 | 1986-10-20 | Takenaka Komuten Co Ltd | クリ−ンル−ム |
JPS625031A (ja) * | 1985-06-28 | 1987-01-12 | Kajima Corp | 部分的に清浄度の異なるクリ−ンル−ム |
US4667579A (en) * | 1985-10-03 | 1987-05-26 | Daw, Incorporated | Cleanroom structure |
US4787297A (en) * | 1987-08-27 | 1988-11-29 | Texas Instruments Incorporated | Stacked robotic work cell process station |
-
1988
- 1988-03-31 JP JP7848588A patent/JPH0756879B2/ja not_active Expired - Lifetime
- 1988-12-29 US US07/291,757 patent/US4923352A/en not_active Expired - Lifetime
-
1989
- 1989-01-16 EP EP89400122A patent/EP0335752B1/de not_active Expired - Lifetime
- 1989-01-16 DE DE68917968T patent/DE68917968T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02153546A (ja) | 1990-06-13 |
EP0335752A3 (de) | 1991-06-12 |
JPH0756879B2 (ja) | 1995-06-14 |
US4923352A (en) | 1990-05-08 |
DE68917968T2 (de) | 1995-04-27 |
EP0335752A2 (de) | 1989-10-04 |
EP0335752B1 (de) | 1994-09-07 |
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