DE68913524D1 - Laserüberschallöten. - Google Patents

Laserüberschallöten.

Info

Publication number
DE68913524D1
DE68913524D1 DE89912326T DE68913524T DE68913524D1 DE 68913524 D1 DE68913524 D1 DE 68913524D1 DE 89912326 T DE89912326 T DE 89912326T DE 68913524 T DE68913524 T DE 68913524T DE 68913524 D1 DE68913524 D1 DE 68913524D1
Authority
DE
Germany
Prior art keywords
surplusing
laser
laser surplusing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89912326T
Other languages
English (en)
Other versions
DE68913524T2 (de
Inventor
Peter Bullock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DE68913524D1 publication Critical patent/DE68913524D1/de
Application granted granted Critical
Publication of DE68913524T2 publication Critical patent/DE68913524T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B23K26/037—Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78261—Laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0106—Neodymium [Nd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE68913524T 1988-12-21 1989-10-23 Laserüberschallöten. Expired - Fee Related DE68913524T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/287,763 US4893742A (en) 1988-12-21 1988-12-21 Ultrasonic laser soldering
PCT/US1989/004714 WO1990007191A1 (en) 1988-12-21 1989-10-23 Ultrasonic laser soldering

Publications (2)

Publication Number Publication Date
DE68913524D1 true DE68913524D1 (de) 1994-04-07
DE68913524T2 DE68913524T2 (de) 1994-08-25

Family

ID=23104230

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68913524T Expired - Fee Related DE68913524T2 (de) 1988-12-21 1989-10-23 Laserüberschallöten.

Country Status (5)

Country Link
US (1) US4893742A (de)
EP (1) EP0406351B1 (de)
JP (1) JPH03502860A (de)
DE (1) DE68913524T2 (de)
WO (1) WO1990007191A1 (de)

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US5164566A (en) * 1990-06-12 1992-11-17 Microelectronics And Computer Technology Corp. Method and apparatus for fluxless solder reflow
US5207369A (en) * 1990-11-29 1993-05-04 Matsushita Electric Industrial Co., Ltd. Inner lead bonding apparatus
US5201453A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Linear, direct-drive microelectronic bonding apparatus and method
RU2095206C1 (ru) * 1992-01-17 1997-11-10 С.Л.Т.Джапан Ко., Лтд. Способ пайки
US5298715A (en) * 1992-04-27 1994-03-29 International Business Machines Corporation Lasersonic soldering of fine insulated wires to heat-sensitive substrates
US5249728A (en) * 1993-03-10 1993-10-05 Atmel Corporation Bumpless bonding process having multilayer metallization
JPH06342976A (ja) * 1993-06-01 1994-12-13 Nippondenso Co Ltd 基板の接続方法
JPH07221141A (ja) * 1994-02-03 1995-08-18 Matsushita Electric Ind Co Ltd 超音波ワイヤボンディング装置
US5580471A (en) * 1994-03-30 1996-12-03 Panasonic Technologies, Inc. Apparatus and method for material treatment and inspection using fiber-coupled laser diode
DE69405209T2 (de) * 1994-03-31 1998-03-19 Sgs Thomson Microelectronics Verbindungsvorrichtung für elektronische Halbleiter-Einheiter
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
US5562842A (en) * 1994-10-17 1996-10-08 Panasonic Technologies, Inc. Material treatment apparatus combining a laser diode and an illumination light with a video imaging system
US5509597A (en) * 1994-10-17 1996-04-23 Panasonic Technologies, Inc. Apparatus and method for automatic monitoring and control of a soldering process
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser
US5626280A (en) * 1995-06-05 1997-05-06 He Holdings, Inc. Infrared transparent soldering tool and infrared soldering method
DE19639993C2 (de) * 1995-09-18 2000-10-05 Hahn Meitner Inst Berlin Gmbh Vorrichtung zum berührungslosen, selektiven Ein- oder Auslöten von Bauelementen
US5739433A (en) * 1996-03-01 1998-04-14 University Of Central Florida Touch off probe
US5731244A (en) * 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US5821494A (en) * 1996-09-27 1998-10-13 International Business Machines Corporation Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
US5938952A (en) * 1997-01-22 1999-08-17 Equilasers, Inc. Laser-driven microwelding apparatus and process
US5948286A (en) * 1997-02-06 1999-09-07 International Business Machines Corporation Diffusion bonding of lead interconnections using precise laser-thermosonic energy
US5921460A (en) * 1997-06-05 1999-07-13 Ford Motor Company Method of soldering materials supported on low-melting substrates
JPH11145188A (ja) * 1997-11-10 1999-05-28 Sony Corp 半導体装置及びその製造方法
US6056185A (en) * 1998-03-18 2000-05-02 Ga-Tek Inc. Method of connecting batteries to electronic circuits
DE19814118A1 (de) * 1998-03-30 1999-10-14 F&K Delvotec Bondtechnik Gmbh Vorrichtung zum Thermokompressionsbonden, und Thermokompressionsbonden
US20090149479A1 (en) * 1998-11-02 2009-06-11 Elan Pharma International Limited Dosing regimen
JP3587748B2 (ja) * 1999-10-18 2004-11-10 ソニーケミカル株式会社 多層フレキシブル配線板及び多層フレキシブル配線板製造方法
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
IT1311304B1 (it) * 1999-12-07 2002-03-12 Bruno Bisiach Piede di appoggio per teste di saldatura.
US6329629B1 (en) * 2000-04-28 2001-12-11 Branson Ultrasonics Corporation Distance mode control for laser welding
US6478212B1 (en) * 2001-01-16 2002-11-12 International Business Machines Corporation Bond pad structure and method for reduced downward force wirebonding
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6520399B1 (en) * 2001-09-14 2003-02-18 Raytheon Company Thermosonic bonding apparatus, tool, and method
US6641027B2 (en) 2001-12-18 2003-11-04 Ngk Spark Plug Co., Ltd. Method of connecting electric leads to battery tabs
DE10205609A1 (de) * 2002-02-11 2003-08-28 Infineon Technologies Ag Anordnung zum Drahtbonden und Verfahren zur Herstellung einer Bondverbindung
US6776328B2 (en) † 2002-09-17 2004-08-17 The Boeing Company Radiation assisted friction welding
EP1535689A3 (de) * 2003-11-26 2006-09-20 International Business Machines Corporation Verfahren zum flussmittelfrei Löten von Werkstucken
US20050109746A1 (en) * 2003-11-26 2005-05-26 International Business Machines Corporation Method for fluxless soldering of workpieces
US7677432B2 (en) * 2005-05-03 2010-03-16 Texas Instruments Incorporated Spot heat wirebonding
KR101180916B1 (ko) * 2007-11-20 2012-09-07 삼성테크윈 주식회사 카메라 모듈 본딩장치, 이를 구비한 카메라 모듈 조립장비및 이를 이용한 카메라 모듈 조립방법
SG155779A1 (en) * 2008-03-10 2009-10-29 Micron Technology Inc Apparatus and methods of forming wire bonds
EP2100686A1 (de) * 2008-03-11 2009-09-16 ProLas GmbH Verfahren zum Verlöten von metallischen Fügepartnern sowie Vorrichtung dafür
US9059074B2 (en) * 2008-03-26 2015-06-16 Stats Chippac Ltd. Integrated circuit package system with planar interconnect
US8436251B2 (en) 2009-07-08 2013-05-07 Medtronic, Inc. Ribbon connecting electrical components
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN104842069A (zh) * 2014-02-13 2015-08-19 泰科电子(上海)有限公司 激光焊接***
TWI610411B (zh) * 2014-08-14 2018-01-01 艾馬克科技公司 用於半導體晶粒互連的雷射輔助接合
DE102017104097A1 (de) * 2017-02-28 2018-08-30 Pac Tech-Packaging Technologies Gmbh Verfahren und Laseranordnung zum Aufschmelzen eines Lotmaterialdepots mittels Laserenergie
CN109759666B (zh) * 2017-07-11 2020-12-04 温州职业技术学院 一种整流二极管装配件的激光锡焊方法
CN114502315A (zh) * 2019-09-06 2022-05-13 崇德超声波有限公司 用于焊接至少两个部件的焊接设备及方法
DE102019124334A1 (de) * 2019-09-11 2021-03-11 Hesse Gmbh Bondanordnung und Bondwerkzeug
CN216576042U (zh) * 2021-11-03 2022-05-24 必能信超声(上海)有限公司 一种模块化设计的超声波金属焊机架

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US3734382A (en) * 1972-04-03 1973-05-22 Motorola Inc Apparatus for control of welding apparatus
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US3874963A (en) * 1973-11-08 1975-04-01 Kuss & Co R L Sonic bonding process
SU642114A1 (ru) * 1977-02-18 1979-01-15 Предприятие П/Я Х-5263 Способ диффузионной сварки
JPS5925378B2 (ja) * 1980-05-23 1984-06-16 松下電器産業株式会社 電子部品の実装方法
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JPS58209493A (ja) * 1982-05-28 1983-12-06 Nippon Univac Kk 光溶接装置
JPS592333A (ja) * 1982-06-28 1984-01-07 Toshiba Corp ワイヤボンデイング装置
JPS59175736A (ja) * 1983-03-25 1984-10-04 Fujitsu Ltd ワイヤボンデイング装置
US4534811A (en) * 1983-12-30 1985-08-13 International Business Machines Corporation Apparatus for thermo bonding surfaces
JPS61101043A (ja) * 1984-10-24 1986-05-19 Hitachi Ltd ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH03502860A (ja) 1991-06-27
DE68913524T2 (de) 1994-08-25
EP0406351B1 (de) 1994-03-02
WO1990007191A1 (en) 1990-06-28
US4893742A (en) 1990-01-16
EP0406351A1 (de) 1991-01-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee