DE60333174D1 - Herstellungsverfahren für eine sic-monitor-wafer - Google Patents

Herstellungsverfahren für eine sic-monitor-wafer

Info

Publication number
DE60333174D1
DE60333174D1 DE60333174T DE60333174T DE60333174D1 DE 60333174 D1 DE60333174 D1 DE 60333174D1 DE 60333174 T DE60333174 T DE 60333174T DE 60333174 T DE60333174 T DE 60333174T DE 60333174 D1 DE60333174 D1 DE 60333174D1
Authority
DE
Germany
Prior art keywords
manufacturing process
monitor wafer
sic monitor
sic
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60333174T
Other languages
English (en)
Inventor
Isao Yamada
Jiro Matsuo
Noriaki Toyoda
Kazutoshi Murata
Naomasa Miyatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Engineering and Shipbuilding Co Ltd
Original Assignee
Mitsui Engineering and Shipbuilding Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Engineering and Shipbuilding Co Ltd filed Critical Mitsui Engineering and Shipbuilding Co Ltd
Application granted granted Critical
Publication of DE60333174D1 publication Critical patent/DE60333174D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32—Carbides
    • C23C16/325—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/931—Silicon carbide semiconductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
DE60333174T 2002-02-22 2003-01-10 Herstellungsverfahren für eine sic-monitor-wafer Expired - Lifetime DE60333174D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002045725A JP3881562B2 (ja) 2002-02-22 2002-02-22 ＳｉＣモニタウェハ製造方法
PCT/JP2003/000175 WO2003071588A1 (en) 2002-02-22 2003-01-10 Production method of sic monitor wafer

Publications (1)

Publication Number Publication Date
DE60333174D1 true DE60333174D1 (de) 2010-08-12

Family

ID=27750595

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60333174T Expired - Lifetime DE60333174D1 (de) 2002-02-22 2003-01-10 Herstellungsverfahren für eine sic-monitor-wafer

Country Status (7)

Country Link
US (1) US7022545B2 (de)
EP (1) EP1483782B1 (de)
JP (1) JP3881562B2 (de)
KR (1) KR100857751B1 (de)
DE (1) DE60333174D1 (de)
TW (1) TW583733B (de)
WO (1) WO2003071588A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2846788B1 (fr) * 2002-10-30 2005-06-17 Procede de fabrication de substrats demontables
FR2857895B1 (fr) * 2003-07-23 2007-01-26 Soitec Silicon On Insulator Procede de preparation de surface epiready sur films minces de sic
JP3816484B2 (ja) * 2003-12-15 2006-08-30 日本航空電子工業株式会社 ドライエッチング方法
US7323111B1 (en) * 2004-01-30 2008-01-29 Metadigm Llc Angle control of multi-cavity molded components for MEMS and NEMS group assembly
JP2008502150A (ja) * 2004-06-03 2008-01-24 エピオン コーポレーション 改善された二重ダマシン集積構造およびその製造方法
JP4665443B2 (ja) * 2004-06-22 2011-04-06 旭硝子株式会社 ガラス基板の研磨方法
US7314520B2 (en) 2004-10-04 2008-01-01 Cree, Inc. Low 1c screw dislocation 3 inch silicon carbide wafer
US7514725B2 (en) * 2004-11-30 2009-04-07 Spire Corporation Nanophotovoltaic devices
US7405152B2 (en) 2005-01-31 2008-07-29 International Business Machines Corporation Reducing wire erosion during damascene processing
DE102005024073A1 (de) * 2005-05-25 2006-11-30 Siltronic Ag Halbleiter-Schichtstruktur und Verfahren zur Herstellung einer Halbleiter-Schichtstruktur
US7709344B2 (en) 2005-11-22 2010-05-04 International Business Machines Corporation Integrated circuit fabrication process using gas cluster ion beam etching
EP1988854A2 (de) * 2006-02-15 2008-11-12 M. S. Abdou Vorrichtungen und verfahren zur positionierung orthopädischer bandscheibenvorrichtungen
KR100795363B1 (ko) 2006-11-24 2008-01-17 삼성전자주식회사 반도체 소자의 도전성 배선 및 이의 형성방법과 이를구비하는 플래시 메모리 장치 및 이의 제조 방법
EP2172967A1 (de) 2008-08-04 2010-04-07 Siltronic AG Verfahren zur Herstellung von Siliciumcarbid
US8226835B2 (en) * 2009-03-06 2012-07-24 Tel Epion Inc. Ultra-thin film formation using gas cluster ion beam processing
JP5236687B2 (ja) * 2010-05-26 2013-07-17 兵庫県 表面処理方法及び表面処理装置
US8193094B2 (en) 2010-06-21 2012-06-05 Taiwan Semiconductor Manufacturing Company, Ltd. Post CMP planarization by cluster ION beam etch
JP4956649B2 (ja) * 2010-07-06 2012-06-20 三井造船株式会社 炭化珪素基板、半導体装置およびｓｏｉウエハ
DE112012002299T5 (de) 2011-06-02 2014-05-15 Sumitomo Electric Industries, Ltd. Verfahren zum Herstellen eines Siliziumkarbidsubstrates
KR101926687B1 (ko) * 2011-10-24 2018-12-07 엘지이노텍 주식회사 에피 웨이퍼 제조 장치, 에피 웨이퍼 제조 방법 및 에피 웨이퍼
KR101158343B1 (ko) 2011-12-29 2012-06-22 주식회사 티씨케이 실리콘 카바이드 구조물 및 그 제조방법
US8860040B2 (en) 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9240357B2 (en) 2013-04-25 2016-01-19 Samsung Electronics Co., Ltd. Method of fabricating semiconductor device having preliminary stacked structure with offset oxide etched using gas cluster ion
US20150361585A1 (en) * 2013-06-04 2015-12-17 Nippon Steel & Sumitomo Metal Corporation Method for manufacturing sic single-crystal substrate for epitaxial sic wafer, and sic single-crystal substrate for epitaxial sic wafer
CN104779135A (zh) * 2014-01-10 2015-07-15 上海华虹宏力半导体制造有限公司 在批量式多晶硅沉积制程中消除控片影响的方法
WO2016006663A1 (ja) * 2014-07-10 2016-01-14 株式会社豊田自動織機 半導体基板および半導体基板の製造方法
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
JP6444249B2 (ja) * 2015-04-15 2018-12-26 株式会社ディスコ ウエーハの生成方法
US10654150B2 (en) 2017-12-26 2020-05-19 Industrial Technology Research Institute Grinding disk and method of manufacturing the same
JP7220844B2 (ja) * 2018-11-30 2023-02-13 住友金属鉱山株式会社 ＳｉＣ多結晶基板の製造方法
JP7234703B2 (ja) * 2019-03-11 2023-03-08 住友金属鉱山株式会社 炭化ケイ素多結晶基板の製造方法、及び、炭化ケイ素多結晶基板の製造装置
JP7385459B2 (ja) * 2019-12-19 2023-11-22 イビデン株式会社 非酸化物系気相成長セラミック材料の形成用の型、非酸化物系気相成長セラミック材料、及び、非酸化物系気相成長セラミック材料の形成用の型の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1147806A (zh) * 1995-03-01 1997-04-16 圣戈本/诺顿工业搪瓷有限公司 新颖的碳化硅仿真晶片
US6534380B1 (en) * 1997-07-18 2003-03-18 Denso Corporation Semiconductor substrate and method of manufacturing the same
JPH1187202A (ja) * 1997-09-09 1999-03-30 Mitsui Eng & Shipbuild Co Ltd 炭化ケイ素モニタウエハ
JP3525038B2 (ja) * 1997-09-09 2004-05-10 三井造船株式会社 ＳｉＣダミーウェハ
JPH11121311A (ja) * 1997-10-13 1999-04-30 Mitsui Eng & Shipbuild Co Ltd 炭化ケイ素材およびその製造方法並びに炭化ケイ素ウエハ
JPH11121312A (ja) * 1997-10-13 1999-04-30 Mitsui Eng & Shipbuild Co Ltd 炭化ケイ素ウエハ
JP4531870B2 (ja) * 1997-10-14 2010-08-25 三井造船株式会社 多層炭化ケイ素ウエハ
JP3733762B2 (ja) * 1997-11-07 2006-01-11 旭硝子株式会社 ダミーウエハ及びその製造法
JPH11199323A (ja) * 1998-01-14 1999-07-27 Tokai Carbon Co Ltd ダミーウエハ
JP4275767B2 (ja) * 1998-05-28 2009-06-10 東洋炭素株式会社 炭化ケイ素質ダミーウェハの製造方法
JP3857446B2 (ja) * 1998-12-01 2006-12-13 東海カーボン株式会社 ＳｉＣ成形体
JP2000178751A (ja) * 1998-12-16 2000-06-27 Ngk Insulators Ltd 炭化珪素体の製造方法
JP2000243706A (ja) * 1999-02-22 2000-09-08 Asahi Glass Co Ltd Ｃｖｄ膜の形成方法およびダミーウエハ
US6375790B1 (en) * 1999-07-19 2002-04-23 Epion Corporation Adaptive GCIB for smoothing surfaces
US6614576B2 (en) * 2000-12-15 2003-09-02 Texas Instruments Incorporated Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices
JP2002237008A (ja) * 2001-02-08 2002-08-23 Hitachi Ltd 薄膜磁気ヘッド
ATE504082T1 (de) * 2003-05-27 2011-04-15 Soitec Silicon On Insulator Verfahren zur herstellung einer heteroepitaktischen mikrostruktur
FR2857895B1 (fr) * 2003-07-23 2007-01-26 Soitec Silicon On Insulator Procede de preparation de surface epiready sur films minces de sic

Also Published As

Publication number Publication date
US20050042800A1 (en) 2005-02-24
US7022545B2 (en) 2006-04-04
WO2003071588A1 (en) 2003-08-28
KR20040080004A (ko) 2004-09-16
EP1483782A1 (de) 2004-12-08
JP2003249426A (ja) 2003-09-05
TW200303580A (en) 2003-09-01
TW583733B (en) 2004-04-11
KR100857751B1 (ko) 2008-09-09
EP1483782B1 (de) 2010-06-30
JP3881562B2 (ja) 2007-02-14
EP1483782A4 (de) 2008-05-21

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