DE60228784D1 - Lichtduchlässiges Polierkissen für eine Halbleiterschleife - Google Patents

Lichtduchlässiges Polierkissen für eine Halbleiterschleife

Info

Publication number
DE60228784D1
DE60228784D1 DE60228784T DE60228784T DE60228784D1 DE 60228784 D1 DE60228784 D1 DE 60228784D1 DE 60228784 T DE60228784 T DE 60228784T DE 60228784 T DE60228784 T DE 60228784T DE 60228784 D1 DE60228784 D1 DE 60228784D1
Authority
DE
Germany
Prior art keywords
light
polishing pad
semiconductor loop
permeable polishing
permeable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60228784T
Other languages
English (en)
Inventor
Kou Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001128482A external-priority patent/JP3826728B2/ja
Priority claimed from JP2001128483A external-priority patent/JP3826729B2/ja
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60228784D1 publication Critical patent/DE60228784D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60228784T 2001-04-25 2002-04-24 Lichtduchlässiges Polierkissen für eine Halbleiterschleife Expired - Lifetime DE60228784D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001128482A JP3826728B2 (ja) 2001-04-25 2001-04-25 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2001128483A JP3826729B2 (ja) 2001-04-25 2001-04-25 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Publications (1)

Publication Number Publication Date
DE60228784D1 true DE60228784D1 (de) 2008-10-23

Family

ID=26614233

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60228784T Expired - Lifetime DE60228784D1 (de) 2001-04-25 2002-04-24 Lichtduchlässiges Polierkissen für eine Halbleiterschleife

Country Status (4)

Country Link
US (1) US6855034B2 (de)
EP (1) EP1252973B1 (de)
KR (1) KR100858392B1 (de)
DE (1) DE60228784D1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
US6752690B1 (en) * 2002-06-12 2004-06-22 Clinton O. Fruitman Method of making polishing pad for planarization of semiconductor wafers
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW200530378A (en) 2003-03-11 2005-09-16 Toyo Tire & Rubber Co Polishing pad and semiconductor device manufacturing method
EP1466699A1 (de) * 2003-04-09 2004-10-13 JSR Corporation Polierkissen, Verfahren und Metallgiessform zur Herstellung desselben und Halbleiterscheibepolierverfahren
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
KR100541545B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
KR100526877B1 (ko) * 2003-06-23 2005-11-09 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비의 폴리싱 패드
US7183213B2 (en) 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
EP1561541B1 (de) * 2004-02-05 2008-04-30 JSR Corporation Chemisch-mechanisches Polierkissen und Polierverfahren
US7323415B2 (en) * 2004-04-23 2008-01-29 Jsr Corporation Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US20090017729A1 (en) * 2004-08-25 2009-01-15 Jh Rhodes Company, Inc. Polishing pad and methods of improving pad removal rates and planarization
US20060291530A1 (en) * 2005-06-23 2006-12-28 Alexander Tregub Treatment of CMP pad window to improve transmittance
TW200709892A (en) * 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP4931133B2 (ja) * 2007-03-15 2012-05-16 東洋ゴム工業株式会社 研磨パッド
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
CN102301455A (zh) * 2009-01-27 2011-12-28 因诺派德公司 包含形成图案的结构区域的化学机械平坦化垫
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US8506355B1 (en) * 2010-01-04 2013-08-13 Applied Micro Circuits Corporation System and method for in-situ inspection during metallurgical cross-sectioning
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8393940B2 (en) 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8367429B2 (en) * 2011-03-10 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Adaptive endpoint method for pad life effect on chemical mechanical polishing
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US20140120802A1 (en) * 2012-10-31 2014-05-01 Wayne O. Duescher Abrasive platen wafer surface optical monitoring system
CN105453232B (zh) * 2013-08-10 2019-04-05 应用材料公司 具有促进受控的调节的材料组成的cmp垫
US9352443B2 (en) * 2013-11-13 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Platen assembly, chemical-mechanical polisher, and method for polishing substrate
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
JP6743785B2 (ja) * 2017-08-30 2020-08-19 株式会社Sumco キャリアの製造方法およびウェーハの研磨方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6074287A (en) 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
JP3239764B2 (ja) * 1996-07-17 2001-12-17 株式会社ニコン Ｃｍｐ用研磨装置及び研磨ポリシャ
DE19720623C1 (de) 1997-05-16 1998-11-05 Siemens Ag Poliervorrichtung und Poliertuch
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6190234B1 (en) 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
KR20020072548A (ko) 1999-12-14 2002-09-16 로델 홀딩스 인코포레이티드 중합체 연마 패드 또는 중합체 복합재 연마 패드의 제조방법
WO2001062440A1 (en) * 2000-02-25 2001-08-30 Rodel Holdings, Inc. Polishing pad with a transparent portion

Also Published As

Publication number Publication date
EP1252973B1 (de) 2008-09-10
US20020173231A1 (en) 2002-11-21
US6855034B2 (en) 2005-02-15
EP1252973A1 (de) 2002-10-30
KR20020083136A (ko) 2002-11-01
KR100858392B1 (ko) 2008-09-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition