DE60313777D1 - Optisches halbleiterbauelement - Google Patents
Optisches halbleiterbauelementInfo
- Publication number
- DE60313777D1 DE60313777D1 DE60313777T DE60313777T DE60313777D1 DE 60313777 D1 DE60313777 D1 DE 60313777D1 DE 60313777 T DE60313777 T DE 60313777T DE 60313777 T DE60313777 T DE 60313777T DE 60313777 D1 DE60313777 D1 DE 60313777D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor element
- optical semiconductor
- optical
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
- Optical Transform (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002204782A JP4046564B2 (ja) | 2002-07-12 | 2002-07-12 | 光半導体装置 |
JP2002204782 | 2002-07-12 | ||
PCT/JP2003/008859 WO2004008594A1 (ja) | 2002-07-12 | 2003-07-11 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60313777D1 true DE60313777D1 (de) | 2007-06-21 |
DE60313777T2 DE60313777T2 (de) | 2008-01-24 |
Family
ID=30112738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60313777T Expired - Lifetime DE60313777T2 (de) | 2002-07-12 | 2003-07-11 | Optisches halbleiterbauelement |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050067698A1 (de) |
EP (1) | EP1523078B1 (de) |
JP (1) | JP4046564B2 (de) |
CA (1) | CA2468441C (de) |
DE (1) | DE60313777T2 (de) |
WO (1) | WO2004008594A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100575969B1 (ko) * | 2003-11-14 | 2006-05-02 | 삼성전자주식회사 | 티오-캔 구조의 광 모듈 |
US7317742B2 (en) * | 2004-02-19 | 2008-01-08 | Sumitomo Electric Industries, Ltd. | Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly |
JP4599091B2 (ja) * | 2004-05-19 | 2010-12-15 | 日本オプネクスト株式会社 | 光モジュールおよび光伝送装置 |
JP4815814B2 (ja) * | 2005-02-04 | 2011-11-16 | 三菱電機株式会社 | 光モジュール |
JP2006222263A (ja) * | 2005-02-10 | 2006-08-24 | Mitsubishi Electric Corp | 光半導体装置 |
JP2006303668A (ja) * | 2005-04-18 | 2006-11-02 | Matsushita Electric Ind Co Ltd | 出力インピーダンス可変回路 |
JP2006332372A (ja) * | 2005-05-26 | 2006-12-07 | Sumitomo Electric Ind Ltd | 光モジュール |
JP4506640B2 (ja) | 2005-10-19 | 2010-07-21 | 住友電気工業株式会社 | 半導体レーザ駆動回路 |
JP4814769B2 (ja) * | 2006-11-29 | 2011-11-16 | 日本オプネクスト株式会社 | 光送信器 |
US7901144B2 (en) * | 2008-03-14 | 2011-03-08 | Finisar Corporation | Optical interconnect solution |
US7806602B2 (en) * | 2008-03-14 | 2010-10-05 | Finisar Corporation | Optical micro-connector |
JP2011053354A (ja) * | 2009-08-31 | 2011-03-17 | Toshiba Corp | 光電気配線フィルムおよび光電気配線モジュール |
US9379819B1 (en) * | 2014-01-03 | 2016-06-28 | Google Inc. | Systems and methods for reducing temperature in an optical signal source co-packaged with a driver |
JP6376377B2 (ja) * | 2014-05-30 | 2018-08-22 | 住友電工デバイス・イノベーション株式会社 | 光学装置 |
JP6502797B2 (ja) * | 2015-08-31 | 2019-04-17 | 日本オクラロ株式会社 | 光モジュール |
CN111971864B (zh) * | 2018-04-06 | 2022-08-02 | Ipg光子公司 | 具有高压隔离功能的海底光中继器 |
EP3845915B1 (de) * | 2018-09-20 | 2022-11-02 | Huawei Technologies Co., Ltd. | Photoelektronenkomponente und herstellungsverfahren dafür |
JP2021048206A (ja) * | 2019-09-18 | 2021-03-25 | ソニーセミコンダクタソリューションズ株式会社 | 半導体レーザ駆動装置、電子機器、および、半導体レーザ駆動装置の製造方法 |
JP7350646B2 (ja) * | 2019-12-17 | 2023-09-26 | CIG Photonics Japan株式会社 | 光モジュール |
JP7369047B2 (ja) | 2020-01-30 | 2023-10-25 | CIG Photonics Japan株式会社 | 光モジュール及び光伝送装置 |
US11340412B2 (en) * | 2020-02-28 | 2022-05-24 | CIG Photonics Japan Limited | Optical module |
JP2022149255A (ja) * | 2021-03-25 | 2022-10-06 | 日本電信電話株式会社 | 送信インターフェースおよび送信装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873566A (en) * | 1985-10-28 | 1989-10-10 | American Telephone And Telegraph Company | Multilayer ceramic laser package |
JPS62206570A (ja) * | 1986-03-07 | 1987-09-11 | Citizen Watch Co Ltd | レ−ザ−ダイオ−ドパルス点燈回路 |
JPH01251801A (ja) * | 1988-03-30 | 1989-10-06 | Ngk Spark Plug Co Ltd | 三導体構造フィルタ |
US5260956A (en) * | 1991-09-30 | 1993-11-09 | Nikon Corporation | Laser drive circuit |
JP2954422B2 (ja) * | 1992-05-22 | 1999-09-27 | 株式会社日立製作所 | 光送信モジュール |
US5646560A (en) * | 1994-09-30 | 1997-07-08 | National Semiconductor Corporation | Integrated low-power driver for a high-current laser diode |
JP3432620B2 (ja) * | 1994-12-20 | 2003-08-04 | 富士通株式会社 | 光送信機及びレーザダイオードモジュール |
JPH0955630A (ja) * | 1995-08-14 | 1997-02-25 | Hitachi Ltd | 出力バッファ回路及び光変調器の駆動装置 |
JPH09115166A (ja) * | 1995-10-16 | 1997-05-02 | Sony Corp | 半導体レーザ素子の出力制御装置 |
US5760939A (en) * | 1995-10-23 | 1998-06-02 | Sdl, Inc. | Optical transmission link capable of high temperature operation without cooling with an optical receiver module having temperature independent sensitivity performance and optical transmitter module with laser diode source |
JPH09283825A (ja) * | 1996-04-18 | 1997-10-31 | Kokusai Electric Co Ltd | 発光回路 |
US5982793A (en) * | 1996-05-20 | 1999-11-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser module with internal matching circuit |
US6181718B1 (en) * | 1997-01-08 | 2001-01-30 | Matsushita Electric Industrial Co., Ltd. | Electronically cooled semiconductor laser module with modified ground line inductance |
JP3379421B2 (ja) * | 1998-02-16 | 2003-02-24 | 住友電気工業株式会社 | レーザモジュール |
JP2002111118A (ja) * | 2000-09-28 | 2002-04-12 | Hitachi Cable Ltd | 光送信回路 |
US20030002551A1 (en) * | 2001-06-29 | 2003-01-02 | Broadband Transport Technologies, Inc. | Laser diode driver |
US20030086455A1 (en) * | 2001-10-24 | 2003-05-08 | Ciubotaru Alexamicu Amclian | High speed semiconductor vertical cavity surface emitting laser driver circuit |
-
2002
- 2002-07-12 JP JP2002204782A patent/JP4046564B2/ja not_active Expired - Fee Related
-
2003
- 2003-07-11 WO PCT/JP2003/008859 patent/WO2004008594A1/ja active IP Right Grant
- 2003-07-11 EP EP03764178A patent/EP1523078B1/de not_active Expired - Fee Related
- 2003-07-11 US US10/500,325 patent/US20050067698A1/en not_active Abandoned
- 2003-07-11 CA CA002468441A patent/CA2468441C/en not_active Expired - Fee Related
- 2003-07-11 DE DE60313777T patent/DE60313777T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1523078A1 (de) | 2005-04-13 |
DE60313777T2 (de) | 2008-01-24 |
US20050067698A1 (en) | 2005-03-31 |
EP1523078B1 (de) | 2007-05-09 |
JP2004047832A (ja) | 2004-02-12 |
JP4046564B2 (ja) | 2008-02-13 |
WO2004008594A1 (ja) | 2004-01-22 |
CA2468441C (en) | 2009-12-15 |
CA2468441A1 (en) | 2004-01-22 |
EP1523078A4 (de) | 2006-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |