DE60224543D1 - Klebeband - Google Patents
KlebebandInfo
- Publication number
- DE60224543D1 DE60224543D1 DE60224543T DE60224543T DE60224543D1 DE 60224543 D1 DE60224543 D1 DE 60224543D1 DE 60224543 T DE60224543 T DE 60224543T DE 60224543 T DE60224543 T DE 60224543T DE 60224543 D1 DE60224543 D1 DE 60224543D1
- Authority
- DE
- Germany
- Prior art keywords
- duct tape
- duct
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001250134 | 2001-08-21 | ||
JP2001250134A JP4869517B2 (ja) | 2001-08-21 | 2001-08-21 | 粘接着テープ |
PCT/JP2002/008127 WO2003017363A1 (en) | 2001-08-21 | 2002-08-08 | Adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60224543D1 true DE60224543D1 (de) | 2008-02-21 |
DE60224543T2 DE60224543T2 (de) | 2009-01-29 |
Family
ID=19079017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60224543T Expired - Fee Related DE60224543T2 (de) | 2001-08-21 | 2002-08-08 | Klebeband |
Country Status (9)
Country | Link |
---|---|
US (1) | US7135224B2 (de) |
EP (1) | EP1419527B1 (de) |
JP (1) | JP4869517B2 (de) |
KR (1) | KR100755175B1 (de) |
CN (1) | CN1322580C (de) |
DE (1) | DE60224543T2 (de) |
MY (1) | MY134364A (de) |
TW (1) | TWI299354B (de) |
WO (1) | WO2003017363A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7534498B2 (en) | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
JP4565804B2 (ja) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
KR100534406B1 (ko) * | 2002-08-03 | 2005-12-08 | 김영길 | 정전기에 의한 쇼크를 방지할 수 있는 스티커를 부착한 차량용 도어 |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
KR100583713B1 (ko) * | 2003-01-22 | 2006-05-25 | 간사이 페인트 가부시키가이샤 | 광파이버용 피복조성물 및 피복 광파이버 |
JP4025223B2 (ja) * | 2003-03-17 | 2007-12-19 | 住友ベークライト株式会社 | ダイボンディング用フィルム状接着剤並びにそれを用いた半導体装置の製造方法及び半導体装置 |
JP4004047B2 (ja) * | 2003-03-25 | 2007-11-07 | 住友ベークライト株式会社 | ダイシングシート機能付きダイアタッチフィルム並びにそれを用いた半導体装置の製造方法及び半導体装置 |
JP3710457B2 (ja) * | 2003-05-22 | 2005-10-26 | 住友ベークライト株式会社 | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
EP1650790B1 (de) * | 2003-07-08 | 2010-04-28 | LINTEC Corporation | Härtbare selbstklebefolie zum zertrennen bzw. chip-bonden und verfahren zur herstellung eines halbleiterbauelements |
JP2005150235A (ja) * | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
JP4405246B2 (ja) | 2003-11-27 | 2010-01-27 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体チップの製造方法 |
US7273894B2 (en) * | 2003-12-02 | 2007-09-25 | Eastman Chemical Company | Compositions for the preparation of void-containing articles |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4027332B2 (ja) * | 2004-03-19 | 2007-12-26 | リンテック株式会社 | 半導体用粘接着シートおよび半導体装置の製造方法 |
US20060252234A1 (en) * | 2004-07-07 | 2006-11-09 | Lintec Corporation | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
US20070004813A1 (en) * | 2004-09-16 | 2007-01-04 | Eastman Chemical Company | Compositions for the preparation of void-containing articles |
US20060121219A1 (en) * | 2004-12-07 | 2006-06-08 | Eastman Chemical Co. | Void-containing polyester shrink film with improved density retention |
JP2006054437A (ja) * | 2005-07-08 | 2006-02-23 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
TWI448527B (zh) * | 2005-11-08 | 2014-08-11 | Toyo Ink Mfg Co | 硬化性電磁波遮蔽性黏著性薄膜,其製造方法,及其使用方法,暨電磁波遮蔽物之製造方法及電磁波遮蔽物 |
KR100909169B1 (ko) * | 2006-09-11 | 2009-07-23 | 제일모직주식회사 | 선 경화형 반도체 조립용 접착 필름 조성물 |
US20080063871A1 (en) * | 2006-09-11 | 2008-03-13 | Jung Ki S | Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
CN101506948B (zh) * | 2006-09-12 | 2012-12-12 | 日东电工株式会社 | 切割/芯片焊接膜 |
JP2007043198A (ja) * | 2006-10-20 | 2007-02-15 | Sumitomo Bakelite Co Ltd | ダイボンディング用フィルム状接着剤並びにそれを用いた半導体装置の製造方法及び半導体装 |
JP4356730B2 (ja) * | 2006-10-20 | 2009-11-04 | 住友ベークライト株式会社 | ダイボンディング用フィルム状接着剤並びにそれを用いた半導体装置の製造方法及び半導体装置 |
US9725549B2 (en) * | 2006-10-27 | 2017-08-08 | Basf Se | Radiation-curable mixture containing low-molecular, ethylenically unsaturated compounds having non-aromatic ring systems |
TW200842174A (en) * | 2006-12-27 | 2008-11-01 | Cheil Ind Inc | Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same |
JP4778472B2 (ja) * | 2007-05-08 | 2011-09-21 | 日東電工株式会社 | 粘着型光学フィルムおよび画像表示装置 |
US20100173164A1 (en) * | 2007-06-22 | 2010-07-08 | Sumitomo Bakelite Company Limited | Adhesive film and semiconductor device having the same |
KR101403282B1 (ko) * | 2007-10-05 | 2014-06-02 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체 |
JP4717051B2 (ja) * | 2007-11-08 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4893640B2 (ja) * | 2008-01-22 | 2012-03-07 | 住友ベークライト株式会社 | 半導体用接着フィルム及びこれを用いた半導体装置 |
EP2254147A1 (de) * | 2008-03-14 | 2010-11-24 | Sumitomo Bakelite Co., Ltd. | Harzlack zur herstellung einer klebefolie für ein halbleiterbauelement, klebefolie für halbleiterbauelement und halbleiterbauelement |
KR101075192B1 (ko) * | 2009-03-03 | 2011-10-21 | 도레이첨단소재 주식회사 | 전자부품 제조용 점착테이프 |
JP2010229218A (ja) * | 2009-03-26 | 2010-10-14 | Dic Corp | 硬化性樹脂組成物、その硬化物、及び電子部品用樹脂材料 |
KR101038741B1 (ko) * | 2010-04-07 | 2011-06-03 | 한국전기연구원 | 팬텀을 이용하여 구조좌표를 측정하기 위한 x―선 유방암진단 시스템 및 그 방법 |
JP5686436B2 (ja) * | 2011-03-31 | 2015-03-18 | リンテック株式会社 | 粘着剤組成物及び粘着シート |
JP5644896B2 (ja) | 2012-07-04 | 2014-12-24 | 大日本印刷株式会社 | 粘接着層及び粘接着シート |
US10329393B2 (en) | 2012-12-12 | 2019-06-25 | Eastman Chemical Company | Copolysters plasticized with polymeric plasticizer for shrink film applications |
TWI486419B (zh) * | 2012-12-27 | 2015-06-01 | Hon Hai Prec Ind Co Ltd | 膠帶 |
JP5678976B2 (ja) * | 2013-03-07 | 2015-03-04 | Dic株式会社 | 硬化性樹脂組成物、その硬化物、及び電子部品用樹脂材料 |
KR102031657B1 (ko) * | 2013-03-11 | 2019-10-14 | 동우 화인켐 주식회사 | 광학용 점착제 조성물 및 이를 함유한 점착필름 |
WO2015146936A1 (ja) | 2014-03-24 | 2015-10-01 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物 |
JP6488554B2 (ja) | 2014-04-23 | 2019-03-27 | 大日本印刷株式会社 | コンクリートの剥落防止工事の作業時間短縮化方法 |
DE102016207540A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
DE102016207548A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
RU2019102014A (ru) * | 2016-06-28 | 2020-07-28 | Хантсман Эдванст Матириалз Лайсенсинг (Свитзеленд) Гмбх | Система электрической изоляции на основе эпоксидных смол для генераторов и двигателей |
KR102324899B1 (ko) * | 2016-06-29 | 2021-11-10 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 |
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JPWO2022181564A1 (de) * | 2021-02-24 | 2022-09-01 |
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DE2200021C3 (de) | 1972-01-03 | 1980-06-19 | Henkel Kgaa | Acrylsaeureester bzw. methacrylsaeureester von oh-gruppenhaltigen tricyclischen decanolen, verfahren zu deren herstellung sowie deren verwendung |
JPS55145726A (en) * | 1979-04-28 | 1980-11-13 | Hitachi Chem Co Ltd | Epoxy ester resin composition |
US4612209A (en) * | 1983-12-27 | 1986-09-16 | Ciba-Geigy Corporation | Process for the preparation of heat-curable adhesive films |
JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JPS60223139A (ja) | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | 半導体ウエハ固定用接着薄板 |
JPH0715087B2 (ja) | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
TW340967B (en) | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
DE60029205T2 (de) | 1999-02-15 | 2007-06-06 | Dsm Ip Assets B.V. | Harzzusammensetzung und gehärtetes produkt |
-
2001
- 2001-08-21 JP JP2001250134A patent/JP4869517B2/ja not_active Expired - Fee Related
-
2002
- 2002-08-08 WO PCT/JP2002/008127 patent/WO2003017363A1/en active IP Right Grant
- 2002-08-08 US US10/487,531 patent/US7135224B2/en not_active Expired - Lifetime
- 2002-08-08 CN CNB028164075A patent/CN1322580C/zh not_active Expired - Fee Related
- 2002-08-08 KR KR1020047002477A patent/KR100755175B1/ko active IP Right Grant
- 2002-08-08 DE DE60224543T patent/DE60224543T2/de not_active Expired - Fee Related
- 2002-08-08 EP EP02755877A patent/EP1419527B1/de not_active Expired - Fee Related
- 2002-08-14 MY MYPI20023008A patent/MY134364A/en unknown
- 2002-08-20 TW TW091118754A patent/TWI299354B/zh active
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WO2003017363A1 (en) | 2003-02-27 |
EP1419527A1 (de) | 2004-05-19 |
KR100755175B1 (ko) | 2007-09-03 |
JP2003055623A (ja) | 2003-02-26 |
JP4869517B2 (ja) | 2012-02-08 |
TWI299354B (de) | 2008-08-01 |
KR20040030979A (ko) | 2004-04-09 |
US7135224B2 (en) | 2006-11-14 |
DE60224543T2 (de) | 2009-01-29 |
CN1545729A (zh) | 2004-11-10 |
MY134364A (en) | 2007-12-31 |
EP1419527B1 (de) | 2008-01-09 |
US20040232563A1 (en) | 2004-11-25 |
CN1322580C (zh) | 2007-06-20 |
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