DE602005017741D1 - Halbleiter-Kühleinrichtung und Halbleiter-Kühleinrichtungsstapel - Google Patents

Halbleiter-Kühleinrichtung und Halbleiter-Kühleinrichtungsstapel

Info

Publication number
DE602005017741D1
DE602005017741D1 DE200560017741 DE602005017741T DE602005017741D1 DE 602005017741 D1 DE602005017741 D1 DE 602005017741D1 DE 200560017741 DE200560017741 DE 200560017741 DE 602005017741 T DE602005017741 T DE 602005017741T DE 602005017741 D1 DE602005017741 D1 DE 602005017741D1
Authority
DE
Germany
Prior art keywords
semiconductor cooler
stack
semiconductor
cooler
cooler stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560017741
Other languages
English (en)
Inventor
Hokichi Yoshioka
Takayuki Yamaoka
Satoshi Senoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tecnisco Ltd
Original Assignee
Tecnisco Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecnisco Ltd filed Critical Tecnisco Ltd
Publication of DE602005017741D1 publication Critical patent/DE602005017741D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE200560017741 2005-03-30 2005-03-30 Halbleiter-Kühleinrichtung und Halbleiter-Kühleinrichtungsstapel Active DE602005017741D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20050006883 EP1708322B1 (de) 2005-03-30 2005-03-30 Halbleiter-Kühleinrichtung und Halbleiter-Kühleinrichtungsstapel

Publications (1)

Publication Number Publication Date
DE602005017741D1 true DE602005017741D1 (de) 2009-12-31

Family

ID=34934579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560017741 Active DE602005017741D1 (de) 2005-03-30 2005-03-30 Halbleiter-Kühleinrichtung und Halbleiter-Kühleinrichtungsstapel

Country Status (2)

Country Link
EP (1) EP1708322B1 (de)
DE (1) DE602005017741D1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608924B2 (en) 2007-05-03 2009-10-27 Delphi Technologies, Inc. Liquid cooled power electronic circuit comprising stacked direct die cooled packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353053B2 (ja) * 1997-09-18 2002-12-03 ファナック株式会社 半導体用冷却部品の製造方法及び半導体レーザ用冷却部品の製造方法
ATE330330T1 (de) * 1998-08-18 2006-07-15 Hamamatsu Photonics Kk Kühlkörper, halbleiterlaser und halbleiterlaserstapel mit diesem kühlkörper
DE60045389D1 (de) * 2000-10-20 2011-01-27 Mitsubishi Electric Corp Kühlvorrichtung, halbleiterlaser-lichtquellenvorrichtung und halbleiterlaser-lichtquelleneinheit
JP2004186527A (ja) * 2002-12-05 2004-07-02 Tecnisco Ltd レーザーダイオード冷却装置
JP4014549B2 (ja) 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法

Also Published As

Publication number Publication date
EP1708322A1 (de) 2006-10-04
EP1708322B1 (de) 2009-11-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition