DE602006019670D1 - Halbleitervorrichtung und deren Herstellung - Google Patents
Halbleitervorrichtung und deren HerstellungInfo
- Publication number
- DE602006019670D1 DE602006019670D1 DE602006019670T DE602006019670T DE602006019670D1 DE 602006019670 D1 DE602006019670 D1 DE 602006019670D1 DE 602006019670 T DE602006019670 T DE 602006019670T DE 602006019670 T DE602006019670 T DE 602006019670T DE 602006019670 D1 DE602006019670 D1 DE 602006019670D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005218224A JP4506605B2 (ja) | 2005-07-28 | 2005-07-28 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006019670D1 true DE602006019670D1 (de) | 2011-03-03 |
Family
ID=36940212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006019670T Active DE602006019670D1 (de) | 2005-07-28 | 2006-06-28 | Halbleitervorrichtung und deren Herstellung |
Country Status (7)
Country | Link |
---|---|
US (2) | US7718465B2 (de) |
EP (1) | EP1748502B1 (de) |
JP (1) | JP4506605B2 (de) |
KR (1) | KR20070014971A (de) |
CN (2) | CN101577312B (de) |
DE (1) | DE602006019670D1 (de) |
TW (1) | TW200707744A (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7888671B2 (en) | 2006-12-18 | 2011-02-15 | Panasonic Corporation | Semiconductor device |
JP2008251888A (ja) * | 2007-03-30 | 2008-10-16 | Sony Corp | パターン形成方法および電子素子の製造方法 |
US8057656B2 (en) * | 2008-01-30 | 2011-11-15 | Hewlett-Packard Development Company, Lp | Crossover |
JP5459570B2 (ja) * | 2008-02-05 | 2014-04-02 | セイコーエプソン株式会社 | 半導体装置の製造方法、電気光学装置の製造方法、および電子機器の製造方法 |
JP4434312B2 (ja) * | 2008-02-12 | 2010-03-17 | コニカミノルタホールディングス株式会社 | 有機半導体層の成膜方法、および有機薄膜トランジスタの製造方法 |
WO2010061035A1 (en) * | 2008-11-27 | 2010-06-03 | Upm-Kymmene Corporation | Embossing of electronic thin-film components |
JP5739257B2 (ja) * | 2010-08-05 | 2015-06-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US20140087090A1 (en) * | 2011-05-20 | 2014-03-27 | Takashi Miyagawa | Method for manufacturing pattern structure |
CN106876277B (zh) * | 2017-02-20 | 2020-03-17 | 武汉华星光电技术有限公司 | 薄膜晶体管的制备方法、显示面板的制备方法 |
CN109860207B (zh) * | 2019-02-27 | 2022-07-19 | 合肥鑫晟光电科技有限公司 | 一种阵列基板、其制作方法、显示面板及显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6517995B1 (en) * | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
GB0024294D0 (en) * | 2000-10-04 | 2000-11-15 | Univ Cambridge Tech | Solid state embossing of polymer devices |
GB0207134D0 (en) * | 2002-03-27 | 2002-05-08 | Cambridge Display Tech Ltd | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
US6946677B2 (en) * | 2002-06-14 | 2005-09-20 | Nokia Corporation | Pre-patterned substrate for organic thin film transistor structures and circuits and related method for making same |
JP4314557B2 (ja) * | 2002-09-12 | 2009-08-19 | セイコーエプソン株式会社 | 成膜方法、光学素子、半導体素子および電子機器、電気光学装置の製造方法、カラーフィルターの製造方法 |
JP4356309B2 (ja) * | 2002-12-03 | 2009-11-04 | セイコーエプソン株式会社 | トランジスタ、集積回路、電気光学装置、電子機器 |
GB0229191D0 (en) * | 2002-12-14 | 2003-01-22 | Plastic Logic Ltd | Embossing of polymer devices |
JP2004241397A (ja) * | 2003-01-23 | 2004-08-26 | Dainippon Printing Co Ltd | 薄膜トランジスタおよびその製造方法 |
FI20030919A (fi) * | 2003-06-19 | 2004-12-20 | Avantone Oy | Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti |
GB0324189D0 (en) * | 2003-10-16 | 2003-11-19 | Univ Cambridge Tech | Short-channel transistors |
-
2005
- 2005-07-28 JP JP2005218224A patent/JP4506605B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-28 EP EP06013356A patent/EP1748502B1/de not_active Expired - Fee Related
- 2006-06-28 DE DE602006019670T patent/DE602006019670D1/de active Active
- 2006-06-30 TW TW095123978A patent/TW200707744A/zh not_active IP Right Cessation
- 2006-07-07 KR KR1020060063755A patent/KR20070014971A/ko active IP Right Grant
- 2006-07-19 US US11/458,573 patent/US7718465B2/en not_active Expired - Fee Related
- 2006-07-28 CN CN2009101496338A patent/CN101577312B/zh not_active Expired - Fee Related
- 2006-07-28 CN CNA2006101100197A patent/CN1905131A/zh active Pending
-
2009
- 2009-02-17 US US12/372,452 patent/US20090152540A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2007035981A (ja) | 2007-02-08 |
US20090152540A1 (en) | 2009-06-18 |
US7718465B2 (en) | 2010-05-18 |
TW200707744A (en) | 2007-02-16 |
CN101577312B (zh) | 2011-09-28 |
JP4506605B2 (ja) | 2010-07-21 |
TWI364841B (de) | 2012-05-21 |
KR20070014971A (ko) | 2007-02-01 |
US20070026554A1 (en) | 2007-02-01 |
EP1748502B1 (de) | 2011-01-19 |
CN1905131A (zh) | 2007-01-31 |
EP1748502A1 (de) | 2007-01-31 |
CN101577312A (zh) | 2009-11-11 |
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