DE602005008289D1 - Plasmadetektor und Laservorrichtung mit dem Plasmadetektor - Google Patents
Plasmadetektor und Laservorrichtung mit dem PlasmadetektorInfo
- Publication number
- DE602005008289D1 DE602005008289D1 DE602005008289T DE602005008289T DE602005008289D1 DE 602005008289 D1 DE602005008289 D1 DE 602005008289D1 DE 602005008289 T DE602005008289 T DE 602005008289T DE 602005008289 T DE602005008289 T DE 602005008289T DE 602005008289 D1 DE602005008289 D1 DE 602005008289D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma detector
- laser device
- plasma
- detector
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004029509A JP4646525B2 (ja) | 2004-02-05 | 2004-02-05 | プラズマ検出装置、及びプラズマ検出装置付きレーザ加工機 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005008289D1 true DE602005008289D1 (de) | 2008-09-04 |
Family
ID=34675532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005008289T Expired - Fee Related DE602005008289D1 (de) | 2004-02-05 | 2005-02-04 | Plasmadetektor und Laservorrichtung mit dem Plasmadetektor |
Country Status (5)
Country | Link |
---|---|
US (1) | US7411152B2 (de) |
EP (1) | EP1561537B1 (de) |
JP (1) | JP4646525B2 (de) |
CN (1) | CN100337780C (de) |
DE (1) | DE602005008289D1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4828316B2 (ja) * | 2006-06-13 | 2011-11-30 | 三菱電機株式会社 | レーザ加工機用のギャップ検出装置及びレーザ加工システム並びにレーザ加工機用のギャップ検出方法 |
US7722778B2 (en) * | 2006-06-28 | 2010-05-25 | Lam Research Corporation | Methods and apparatus for sensing unconfinement in a plasma processing chamber |
JP4271696B2 (ja) * | 2006-08-29 | 2009-06-03 | ヤマザキマザック株式会社 | レーザ加工機の自動工具交換装置 |
US8373425B2 (en) * | 2007-04-06 | 2013-02-12 | Hypertherm, Inc. | Plasma insensitive height sensing |
US8244494B2 (en) * | 2007-04-06 | 2012-08-14 | Hypertherm, Inc. | Plasma insensitive height sensing |
US8546724B2 (en) * | 2010-01-26 | 2013-10-01 | King Fahd University Of Petroleum & Minerals | Apparatus and method for controlling laser cutting through surface plasma monitoring |
WO2012155174A1 (en) * | 2011-05-13 | 2012-11-22 | Dbd Innovations Pty Ltd | Method of analyzing a material |
JP5676405B2 (ja) * | 2011-09-27 | 2015-02-25 | 富士フイルム株式会社 | 放射線画像撮影装置、放射線画像撮影システム、プログラムおよび放射線画像撮影方法 |
JP5964604B2 (ja) * | 2012-02-09 | 2016-08-03 | 株式会社ディスコ | レーザー加工装置 |
JP6034030B2 (ja) * | 2012-03-09 | 2016-11-30 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
JP5902540B2 (ja) * | 2012-04-02 | 2016-04-13 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
DE102014217154B4 (de) * | 2014-08-28 | 2016-09-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zum Einstechen in metallische Werkstücke mittels eines Laserstrahls sowie zugehörige Laserbearbeitungsmaschine und Computerprogrammprodukt |
JP6339603B2 (ja) * | 2016-01-28 | 2018-06-06 | ファナック株式会社 | レーザ加工開始条件を学習する機械学習装置、レーザ装置および機械学習方法 |
US10300551B2 (en) * | 2016-11-14 | 2019-05-28 | Matthew Fagan | Metal analyzing plasma CNC cutting machine and associated methods |
US10195683B2 (en) * | 2016-11-14 | 2019-02-05 | Matthew Fagan | Metal analyzing plasma CNC cutting machine and associated methods |
WO2019220611A1 (ja) * | 2018-05-18 | 2019-11-21 | 株式会社Fuji | 加工時間割り当てシミュレート方法とシミュレート装置 |
JP6810110B2 (ja) * | 2018-08-24 | 2021-01-06 | ファナック株式会社 | 加工条件調整装置及び機械学習装置 |
JP6740299B2 (ja) | 2018-08-24 | 2020-08-12 | ファナック株式会社 | 加工条件調整装置及び機械学習装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55117586A (en) * | 1979-03-05 | 1980-09-09 | Hitachi Ltd | Laser working machine |
US4447151A (en) * | 1981-06-18 | 1984-05-08 | The United States Of America As Represented By The Department Of Energy | Method and apparatus for fast laser pulse detection using gaseous plasmas |
US5013886A (en) * | 1990-07-23 | 1991-05-07 | General Electric Company | Real-time magnetic-flux breakthrough detection method and system for laser drilling |
GB2246733A (en) * | 1990-08-09 | 1992-02-12 | Cmb Foodcan Plc | Apparatus and method for monitoring laser material processing |
US5059761A (en) * | 1990-12-21 | 1991-10-22 | General Electric Company | Inductive depth sensing and controlling method and system for laser drilling |
CN1027579C (zh) * | 1991-11-20 | 1995-02-08 | 华中理工大学 | 连续激光焊接过程中焊接质量的实时监测方法 |
JP3187147B2 (ja) * | 1992-06-26 | 2001-07-11 | 東洋電子株式会社 | レーザー加工装置 |
JPH06312283A (ja) * | 1993-04-28 | 1994-11-08 | Toyo Denshi Kk | レーザー加工装置 |
JP3356043B2 (ja) * | 1997-12-26 | 2002-12-09 | 三菱電機株式会社 | レーザ加工装置用距離検出器 |
JP2000084683A (ja) * | 1998-09-08 | 2000-03-28 | Laser Oyo Kogaku Kenkyusho:Kk | レーザー溶接時の異常モニタリング方法及び装置 |
EP1238749B1 (de) | 2001-03-08 | 2005-12-07 | Trumpf Werkzeugmaschinen GmbH + Co. KG | Verfahren und Vorrichtung zum Brennschneiden von Werkstücken |
DE10196266T1 (de) * | 2001-05-23 | 2003-08-07 | Mitsubishi Electric Corp | Laserbearbeitungsvorrichtung |
JP2004243408A (ja) * | 2003-02-17 | 2004-09-02 | Yamazaki Mazak Corp | レーザ加工機 |
-
2004
- 2004-02-05 JP JP2004029509A patent/JP4646525B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-31 US US11/047,393 patent/US7411152B2/en active Active
- 2005-02-04 EP EP05100788A patent/EP1561537B1/de not_active Expired - Fee Related
- 2005-02-04 DE DE602005008289T patent/DE602005008289D1/de not_active Expired - Fee Related
- 2005-02-05 CN CNB2005100075691A patent/CN100337780C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1651176A (zh) | 2005-08-10 |
JP4646525B2 (ja) | 2011-03-09 |
EP1561537A1 (de) | 2005-08-10 |
US7411152B2 (en) | 2008-08-12 |
JP2005219093A (ja) | 2005-08-18 |
EP1561537B1 (de) | 2008-07-23 |
CN100337780C (zh) | 2007-09-19 |
US20050178749A1 (en) | 2005-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |