DE10196266T1 - Laserbearbeitungsvorrichtung - Google Patents

Laserbearbeitungsvorrichtung

Info

Publication number
DE10196266T1
DE10196266T1 DE10196266T DE10196266T DE10196266T1 DE 10196266 T1 DE10196266 T1 DE 10196266T1 DE 10196266 T DE10196266 T DE 10196266T DE 10196266 T DE10196266 T DE 10196266T DE 10196266 T1 DE10196266 T1 DE 10196266T1
Authority
DE
Germany
Prior art keywords
processing device
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10196266T
Other languages
English (en)
Inventor
Yoshihide Kinbara
Kazuo Sakurai
Yoshihiro Ikai
Takaaki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE10196266T1 publication Critical patent/DE10196266T1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
DE10196266T 2001-05-23 2001-05-23 Laserbearbeitungsvorrichtung Ceased DE10196266T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/004321 WO2002094498A1 (fr) 2001-05-23 2001-05-23 Appareil d'usinage au laser

Publications (1)

Publication Number Publication Date
DE10196266T1 true DE10196266T1 (de) 2003-08-07

Family

ID=11737340

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196266T Ceased DE10196266T1 (de) 2001-05-23 2001-05-23 Laserbearbeitungsvorrichtung

Country Status (6)

Country Link
US (1) US20030102294A1 (de)
JP (1) JP4729245B2 (de)
KR (1) KR20030014755A (de)
CN (1) CN1440320A (de)
DE (1) DE10196266T1 (de)
WO (1) WO2002094498A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004042135A1 (de) * 2004-08-30 2006-03-02 Iht Automation Gmbh & Co. Kg Verfahren zur Einstellung mindestens eines vorgegebenen Abstands zwischen einem Bearbeitungswerkzeug und einem metallischen Werkstück

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6874510B2 (en) * 2003-02-07 2005-04-05 Lsi Logic Corporation Method to use a laser to perform the edge clean operation on a semiconductor wafer
JP2005129851A (ja) * 2003-10-27 2005-05-19 Disco Abrasive Syst Ltd レーザ光線を利用した加工方法
JP4646525B2 (ja) * 2004-02-05 2011-03-09 ヤマザキマザック株式会社 プラズマ検出装置、及びプラズマ検出装置付きレーザ加工機
US7146237B2 (en) * 2004-04-07 2006-12-05 Mks Instruments, Inc. Controller and method to mediate data collection from smart sensors for fab applications
US7718921B2 (en) * 2004-11-17 2010-05-18 Metal Improvement Company Llc Active beam delivery system with variable optical path segment through air
US20060213615A1 (en) * 2004-12-16 2006-09-28 Sematech, Inc. Laser nozzle cleaning tool
US7629556B2 (en) * 2005-12-16 2009-12-08 Sematech, Inc. Laser nozzle methods and apparatus for surface cleaning
JP4828316B2 (ja) * 2006-06-13 2011-11-30 三菱電機株式会社 レーザ加工機用のギャップ検出装置及びレーザ加工システム並びにレーザ加工機用のギャップ検出方法
DE102007063627B4 (de) * 2007-10-02 2010-08-12 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Bestimmung der Lage eines Laserstrahls relativ zu einer Öffnung, sowie Laserbearbeitungsmaschine
DE102008030783B3 (de) * 2008-06-28 2009-08-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Laserstrahlschrägschneiden und Laserbearbeitungsmaschine
FR2936177B1 (fr) * 2008-09-24 2011-08-26 Air Liquide Procede de soudage laser de type co2 avec buse a jet dynamique.
WO2011037981A2 (en) * 2009-09-22 2011-03-31 Laser Mechanisms, Inc. Fast response capacitive gauging system featuring steep slope filter discrimination circuit
US9267975B2 (en) 2009-09-22 2016-02-23 Laser Mechanisms, Inc. Fast response capacitive gauging system featuring steep slope filter discrimination circuit
DE102010011643B4 (de) * 2010-03-16 2024-05-29 Christian Buske Vorrichtung und Verfahren zur Plasmabehandlung von lebendem Gewebe
US10307864B2 (en) * 2013-12-13 2019-06-04 Avonisys Ag Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing
CN104096979B (zh) * 2014-06-20 2016-01-20 西安交通大学 一种基于静电场辅助的激光加工工艺及其加工装置
US10702951B2 (en) * 2015-07-03 2020-07-07 Murata Machinery, Ltd. Laser machine, laser machining method, planar-member machining system, and planar-member machining method
CN105149796A (zh) * 2015-10-19 2015-12-16 无锡清杨机械制造有限公司 激光切割工艺
WO2017178580A1 (de) * 2016-04-14 2017-10-19 Plasmatreat Gmbh Vorrichtung zur bearbeitung einer oberfläche eines werkstücks mit einem laserstrahl und verfahren zum betrieb der vorrichtung
KR20180072124A (ko) 2016-12-21 2018-06-29 곽현만 레이저 가공장치의 압전용량센서
JP6740299B2 (ja) * 2018-08-24 2020-08-12 ファナック株式会社 加工条件調整装置及び機械学習装置
JP6810110B2 (ja) 2018-08-24 2021-01-06 ファナック株式会社 加工条件調整装置及び機械学習装置
CN111203653A (zh) * 2018-11-16 2020-05-29 中达电子零组件(吴江)有限公司 用于调节激光切割头位置的自适应控制装置及其控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3510665A (en) * 1967-07-12 1970-05-05 Reynolds Metals Co Apparatus for plasma measurement
JPH03165989A (ja) * 1989-11-22 1991-07-17 Nippei Toyama Corp レーザ加工装置
JPH04356391A (ja) * 1991-05-14 1992-12-10 Mitsubishi Electric Corp レーザ加工機の静電容量式ハイトセンサ
JPH0825069A (ja) * 1994-07-08 1996-01-30 Ngk Spark Plug Co Ltd レーザ溶接装置、溶接状態管理方法及びスパークプラグ用中心電極の製造方法
DE4442238C1 (de) * 1994-11-28 1996-04-04 Precitec Gmbh Verfahren zur thermischen Bearbeitung eines Werkstücks, insbesondere mittels Laserstrahlung
US5705785A (en) * 1994-12-30 1998-01-06 Plasma-Laser Technologies Ltd Combined laser and plasma arc welding torch
JPH10235483A (ja) * 1997-02-26 1998-09-08 Amada Co Ltd レーザ加工機の倣いセンサ
JP2001219288A (ja) * 2000-02-10 2001-08-14 Aida Eng Ltd レーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004042135A1 (de) * 2004-08-30 2006-03-02 Iht Automation Gmbh & Co. Kg Verfahren zur Einstellung mindestens eines vorgegebenen Abstands zwischen einem Bearbeitungswerkzeug und einem metallischen Werkstück
US7756672B2 (en) 2004-08-30 2010-07-13 Iht Automation Gmbh & Co. Kg Method for setting a predetermined distance between a machine tool and an electrically conductive workpiece

Also Published As

Publication number Publication date
US20030102294A1 (en) 2003-06-05
KR20030014755A (ko) 2003-02-19
JP4729245B2 (ja) 2011-07-20
CN1440320A (zh) 2003-09-03
WO2002094498A1 (fr) 2002-11-28
JPWO2002094498A1 (ja) 2004-09-02

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